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IXGH25N100U1

型号:

IXGH25N100U1

描述:

高速IGBT与二极管[ High speed IGBT with Diode ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

6 页

PDF大小:

318 K

Preliminary data  
VCES  
IC25  
VCE(sat)  
Low VCE(sat)  
High speed IGBT  
withDiode  
1000 V 50 A 3.5 V  
1000 V 50 A 4.0 V  
IXGH25N100U1  
IXGH25N100AU1  
TO-247 AD (IXGH)  
Symbol  
TestConditions  
Maximum Ratings  
VCES  
VCGR  
TJ = 25°C to 150°C  
1000  
1000  
V
V
G
C
E
TJ = 25°C to 150°C; RGE = 1 MΩ  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G = Gate  
E = Emitter  
C = Collector  
TAB = Collector  
IC25  
IC90  
ICM  
TC = 25°C  
50  
25  
A
A
A
TC = 90°C  
TC = 25°C, 1 ms  
100  
SSOA  
VGE= 15 V, TVJ = 125°C, RG = 33 Ω  
ICM = 50  
A
Features  
(RBSOA)  
Clamped inductive load, L = 100 µH  
@ 0.8 VCES  
l International standard package  
JEDEC TO-247 AD  
l IGBT and anti-parallel FRED in one  
PC  
TC = 25°C  
200  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
package  
TJM  
Tstg  
l 2nd generation HDMOSTM process  
-55 ... +150  
l
l Low VCE(sat)  
- for minimum on-state conduction  
losses  
l MOS Gate turn-on  
Md  
Mounting torque (M3)  
1.13/10 Nm/lb.in.  
Weight  
TO-204 = 18 g, TO-247 = 6 g  
- drive simplicity  
l Fast Recovery Epitaxial Diode (FRED)  
- soft recovery with low IRM  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Applications  
l AC motor speed control  
l DC servo and robot drives  
l DC choppers  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
l Uninterruptible power supplies (UPS)  
l Switch-mode and resonant-mode  
power supplies  
BVCES  
VGE(th)  
IC = 4.5 mA, VGE = 0 V  
1000  
2.5  
V
IC = 500 µA, VCE = VGE  
5.5  
V
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
500  
8
µA  
mA  
Advantages  
l Saves space (two devices in one  
package)  
l Easy to mount (isolated mounting  
IGES  
VCE = 0 V, VGE = ±20 V  
±100  
nA  
VCE(sat)  
IC = IC90, VGE = 15 V  
25N100U1  
25N100AU1  
3.5  
4.0  
V
V
screw hole)  
l Reduces assembly time and cost  
l
© 1996 IXYS All rights reserved  
95587(9/96)  
IXGH25N100U1 IXGH25N100AU1  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
TO-247 AD Outline  
min. typ.  
max.  
IC = IC90; VCE = 10 V,  
8
15  
S
Pulse test, t 300 µs, duty cycle 2 %  
Cies  
Coes  
Cres  
2750  
270  
50  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
Qg  
130  
25  
180 nC  
60 nC  
90 nC  
Qge  
Qgc  
IC = IC90, VGE = 15 V, VCE = 0.5 VCES  
55  
1 = Gate  
2 = Collector  
3 = Emitter  
Inductive load, TJ = 25°C  
IC = IC90, VGE = 15 V, L = 300 µH,  
VCE = 0.8 VCES, RG = Roff = 33 Ω  
Remarks: Switching times  
td(on)  
tri  
td(off)  
tfi  
100  
200  
500  
500  
5
ns  
ns  
Tab = Collector  
ns  
25N100AU1  
ns  
may increase  
Eoff  
25N100AU1  
mJ  
for VCE (Clamp) > 0.8 • VCES  
,
higher TJ or increased RG  
td(on)  
tri  
100  
250  
3.5  
ns  
ns  
Inductive load, TJ = 125°C  
IC = IC90, VGE = 15 V, L = 300 µH  
CE = 0.8 VCES, RG = Roff = 33 Ω  
Eon  
td(off)  
tfi  
mJ  
V
720 1000 ns  
950 3000 ns  
Remarks: Switching times  
may increase  
25N100U1  
25N100AU1  
25N100U1  
25N100AU1  
for VCE (Clamp) > 0.8 • VCES  
higher TJ or increased RG  
,
800  
10  
6
ns  
mJ  
mJ  
Eoff  
RthJC  
RthCK  
0.62 K/W  
K/W  
0.25  
Reverse Diode (FRED)  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Symbol  
VF  
TestConditions  
IF = IC90, VGE = 0 V,  
min. typ. max.  
2.5  
18  
V
Pulse test, t 300 µs, duty cycle d 2 %  
IRM  
trr  
IF = IC90, VGE = 0 V, -diF/dt = 240 A/µs  
16  
TJ =125°C 120  
IF = 1 A; -di/dt = 100 A/µs; VR = 30 V TJ =25°C 35  
A
VR = 540 V  
ns  
50 ns  
RthJC  
1 K/W  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106  
4,850,072 4,931,844  
5,017,508  
5,034,796  
5,049,961 5,187,117 5,486,715  
5,063,307 5,237,481 5,381,025  
IXGH25N100U1 IXGH25N100AU1  
© 1996 IXYS All rights reserved  
IXGH25N100U1 IXGH25N100AU1  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106  
4,850,072 4,931,844  
5,017,508  
5,034,796  
5,049,961 5,187,117 5,486,715  
5,063,307 5,237,481 5,381,025  
IXGH25N100U1 IXGH25N100AU1  
Fig.11 Maximum Forward Voltage Drop  
Fig.12 Peak Forward Voltage VFR and  
Forward Recovery Time tFR  
100  
80  
60  
40  
20  
0
50  
40  
30  
20  
10  
0
1000  
800  
600  
400  
200  
0
TJ = 125°C  
IF =37A  
VFR  
TJ = 100°C  
t
TJ = 150°C  
fr  
TJ = 25°C  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
0
100  
200  
300  
400  
500  
600  
Voltage Drop - Volts  
diF /dt - A/µs  
Fig.13Junction Temperature Dependence  
off IRM and Qr  
Fig.14 Reverse Recovery Chargee  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
4
max.  
IF = 30A  
TJ = 100°C  
VR = 540V  
3
2
1
0
typ.  
IF = 60A  
IRM  
Qr  
IF = 30A  
IF = 15A  
0
40  
80  
120  
160  
1
10  
100  
diF /dt - A/µs  
1000  
TJ - Degrees C  
Fig.15 Peak Reverse Recovery Current  
Fig.16 Reverse Recovery Time  
50  
40  
30  
20  
10  
0
0.8  
0.6  
0.4  
0.2  
0.0  
max.  
IF = 30A  
TJ = 100°C  
max.  
TJ = 100°C  
VR = 540V  
IF = 30A  
VR = 540V  
typ.  
IF = 60A  
IF = 30A  
IF = 15A  
typ.  
IF = 60A  
IF = 30A  
IF = 15A  
200  
400  
600  
0
200  
400  
600  
diF /dt - A/µs  
diF /dt - A/µs  
© 1996 IXYS All rights reserved  
IXGH25N100U1 IXGH25N100AU1  
Fig.17 Diode Transient Thermal resistance junction to case  
1.00  
0.10  
0.01  
0.001  
0.01  
0.1  
1
Pulse Width - Seconds  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106  
4,850,072 4,931,844  
5,017,508  
5,034,796  
5,049,961 5,187,117 5,486,715  
5,063,307 5,237,481 5,381,025  
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