找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

LYH1056_13

型号:

LYH1056_13

品牌:

LUXPIA[ LUXPIA ]

页数:

16 页

PDF大小:

612 K

Specification for Approval  
(Ver 1.0)  
Part No : LYH1056  
comments  
LUXPIA Co., Ltd.  
Designed by Checked by Approved by  
Approved by Approved by Approved by  
/
/
/
/
/
/
Date :  
.
.
.
Date :  
.
.
.
LUXPIA CO.,LTD.  
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea Tel 82-70-8671-2500 Fax 82-70-8620-8081  
-
CONTENTS  
-
1. Features  
2. Package Outline Dimensions and Materials  
3. Absolute Maximum Ratings  
4. Electro-Optical Characteristics  
5. CIE Chromaticity Diagram  
6. Materials  
7. Taping  
8. Packing  
9. Reliability  
10. Cautions  
11. Warranty  
12. Characteristic Diagrams  
(Ver 1.0)  
1/15  
1. Features  
Package : SMD Top View type (3 Chips and 1 Zener in 1 PKG )  
5.4 × 5.0 × 1.6 mm3 (L×W×H) size surface mount type  
Viewing angle : extremely wide(120˚)  
Soldering methods : IR reflow soldering  
2. Package Outline Dimensions and Recommended Solder Patterns  
(
(Ver 1.0)  
2/15  
3. Absolute Maximum Ratings1)  
(Ta=25)  
item  
symbol  
value  
unit  
mA  
mA  
V
forward current  
IF  
IFP  
90  
300  
pulse forward current 2)  
reverse voltage  
VR  
5
power dissipation  
operating temperature  
storage temperature  
PD  
320  
mW  
Topr  
Tstg  
-30 to +85  
-40 to +100  
1) These values are based on 3-die performance  
2)  
I
FP  
conditions : pulse width 10msec & duty ratio 1/10  
4. Electro-Optical Characteristics  
(Ta=25)  
item  
rank  
V18  
V20  
V22  
V24  
symbol  
VF  
condition  
IF= 60mA  
min  
1.8  
2.0  
2.2  
2.4  
typ  
max  
unit  
-
-
-
-
2.0  
2.2  
2.4  
2.6  
forward  
voltage 2)  
V
Dominant  
-
λD  
IF= 60mA  
IF= 60mA  
585  
800  
-
-
595  
nm  
Wavelength3)  
2E80  
1000  
luminous  
intensity 4)  
IV  
mcd  
3E15  
3E20  
1000  
1500  
-
-
1500  
2000  
2) Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ±0.1V.  
3) Dominant wavelength are tested at a current pulse duration of 10 ms and an accuracy within ±2nm.  
4) The allowance of luminous intensity measurement is within ±10%.  
* To avoid optical difference, please do not mix differently ranked product.  
* All measurements were made under the standardized environment of LUXPIA.  
(Ver 1.0)  
3/15  
6. Materials  
item  
LED chip  
wire  
material  
AlGaInP  
gold  
lead frame  
encapsulation  
copper alloy/Ni/Ag plating  
silicone  
PPA  
heat-resistant polymer  
7. Taping  
7.1. Tape (material : PS conductive, 104~105)  
(units : mm)  
(Ver 1.0)  
4/15  
7.2. Wheel (color : black, material : PS conductive, 109~1012)  
(units : mm)  
- quantity per reel  
LYH1056 : 1,000pcs  
7.3. Label  
part no.  
size (L X W) : 85mm × 50mm  
LYH1056  
3E10 – V20  
1,000ea  
IV rank  
VF rank  
(Ver 1.0)  
5/15  
8. Packing  
• The LEDs are packed in cardboard boxes after taping. The label shows part number, lot number, rank,  
and quantity.  
• In order to protect the LEDs from mechanical shock, they are packed with cardboard boxes  
for transportation.  
• The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so cautions must be taken to prevent any possible damage.  
• The boxes are not water-resistant and, therefore, must be kept away from water and moisture.  
• When the LEDs are transported, it is recommended that the same packing method as Luxpia's is used.  
• If noticeable damage on a box appears upon arrival at the user’s warehouse, the user should submit a  
claim to Luxpia within one week after arrival of the products.  
(Ver 1.0)  
6/15  
9. Reliability  
9.1. Test Items And Results  
Standard Test  
Method  
Number of  
Damaged  
NO  
1.  
Test Item  
Test Conditions  
Note  
Resistance to  
Soldering Heat  
Tsld=260°c, 10sec.  
(Pre treatment  
JEITA ED-4701  
300 301  
1 times  
0/22  
(Reflow Soldering)  
Solderability  
30°c,70%,12hrs)  
Tsld=215±5°c, 3sec  
(Lead Solder)  
JEITA ED-4701 300  
1 time  
2
3
4
5
6
0/22  
0/22  
0/22  
0/22  
0/22  
(Reflow Soldering)  
303  
JEITA ED-4701 100  
105  
over 95%  
-40~25~100℃  
30min. 5min. 30min  
Temperature Cycle  
100 cycles  
1000 hrs  
1000 hrs  
1000 hrs  
High Temperature  
Storage  
JEITA ED-4701 200  
201  
Ta=100℃  
Ta=60, RH=90%  
Ta=-40℃  
Temperature Humidity JEITA ED-4701 100  
Storage  
Low Temperature  
Storage  
103  
JEITA ED-4701 200  
202  
Steady State  
Internal  
Ta=25, IF=60mA  
Ta=85, IF=15mA  
7
8
Operating Life  
Condition  
1000 hrs  
1000 hrs  
500 hrs  
0/22  
0/22  
0/22  
0/22  
Reference  
Steady State  
Internal  
Operating Life of High  
Temperature  
Reference  
Steady State  
60, RH=90%,  
Internal  
9
Operating Life of High  
Humidity Heat  
Steady State  
Reference  
IF=30mA  
Internal  
Ta=-30, IF=60mA  
10  
Operating Life of Low  
Temperature  
1000 hrs  
Reference  
* LED with Luxpia standard circuit board  
9.2. Criteria For Judging The Damage  
Criteria For Judgement  
Min. Max.  
Item  
Symbol  
Test Condition  
Forward Voltage  
VF  
IV  
IF = 60mA  
IF = 60mA  
-
U.S.L.6) × 1.1  
Luminous Intensity  
L.S.L.7) × 0.7  
-
6) U.S.L. : Upper Standard Level  
7) L.S.L. : Lower Standard Level  
(Ver 1.0)  
7/15  
10. Cautions  
The LEDs are device which are materialized by combining Blue LEDs and special phosphors. Consequently,  
the color of White LEDs is subject to change a little by an operating current.  
Care should be taken after due consideration when using LEDs.  
(1) Moisture-Proof Package  
