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PX3519_15

型号:

PX3519_15

品牌:

INFINEON[ Infineon ]

页数:

21 页

PDF大小:

1497 K

Revision 2.3, 2015-10-21  
Edition 2015-10-21  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2015 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the  
failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life  
support devices or systems are intended to be implanted in the human body or to support and/or maintain and  
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other  
persons may be endangered.  
PX3519  
Revision History  
Page or Item  
Subjects (major changes since previous revision)  
Revision 2.0  
Revision 2.1  
2013-07-17 first issue  
2014-08-21 changes:  
Table 5 page 8: PHASE voltage, pulsed Minimum to -12V  
2014-09-19 changes:  
Revision 2.2  
Revision 2.3  
RPHASE added in the Simplified Block Diagram  
SOA diagram for RPHASE introduced  
2015-10-21 changes:  
Power up and power down sequence introduced  
Junction operating temperature from -25°C to -40°C table 1 and table 7  
Trademarks of Infineon Technologies AG  
AURIX, BlueMoon, COMNEON, C166, CROSSAVE, CanPAK, CIPOS, CoolMOS,  
CoolSET, CORECONTROL, DAVE, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPACK,  
EconoPIM, EiceDRIVER, EUPEC, FCOS, HITFET, HybridPACK, ISOFACE, I²RF,  
IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OmniTune, OptiMOS, ORIGA, PROFET,  
PRO-SIL, PRIMARION, PrimePACK, RASIC, ReverSave, SatRIC, SIEGET, SINDRION,  
SMARTi, SmartLEWIS, TEMPFET, thinQ!, TriCore, TRENCHSTOP, X-GOLD, XMM,  
X-PMU, XPOSYS.  
Other Trademarks  
Advance Design System(ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, PRIMECELL,  
REALVIEW, THUMBof ARM Limited, UK. AUTOSARis licensed by AUTOSAR development  
partnership. Bluetoothof Bluetooth SIG Inc. CAT-iqof DECT Forum. COLOSSUS, FirstGPSof Trimble  
Navigation Ltd. EMVof EMVCo, LLC (Visa Holdings Inc.). EPCOSof Epcos AG. FLEXGOof Microsoft  
Corporation. FlexRayis licensed by FlexRay Consortium. HYPERTERMINALof Hilgraeve Incorporated.  
IECof Commission Electrotechnique Internationale. IrDAof Infrared Data Association Corporation. ISO™  
of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABof MathWorks, Inc. MAXIMof  
Maxim Integrated Products, Inc. MICROTEC, NUCLEUSof Mentor Graphics Corporation. Mifareof NXP.  
MIPIof MIPI Alliance, Inc. MIPSof MIPS Technologies, Inc., USA. muRataof MURATA  
MANUFACTURING CO., MICROWAVE OFFICE(MWO) of Applied Wave Research Inc., OmniVisionof  
OmniVision Technologies, Inc. OpenwaveOpenwave Systems Inc. RED HATRed Hat, Inc. RFMDRF  
Micro Devices, Inc. SIRIUSof Sirius Sattelite Radio Inc. SOLARISof Sun Microsystems, Inc. SPANSION™  
of Spansion LLC Ltd. Symbianof Symbian Software Limited. TAIYO YUDENof Taiyo Yuden Co.  
TEAKLITEof CEVA, Inc. TEKTRONIXof Tektronix Inc. TOKOof TOKO KABUSHIKI KAISHA TA.  
UNIXof X/Open Company Limited. VERILOG, PALLADIUMof Cadence Design Systems, Inc. VLYNQ™  
of Texas Instruments Incorporated. VXWORKS, WIND RIVERof WIND RIVER SYSTEMS, INC. ZETEX™  
of Diodes Zetex Limited.  
