COMCHIP
SSMMDD SSwwiittcchinngg Diode
SMD Diodes Specialist
CDSF4148-B03 (Lead-free Device)
High Speed
Features
Designed for mounting on small surface.
1005(2512)
Extremely thin/leadless package.
0.102(2.60)
0.095(2.40)
High mounting capability, strong surge
withstand, high reliability.
0.051(1.30)
0.043(1.10)
Mechanical data
Case: 1005 (2512) standard package,
molded plastic.
0.035(0.90)
0.027(0.70)
Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
0.020(0.50) Typ.
Polarity: Indicated by cathode band.
0.012 (0.30) Typ.
Mounting position: Any.
0.020(0.50) Typ.
Weight: 0.006 gram (approximately)
Dimensions in inches and (millimeter)
Maximum Rating ( at TA = 25 C unless otherwise noted )
Parameter
Repetitive peak reverse voltage
Reverse voltage
Symbol
Conditions
Typ Max Unit
Min
VRRM
100
75
V
VR
V
Average forward current
IO
150
mA
tp=1uS
tp=1mS
4
1
Forward current , surge peak
IFSM
A
Repetitive peak forward current
Power Dissipation
IFRM
300
350
mA
PD
mW
TSTG
+125
+125
-40
-40
Storage temperature
C
C
T j
Junction temperature
Electrical Characteristics ( at TA = 25 C unless otherwise noted )
Conditions
Symbol Min Typ Max
Parameter
Unit
I F = 50 mADC
VF
1.0
Forward voltage
V
VR = 20 V
VR = 75 V
25
Reverse current
nA
uA
IR
2.5
f = 1MHz, and 0 VDCreverse voltage
CT
4
4
Capacitance between terminals
Reverse recovery time
pF
IF = IR = 10 mA, RL =100 ohms, irr= 1mA
Trr
nS
REV:A
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