• When moisture is absorbed into the SMT package it may vaporize and expand products during soldering.  
There is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics  
of the LEDs. For this reason, the moisture-proof package is used to keep moisture to a minimum in the  
package.  
• A package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. The silica gel  
changes its color from blue to pink as it absorbs moisture.  
(2) Storage  
• Storage Conditions  
- Before opening the package :  
The LEDs should be kept at 5~30or less and 65%RH or less. The LEDs should be used within a year.  
When storing the LEDs, moisture-proof packaging with moisture-absorbent material (silica gel) is  
recommended.  
- After opening the package :  
The LEDs should be kept at 5~40or less and 30%RH or less. The LEDs should be soldered within 168  
hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture-proof  
packages, such as sealed containers with packages of moisture-absorbent material (silica gel). It is also  
recommended to return the LEDs to the original moisture-proof bag and to reseal the moisture-proof bag  
again.  
• If the moisture-absorbent material (silica gel) has faded away or the LEDs have exceeded the recommended  
storage time, baking treatment should be performed using the following conditions.  
- Baking treatment : more than 48 hours at 45±5(Reel condition)  
more than 24 hours at 125±5(Each piece condition)  
• After assembly and during use, silver plating can be affected by the corrosive gases emitted by components  
and materials in close proximity of the LEDs within an end product, and the gases entering into the product  
from the external atmosphere. The above should be taken into consideration when designing.  
• Please avoid rapid transitions in ambient temperature, especially in high humidity environments where  
condensation can occur.  
(3) Heat Generation  
• Thermal design of the end product is of paramount importance. Please consider the heat generation of the  
LED when the system is designed. The coefficient of temperature increase per input electric power is  
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as  
other components. It is necessary to avoid intense heat generation and operate within the maximum ratings  
given in the specification.  
• The operating current should be decided after considering the ambient maximum temperature of LEDs.  
(Ver 1.0)  
8/15  
(4) Recommended circuit  
• In designing a circuit, the current though each LED must not exceed its absolute maximum rating. It is  
recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when  
driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation  
in forward (VF) of the LEDs. In worst case, some LED may be subjected to stresses in excess of the absolute  
maximum rating.  
• This product should be operated in forward bias. Driving circuit must be designed so that the product is not  
subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously  
applied to the product, such operation can cause migration resulting in LED damage.  
• Please determine the operating current with consideration of the ambient temperature local to the LED and  
refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this  
specifications. Please also take measures to remove heat from the area near the LED to improve the  
operational characteristics of the LED.  
(5) Handling Precautions  
• Bare Hand  
When handling the product, touching encapsulant with bare hands will contaminate its surface that could  
affects optical characteristics. In the worst cases, excessive force the encapsulant by hands might result in  
catastrophic failure of the LEDs due to wire deformation and/or breakage.  
Tweezers  
Since silicone used as encapsulating resin in this product is a soft material, the upper surface of the product  
is soft. Pressuring onto the product might cause catastrophic failure of the LEDs due to damage to  
encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and  
LED detachment.  
(Ver 1.0)  
9/15  
• Pick and Place  
Recommended conditions: Outer nozzleΦ4.4mm  
Avoid direct contact to the encapsulant with the picking nozzle.  
Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the  
LEDs due to wire deformation and/or breakage.  
• Drop  
Please note that a package damage such as crack might occur when having dropped the product.  
(Ver 1.0)  
10/15  
• Printed Circuit Board Assembled (PCB with LEDs soldered)  
Do not stack assembled PCBs together. Since silicone is a soft material abrasion between two PCB assembled  
with encapsulate LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as  
scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment.  
(6) Soldering Conditions  
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
• Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
Hand Soldering  
Lead-free Solder  
180~200℃  
Pre-Heat  
120~150℃  
350Max.  
Pre-Heat Time  
Peak Temperature  
Temperature  
120sec Max.  
240Max.  
120sec Max.  
260Max.  
3sec Max.  
Soldering Time  
(one time only)  
Soldering Time  
Condition  
10sec Max.  
10sec Max.  
refer to profile ①  
refer to profile ②  
* Although the recommended soldering conditions are specified in the above table, reflow soldering at the  
lowest possible temperature is desirable for the LEDs.  
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
[Temperature-Profile (surface of circuit board)]  