Last Trademarks Update 2010-06-09  
Datasheet  
3
Revision 2.3, 2015-10-21  
PX3519  
Applications  
1
Applications  
Desktop and Server VR12.X Vcore and non-Vcore buck-converters  
Network and Telecom uncontrolled processor VR  
Single Phase and Multiphase POL  
CPU/GPU Regulation in Notebook, Graphics Cards and Gaming  
Voltage Modules requiring high power density  
Memory (DDR2/3)  
2
Features  
High frequency operation: up to 1.2MHz  
Capability to drive MOSFET for 50A per phase  
Wide VCC input voltage range: 4.5V to 9V  
Wide input voltage range: up to 13.2V  
Low power dissipation  
Includes bootstrap diode  
Gate disable pin for fast low side switch off  
Adaptive shoot through protection  
Compatible to standard +3.3V controller.  
Tri-state PWM input functionality  
Small package: 3mmx3mm VDSON-8  
RoHS compliant  
Table 1  
Product Identification  
Temp Range  
Part Number  
PX3519  
Package  
Marking  
3x3 8-leads VDSON-8  
3519  
-40 to 125C  
Figure 1  
Picture of the product  
Datasheet  
4
Revision 2.3, 2015-10-21  
PX3519  
Description  
3
Description  
3.1  
Pinout  
Figure 2  
Pinout, numbering and name of pins (transparent top view)  
I/O Signals  
Table 2  
Pin No.  
1
Name  
Pin Type Buffer Type Function  
BOOT  
O
Analog  
Floating bootstrap supply pin for the upper gate drive.  
Connect the bootstrap capacitor 1) between this pin and the  
PHASE pin. The bootstrap capacitor provides the charge to  
turn on the upper MOSFET. See the Internal Bootstrap  
Device section herein for guidance in choosing the  
capacitance value.  
2
3
PWM  
EN  
I
I
Logic  
Logic  
PWM drive logic input  
Connect this pin to the PWM output from the controller.  
Enable signal  
Used to activate the device. When connected to high level  
the status of the driver outputs (UGATE, LGATE), is  
determined by the PWM. When connected to low level the  
driver outputs are disabled regardless of signal levels on  
PWM input. EN input must be driven high or low and must  
not be left floating.  
5
7
LGATE  
PHASE  
O
I
Analog  
Analog  
Low side gate signal  
Connect to the gate of the low-side power N-channel  
MOSFET  
Return path for the upper gate driver.  
Connect this pin to the source of the upper MOSFET and  
the drain of the lower MOSFET. This pin provides a return  
path for the upper gate drive.  
8
UGATE  
O
Analog  
Upper gate drive output.  
Connect to the gate of high-side power N-channel MOSFET  
1) See section 5.2 for guidance in choosing capaciatance value  
Datasheet  
5
Revision 2.3, 2015-10-21  
PX3519  
Description  
Table 3  
Pin No.  
4
Power Supply  
Name  
Pin Type Buffer Type Function  
POWER  
Supply for housekeeping/logic and driver sections  
VCC  
-
power to the IC.  
Connect to +4.5V – 8V. Place a high quality low ESR  
ceramic capacitor from this pin to GND.  
Table 4  
Pin No.  
6
Ground Pins  
Name  
Pin Type Buffer Type Function  
GND  
GND  
-
GND connection.  
Can be left open since main GND connection to circuit  
board is via die pad. Must not be used as single ground  
connection.  
-
Die Pad GND  
-
Bias and reference ground.  
All signals are referenced to this node. It is also the power  
ground return of the driver. It is mandatory to connect the  
die paddle electrically and thermally to the circuit board.  
