2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
Environmental Characteristics
Shock
500 G’s 1ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.
0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.
5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.
10 cycles, 95% RH, Per MIL-STD-202G, Method 112.
SinusoidalꢀVibration
RandomꢀVibration
Moisture
MarkingꢀPermanencyꢀ
Per MIL-STD-202G, Method 215J.
SolderꢀProcessꢀRecommendations: RoHS compliant, lead free. See solder profile on page 3.
In-lineꢀreflow:
Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material
consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free
high temperature eutectic alloy with a melting point of 221°C.|
We recommend using KIC profiler or similar device placing one of the thermocouples on the
device to insure that the internal package temperature does not exceed 221°C.
If for any reason the device needs to be removed from the board, use a temperature controlled
repair station with profile monitoring capabilities. Following a monitored profile will insure the
device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.
In-lineꢀovenꢀprofile:
Removalꢀofꢀdevice:
RecommendedꢀCleaningꢀProcess: (If required)
Device is non-hermetic, water resistance with four weep holes, one in each corner to allow
moisture to be removed during the drying cycle. We recommend in-line warm water wash
with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air
circulated oven. Boards should be placed in the oven vertically for good water runoff
Device must be dried properly prior to use!
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀNote:ꢀIfꢀsaponifierꢀisꢀusedꢀmakeꢀsureꢀtheꢀdeviceꢀisꢀrinsedꢀproperlyꢀtoꢀinsureꢀallꢀresiduesꢀareꢀremoved.ꢀPHꢀofꢀsaponifierꢀshouldꢀnotꢀꢀeꢁceedꢀ10.ꢀ
DryingꢀTemperature:
DryingꢀTime:
Between 85 to 100°C.
Time will vary depending on the board size.
Caution: Do not submerge the device!
Notes:
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1.ꢀInitialꢀcalibrationꢀ@ꢀ25°C.
2.ꢀFrequencyꢀstabilityꢀvs.ꢀchangeꢀinꢀtemperature.ꢀ[± ±Fmaꢁꢀ-ꢀFmin)/±2*Fo)].
3.ꢀAfterꢀ30ꢀdaysꢀofꢀoperation.
4.ꢀPeakꢀtoꢀpeakꢀfrequencyꢀstabilityꢀvs.ꢀchangeꢀinꢀtemperature,ꢀfrequencyꢀstabilityꢀvs.ꢀchangeꢀinꢀvoltage,ꢀfrequencyꢀstabilityꢀvs.ꢀchangeꢀinꢀloadꢀandꢀagingꢀ
ꢀ
overꢀaꢀ24ꢀhourꢀperiod.
5.ꢀ0.16ꢀsecondsꢀ<ꢀObservedꢀtimeꢀ<ꢀ64ꢀsecondsꢀatꢀaꢀconstantꢀtemperatureꢀwithꢀ1ꢀhourꢀwarm-up.
6.ꢀInclusiveꢀofꢀcalibrationꢀ@ꢀ25°C,ꢀfrequencyꢀvs.ꢀchangeꢀinꢀtemperature,ꢀchangeꢀinꢀsupplyꢀvoltageꢀ±± 5ꢂ),ꢀloadꢀchangeꢀ±± 10ꢂ),ꢀshockꢀandꢀvibrationꢀandꢀ
ꢀ
20ꢀyearsꢀaging
7.ꢀAttention:ꢀToꢀachieveꢀoptimalꢀfrequencyꢀstability,ꢀandꢀinꢀsomeꢀcasesꢀtoꢀmeetꢀtheꢀspecificationꢀstatedꢀonꢀthisꢀdataꢀsheet,ꢀitꢀisꢀrequiredꢀthatꢀtheꢀcircuitꢀ
ꢀ
ꢀ
connectedꢀtoꢀthisꢀOCXOꢀoutputꢀmustꢀhaveꢀtheꢀequivalentꢀinputꢀcapacitanceꢀthatꢀisꢀspecifiedꢀbyꢀtheꢀnominalꢀloadꢀcapacitance.ꢀDeviationsꢀfromꢀtheꢀ
nominalꢀloadꢀcapacitanceꢀwillꢀhaveꢀaꢀgraduatedꢀeffectꢀonꢀtheꢀstabilityꢀofꢀapproꢁimatelyꢀ20ꢀppbꢀperꢀpFꢀloadꢀdifference.
Ordering Information
ꢀꢀ**ꢀNotꢀallꢀoptionsꢀ
OX914
S3
0
-019.44M
ꢀ
ꢀ
availableꢀatꢀ
Digi-Key
OscillatorꢀType
TemperatureꢀRange
STRATUMꢀ3
OutputꢀFrequency
FrequencyꢀFormat
-xxx.xMꢀMin.*
OX914xxxꢀ-ꢀOCXO
9x14mmꢀPackage
0ꢀ=ꢀ0ꢀtoꢀ70°C
2ꢀ=ꢀ-20ꢀtoꢀ70°C
S3
-xxx.xxxxxxMꢀMax*
3ꢀ=ꢀ-40ꢀtoꢀ85°C
*Amountꢀofꢀnumbersꢀafterꢀtheꢀ
ꢀdecimalꢀpoint.ꢀMꢀ=ꢀMHz
ExampleꢀPartꢀNumber:
OX9140S3-019.44Mꢀ=ꢀOCXO,ꢀ9x14mmꢀpackage,ꢀ0ꢀtoꢀ70°C,ꢀSTRATUMꢀ3,ꢀ19.44ꢀMHz
Bulletin
Page
Cx181
2 of 4
Attention:ꢀSystemꢀDesignersꢀpleaseꢀreviewꢀApplicationꢀNoteꢀAN2093:ꢀ
SystemꢀDesignꢀInformationꢀandꢀPrintedꢀCircuitꢀBoardꢀLayoutꢀGuidelinesꢀforꢀOCXOꢀOscillators. ꢀ
@ꢀwww.conwin.com/technologies.html
Revision
Date
05
17 Sep 2013
Specificationsꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotification.ꢀSeeꢀConnor-Winfield'sꢀwebsiteꢀforꢀlatestꢀrevision.ꢀꢀAllꢀdimensionsꢀinꢀinches.ꢀꢀ
© Copyright 2014The Connor-Winfield CorporationꢀꢀꢀꢀNotꢀintendedꢀforꢀlifeꢀsupportꢀapplications.