Use the conditions shown to the following figures.  
<: Lead Solder>  
<: Lead-free Solder>  
(Ver 1.0)  
11/15  
• Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during  
air reflow. It is recommended that the User use the nitrogen reflow method.  
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-  
head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the  
LEDs will or will not be damaged by repairing.  
• Reflow soldering should not be done more than two times.  
• When soldering, do not put stress on the LEDs during heating.  
• After soldering, do not warp the circuit board.  
(7) Cleaning  
• It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other  
solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or  
not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean  
the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs  
depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should  
be done to confirm whether any damage to the LEDs will occur.  
(8) Static Electricity  
• Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-  
electrostatic glove be used when handling the LEDs.  
• All devices, equipment and machinery must be properly grounded. It is recommended that measurements  
be taken against surge voltage to the equipment that mounts the LEDs.  
• When inspecting the final products in which LEDs were assembled, it is recommended to check whether the  
assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on  
test or a VF test at a lower current (below 1mA is recommended).  
• Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the  
forward voltage becomes lower, or the LEDs do not light at the low current.  
- criteria : VF > 2.0V at IF=0.5㎃  
(9) Others  
• This LED complies with RoHS Directive.  
• The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking  
directly at the LEDs with unaided eyes for more than a few seconds.  
• Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions  
during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it.  
• The customer not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia directly before  
disassembling or analysis.  
• The warranties of quality set forth herein are exclusive. All previous negotiations and agreements not  
specifically incorporated herein are superseded and rendered null and void.  
• Both parties shall sincerely try to find a solution when any disagreement occurs regarding these  
specifications.  
• These specifications can be revised upon mutual agreement.  
• Luxpia understands that the User accepts the content of these specifications, if the User does not return  
these specifications with signatures within 3 weeks after receipt.  
• The LEDs described in the specification are intended to be used for ordinary electronic equipment (such as  
office equipment, communications equipment, on the applications in which exceptional quality and reliability  
are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health  
(such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic  
control equipment, life support systems and safety devices)  
(Ver 1.0)  
12/15  
11. Warranty  
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will convey good title  
to all LEDs sold.  
(2) LUXPIA disclaims all other warranties including the implied warranties of merchantability and fitness for a  
particular purpose.  
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specifications within  
ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s discretion, provided that the User (a)  
promptly notifies Luxpia in writing of the details of the defect (b) ships the LEDs at the User’s expense to  
Luxpia for examination, and (c) the defect is due to the negligence of Luxpia and not mishandling or misuse  
by the User.  
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions exceeding  
our specifications.  
(5) These specifications are applied only when a LED stands alone and it is strongly recommended that the  
User of the LEDs confirms the properties upon assembly. Luxpia is not responsible for failures caused during  
and after assembling. It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.  
(6) A claim report stating details about the defect shall be made when returning defective LEDs. Luxpia will  
investigate the report immediately and inform the user of the results.  
(7) LUXPIA’s liability for defective lamps shall be limited to replacement and in no event shall LUXPIA be liable  
for consequential damage or lost profits.  
(Ver 1.0)  
13/15  
12. Characteristic Diagrams  
(1) forward voltage vs. forward current  
(2) forward current vs. relative luminosity  
(Ta=25)  
(Ta=25)  
3.0  
180  
150  
120  
2.5  
2.0  
1.5  
90  
60  
30  
1.0  
0.5  
0
1
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
30  
60  
90  
120  
150  
forward voltage VF[V]  
forward current IF[mA]  
(3) ambient temperature vs. allowable  
forward current  
(4) ambient temperature vs. relative luminosity  
(IF=60)  
120  
10  
100  
80  
60  
1
40  
20  
0.1  
-40  
-20  
0
20  
40  
60  
80  
100  
20  
-20  
0
40  
60  
80  
100  
ambient temperature Ta[]  
ambient temperature Ta[]  
(Ver 1.0)  
14/15  
(5) relative spectral emission  
V(λ) = standard eye response curve  
(Ta=25, IF=60mA)  
1 .2  
1 .0  
0 .8  
0 .6  
0 .4  
0 .2  
0
4 5 0  
3 5 0  
5 5 0  
6 5 0  
7 5 0  
(Ta=25, IF=60mA)  
(6) radiation characteristics  
(Ver 1.0)  
15/15  
厂商 型号 描述 页数 下载