3.2  
General description  
The PX3519 is a dual high speed driver designed to drive a wide range of high-side and low-side power N-  
channel MOSFETs in synchronous rectified buck converters. When combined with the Infineon PX38xx/PX88xx  
family of Digital Multi-phase Controllers or PX75xx Digital Point of Load (DiPOL) Controllers and N-channel  
MOSFETs, the PX3519 forms a complete core-voltage regulator solution for advanced micro and graphics  
processors as well as point-of-load applications. The PX3519 provides the capability of driving the high-side  
gate and low-side gate with a variable gate driving voltage, ranging from 4.5V up to 8V, to tailor the efficiency of  
the system based on the customer conditions and needs.The input voltage for the power stage can range from  
5V up to 13.2V. Adaptive shoot-through protection is integrated into the IC which prevents both upper and lower  
MOSFETs from conducting simultaneously while minimizing dead time. An enable pin is provided to switch off  
the outputs of the driving stage.  
Datasheet  
6
Revision 2.3, 2015-10-21  
PX3519  
Description  
UVLO  
HS Driver  
Shoot Through  
Protection Unit  
HS  
Logic  
Input  
Logic  
3 state  
PHASE  
LS  
Logic  
LS Driver  
Figure 3  
Simplified block diagram  
Datasheet  
7
Revision 2.3, 2015-10-21  
PX3519  
Electrical specification  
4
Electrical specification  
4.1  
Absolute Maximum Ratings  
Stresses above those listed in Table 5 “Absolute Maximum Ratings” may cause permanent damage to the  
device. These are absolute stress ratings only and operation of the device is not implieed or recommended aat  
these or any other conditions in excess of those given in the operattiional ssections of this specification. Exposure  
to the absolute maximum ratings for extended periods may adversely affect the operation and reliability of thhe  
device.  
Table 5  
Absolute Maximum Ratings (Tambient =25°C)  
Symbol  
Parameter  
Values  
Max.  
Unit  
Note / Test  
Conditions  
Min. Typ.  
VCC supply voltage (DC)  
BOOT voltage, DC  
BOOT voltage, pulsed  
BOOT to PHASE voltage  
PHASE voltage, DC  
PHASE voltage, pulsed  
LGATE voltage, DC  
HGATE voltage to PHASE, DC  
VPWM  
VVCC  
-0.3  
-0.3  
-0.3  
-0.3  
-1  
9
V
VBOOT  
25  
30  
9
V
VBOOT  
V
VBOOT - VPHASE  
VPHASE  
V
16  
25  
9.3  
9.3  
3.6  
3.6  
150  
150  
V
2)  
VPHASE  
-12  
-0.3  
-0.3  
V
LGATE  
V
HGATE - VPHASE  
V
V
EN  
VEN  
V
Junction temperature  
T
TTTBJmax  
-40  
-55  
C  
C  
TB  
Storage temperature  
2) The pulse duration is 2ns for the minimum and 10ns for the maximmum.  
T
TTTBSTG  
TB  
Typical server VCORE  
application conditions  
Figure 4  
Safe Operating Area of RPHASE  
Datasheet  
8
Revision 2.3, 2015-10-21  
PX3519  
Electrical specification  
Note: ton refers to the on-time of the HS-MOSFET. For input voltages below 12 V no limits on the duration of ton  
need to be applied.The relative position of a typical Server VCORE application conditions VIN=12V  
VOUT=1.8V fSW=450kHz is represented as reference.This Safe Operating Area is verified by design, not  
100% tested in production.  
Note: All rated voltages are relative to voltages on the GND pins unless otherwise specified.  
Datasheet  
9
Revision 2.3, 2015-10-21  
PX3519  
Electrical specification  
4.2  
Thermal characteristics  
Table 6  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
Note / Test Condition  
Min.  
Typ. Max.  
θJS  
K/W  
Thermal resistance, junction-soldering  
point3  
-
7
-
-
-
θJtop  
Thermal resistance, junction-top of  
package  
-
20  
-
4.3  
Recommended Operating Conditions and Electrical characteristics  
Note: VCC = 5V, Tambient = 25°C  
Table 7  
Recommended Operating Conditions  
Symbol  
Parameter  
Values  
Typ.  
Unit Test conditions  
Min.  
Max.  
Supply voltage  
T
VTTBVCC  
4.5  
-
8
V
TB  
rising edge between 3.1V and 4.5V :  
dvCC/dt>5V/100ms  
Frequency of the PWM  
Enable pin voltage  
Junction temperature  
Minimum on time  
fSW  
-
0
-
-
1.2  
3.3  
MHz Note4  
T
VTTBEN  
V
B
T
TTTBjOP  
-40  
-
+125  
°C  
ns  
ns  
TB  
Note4  
Note4  
20  
30  
Minimum off time  
Table 8  
Voltage Supply And Biasing Current  
Symbol  
Parameter  
Values  
Typ.  
3.6  
Unit Test conditions  
Min.  
Max.  
VCC rising  
UVLO rising  
VUVLO_R  
-
4.3  
V
rising edge between 3.1V and 4.5V :  
dvCC/dt>5V/100ms  
VCC falling  
fSW = 300kHz  
PWM = 0V  
UVLO falling  
IC current  
VUVLO_F  
-
-
-
-
3.2  
2
-
-
-
-
IVCC_300kHz  
IVCC_PWML  
IVCC_ENL_PWML  
mA  
1.67  
1100  
EN = 0V  
PWM=0V  
μA  
PWM = Open  
IVCC_O  
-
780  
-
3 The junction-soldering point is referred to the GND bottom exposed pad.  
Datasheet  
10  
Revision 2.3, 2015-10-21  
PX3519  
Electrical specification  
Table 9  
Logic Inputs And Threshold  
Symbol  
Parameter  
Values  
Typ.  
Unit Test conditions  
Min.  
2.0  
Max.  
EN  
Input low  
T
T
T
T
T
T
T
VTTBEN_L  
0.8  
V
V
TB  
Input high  
VTTBEN_H  
TB  
PWM  
Input low  
VTTBPWM_L  
0.8  
T
T
T
T
VTTBPWM falling  
TB  
TB  
Input high  
VTTBPWM_H  
2.5  
2.06  
1.6  
VTTBPWM rising  
TB  
TB  
Input resistance  
Open voltage  
RTTBIN-PWM  
VTTBPWM_O  
VTTBPWM_S  
-
-
kΩ  
VTTBPWM = 1 V  
TB  
TB  
V
VTTBPWM_O  
TB  
TB  
Tristate shutdown  
1.2  
2.0  
TB  
windowTPFPT  
Table 10  
Timing Characteristics  
Symbol  
Parameter  
Values  
Typ.  
Unit Test conditions  
Min.  
Max.  
Upper Gate (UGATE) Output  
tSSHD_U  
tr_U  
tf_U  
50  
10  
10  
15  
Note, no load  
Shutdown hold off time  
ns  
Note4, 3nF load  
Note4, 3nF load  
Note, no load  
UGATE rise time  
UGATE fall time  
tPDTS_U  
tri-state to high propagation  
delay  
tPDH_U  
tPDL_U  
15  
20  
Note, no load  
Note, no load  
UGATE turn-on propagation  
delay  
UGATE turn-off propagation  
delay  
Lower Gate (LGATE) Output  
tSSHD_L  
tr_L  
50  
10  
5
Note, no load  
Note4, 3nF load  
Note4, 3nF load  
Note, no load  
Shutdown hold-off time  
ns  
LGATE rise time  
LGATE fall time  
tf_L  
tPDTS_L  
15  
tri-state to low propagation  
delay time  
tPDH_L  
tPDL_L  
15  
7
Note, no load  
Note, no load  
LGATE turn-on propagation  
delay time  
LGATE turn-off propagation  
delay time  
Enable (EN)  
tPDEN  
15  
Propagation delay Time rising  
falling  
ns  
4) Parameter verified by design, not 100% tested in production  
Datasheet  
11  
Revision 2.3, 2015-10-21  
PX3519  
Electrical specification  
Table 11  
Output Characteristics  
Symbol  
Parameter  
Values  
Typ.  
Unit Test conditions  
Min.  
Max.  