LUXPIA

LYH1035 [ Specification for Approval ] 16 页

LUXPIA

LYH1035_13 [ Specification for Approval ] 16 页

LUXPIA

LYH1056 [ Specification for Approval ] 16 页

INFINEON

LYH380-EH 符号LED 5毫米T1 3/4 LED ,天色扩散[ Symbol LED 5 mm T1 3/4 LED, Partly Diffused ] 8 页

INFINEON

LYH380-F 圆筒形的LED灯[ CYLINDRICAL LED LAMP ] 1 页

INFINEON

LYH380-G 符号LED 5毫米T1 3/4 LED ,天色扩散[ Symbol LED 5 mm T1 3/4 LED, Partly Diffused ] 8 页

INFINEON

LYH380-GK 符号LED 5毫米T1 3/4 LED ,天色扩散[ Symbol LED 5 mm T1 3/4 LED, Partly Diffused ] 8 页

INFINEON

LYH380-H 符号LED 5毫米T1 3/4 LED ,天色扩散[ Symbol LED 5 mm T1 3/4 LED, Partly Diffused ] 8 页

INFINEON

LYH380-J 符号LED 5毫米T1 3/4 LED ,天色扩散[ Symbol LED 5 mm T1 3/4 LED, Partly Diffused ] 8 页

INFINEON

LYH380F [ Visible LED, Diffused ] 1 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.189399s