Output Characteristics  
ISRC_UG  
2
0.8  
2
Note2 current pulse < 20ns  
ISRC_UG = 200mA  
Note2, current pulse < 20ns  
Upper drive source current  
Upper drive source impedance  
Upper drive sink current  
A
Ω
A
Ω
A
Ω
A
Ω
RSRC_UG  
ISNK_UG  
RSNK_UG  
ISRC_LG  
RSRC_LG  
ISNK_LG  
0.6  
2
ISINK_UG = 200mA  
Upper drive sink impedance  
Lower drive source current  
Lower drive source impedance  
Lower drive sink current  
Note2, current pulse < 40ns  
ISRC_UG = 200mA  
Note2, current pulse < 40ns  
0.8  
4
RSNK_LG  
0.35  
ISINK_UG = 200mA  
Lower drive sink impedance  
Datasheet  
12  
Revision 2.3, 2015-10-21  
PX3519  
Theory of operation  
5
Theory of operation  
The PX3519 functionality is enabled by the EN pin. When the EN pin voltage overcomes the rising voltage  
threshold of the UVLO the driver begins to operate depending on the PWM status and the VCC pin status (VCC  
has to be higher then the rising threshold voltage). For VCC is recommended to have a slope for the rising edge  
higher than 5V/100ms around the rising UVLO threshold.  
The VCC can range between 4.5V and 8V and it is the supply pin for both driver and logic sections.  
The PX3519 functionality is driven by the PWM signal transitions. When the PWM signal performs a transition  
between low state to high state (PWM voltage higher than 2.5V) the Low Side MOSFET is turned off, after the  
turn off delay propagation time. Then the High Side MOSFET is turned on, after the turn on propagation delay  
time. Once the on time is expired the PWM signal provides a transition between the high state to the low state  
(PWM voltage lower than 0.8V). This will drive the High Side MOSFET from the ON state to the OFF state, after  
the turn off propagation delay time. The PX3519 is also capable to drive the two external MOSFETs both in off  
state. When the PWM signal enters in the shut down window or tri-state (typically between 1.2V and 2.0V) after  
the shut down hold off time both MOSFETs are switched off. This feature is useful when the IC controller wants  
to reduce the number of active phases in order to reduce the power consumption. In principle the tri-state status  
can be used also to improve the transition between high loads to low load.  
The PX3519 implements an embedded resistor network, which forces the PWM pin of the device in the middle  
of the shut down window if the PWM input from the controller is floating.  
In order to avoid cross conduction between the High Side MOSFET and the Low Side MOSFET an anti-shoot-  
through control is implemented with the adaptive scheme. The adaptive scheme is implemented in order to use  
a variety of different power MOSFETs for different kind of conversion. Nevertheless the dead time is kept as  
short as possible in order to increase the efficiency of the overall solution.  
The driver includes gate drive functionality to protect against shoot through. In order to protect the power stage  
from overlap, both High Side and Low Side MOSFETs being on at the same time, the adaptive control circuitry  
monitors the voltage at the “PHASE” pin. When the PWM signal goes low, the High Side MOSFET will begin to  
turn off. Once the “PHASE” pin falls below 1V, the Low Side MOSFET is gated on. Additionally, the gate to  
source voltage of the High Side MOSFET is also monitored. When VGS (High Side) is discharged below 1V, a  
threshold known to turn the High Side MOSFET off, a secondary delay is initiated, which results in the Low Side  
being gated “ON” regardless of the state of the “PHASE” pin. This way it will be ensured that the converter can  
sink current efficiently and the bootstrap capacitor will be refreshed appropriately during each switching cycle.  
During the start up depending on several factors it can be that the power input for the conversion (input rail)  
rises before the VCC input. In this case it could happen that the high side has an induced turn on. In order to  
avoid this undesirable effect the PX3519 embeds a resistance of 10 kOhm between UGATE pin and PHASE  
pin.  
In order to reduce the sensitivity to issues generated during the power on sequence (like the induced turn on of  
the high side MOSFET) and to reduce further the power consumption an EN pin is implemented; in this case the  
designer has the possibility to create a short delay time between the VCC and the EN pin voltage to ensure the  
proper functionality. Moreover the EN pin can be used to disable the driver stage in case a very low  
consumption is required.  
5.1  
Driver characteristics  
The gate driver of the PX3519 has one supply voltage to simplify the layout of the system.The VCC pin is used  
to power the section related to the logic for detecting the status of PWM pin and EN pin. The VCC pin is used  
also to supply the power section related to the driver of the power mosfet.  
The MOSFETs selected for this application are optimized for 5V gate drive, thus giving the end user optimized  
high load as well as light load efficiency. Nevertheless the driving voltage can be increased up to 8V in order to  
have a customized efficiency curve depending on the application conditions. The reference for the power  
circuitry including the driver output stage and the reference for the gate driver control circuit is GND.  
Proper response of the driver to the PWM signal is only guaranteed when UVLO have been cleared by the  
respective supply voltages (ref to table 8). Therefore, it is strongly recommended to only issue pulses to PWM  
when no UVLO conditions are present. The power down sequence should set PWM to HiZ with respect the  
internal threshold, before ramping down VIN (see figure 6 for VIN connection), PVCC and VCC respectively.  
Datasheet  
13  
Revision 2.3, 2015-10-21  
PX3519  
Theory of operation  
5.2  
Current capability and internal Bootstrap  
The PX3519 implements high current capability and low ohmic pull down resistances for the driving stages. The  
high current capability ensures fast switching transition for the MOSFETs in order to reduce the switching losses  
(2A of driving source/sink current for the upper MOSFET) even with high gate charge high side. The low ohmic  
pull down resistance (Low driver sink impedance 0.35 Ohm) is mainly important to avoid the induced turn on  
phenomenon on the low side during the fast turn on of the high side MOSFET.  
The high side is powered through the bootstrap circuitry. The PX3519 provides an embedded bootstrap diode.  
To complete the power network only a capacitance between PHASE and BOOT is needed. In many cases the  
PX3519 is optimized for the best switching behavior. An external resistance is not needed. The bootstrap  
capacitance is chosen depending on the high side gate charge. The following formula is giving a good  
estimation of the voltage drop across the bootstrap capacitance due to the charging of the high side:  
Where the VBOOT is the desired variation of the bootstrap voltage.  
The low side driver is powered through the VCC pin. The same considerations and formula done for the  
bootstrap capacitance can be done for the capacitance used to filter the VCC pin.  
The flexibility to adjust the driving voltage from 4.5V to 8V gives designers the possibility to shape the efficiency  
curve in anyway that is desired.  
5.3  
Power dissipation  
The power dissipation of the driver is given by the gate charge of the external power MOSFETs. The following  
formulas held:  
Where FSW is the switching frequency and QGHS and QGLS are respectively the gate charge of the high side  
and the gate charge of the low side at the VCC driving voltage. The very low thermal resistance package used  
for the PX3519 allows the device to avoid any usage of external resistances to decrease the power dissipation  
inside the driver even with high driving voltage. Since the thermal resistance is strongly influenced by the  
numbers of layers used in the board, it is recommended to check roughly the expected junction temperature via  
the power calculation.  
5.4  
Inputs to the internal control circuits  
The PWM is the control input to the IC from an external PWM controller and is compatible with 3.3V.  
The PWM input has tri-state functionality. When the voltage remains in the specified PWM-shutdown-window for  
at least the PWM-shutdown-holdoff time T_tsshd, the operation will be suspended by keeping both MOSFET  
gate outputs low. Once left open, the pin is internally fixed to VPWM_O = 1.6 V level.  
Table 12  
PWM Pin Functionality  
PWM logic level  
Driver output  
Low  
LGATE= High, UGATE = Low  
LGATE = Low, UGATE = High  
LGATE = Low, UGATE = Low  
High  
Open (left floating, or High impedance)  
During power-up sequence, the initial state of the PWM signal is ignored, until the first rising edge.  
Since all the thresholds are derived from an internal linear regulator they will not depend on the VCC input.  
Datasheet  
14  
Revision 2.3, 2015-10-21  
PX3519  
Theory of operation  
5.5  
Enable pin  
The EN pin has the main function to control the driver stage itself and enables operation. Once the voltage  
across the EN pin is higher than the rising edge threshold of the EN pin and the voltage across the VCC pin is  
above the rising edge threshold of the UVLO, the driver stage turns on and off the MOSFET based on the PWM  
status. The EN pin can not be left floating.  
The enable can be used for three different purposes:  
1. Power sequence: It can be delayed in order to turn on the power stage once VCC is at the expected  
level. This will reduce the probability of improper turn on sequences or oscillation created by unstable  
conditions.  
2. Power saving: there are two ways of disabling the driver stage: the first one is through the PWM signal;  
once the PWM signal is in the tri-state window the gate activity is stopped. The second one is the EN  
pin; once the enable pin is pulled below the falling edge threshold the driver stage is completely  
switched off. The difference between the two methods is basically that the PWM still leaves alive all the  
comparators and the auxiliary voltages, so that the consumption of the power stage is not at the  
minimum level.  
3. Zero Cross: if the controller is capable to detect the crossing of the inductor current, the EN pin could be  
used to switch off the low side MOSFET faster than the PWM (due to the hold off time)´in order to avoid  
the current reverse.  
EN Logic  
Level  
“H”  
Enable  
Shutdown  
“L”  
VEN_R  
VEN_F  
VCC  
Figure 5  
Enable pin  
5.6  
Layout consideration  
The PX3519 has a good protection system against unwanted overshoot and undershoot; the PHASE pin can  
range between dynamically -12V to 25V.  
The parasitic inductances of the PCB and of the power devices’ packaging (both upper and lower MOSFETs)  
can cause serious ringing, exceeding absolute maximum rating of the devices. Careful layout can help minimize  
such unwanted stress. The following advice is meant to lead to an optimized layout:  
Keep decoupling loops (VCC-GND and BOOT-PHASE) as short as possible and use high quality ceramic  
capacitance with low ESR (10mOhm) and low ESL (lower than 1nH).  
Minimize trace inductance, especially on low-impedance lines. All power traces (UGATE, PHASE, LGATE,  
GND, VCC) should be short and wide, as much as possible.  
Minimize the area of the PHASE node. Ideally, the source of the upper and the drain of the lower MOSFET  
should be as close as close as possible.Minimize the current loop of the output and input power trains. Short the  
source connection of the lower MOSFET to ground as close to the transistor pin as feasible. Input capacitors  
(especially ceramic decoupling) should be placed as close to the drain of upper and source of lower MOSFETs  
as possible.  
To optimize heat spreading, copper should be placed directly underneath the IC whether it has an exposed pad  
or not. The copper area can be extended beyond the bottom area of the IC and/or connected to buried copper  
plane(s) with thermal vias. This combination of vias for vertical heat escape, extended copper plane, and buried  
planes for heat spreading allows the IC to achieve its full thermal potential.  
Datasheet  
15  
Revision 2.3, 2015-10-21  
PX3519  
Application  
6
Application  
Figure 6  
Pin interconnection outline (transparent top view)  
Datasheet  
16  
Revision 2.3, 2015-10-21  
PX3519  
Gate driver timing diagram  
7
Gate driver timing diagram  
VPWM_H  
VPWM_H  
Three-state  
VPWM_L  
VPWM_L  
PWM  
_
T
pdll  
T_tsshd  
T_pts  
GL  
_
T
pdhl  
1 V  
T_tsshd  
_
T
pdlu  
T_pts  
_
T
pdhu  
GH  
1 V  
VSWH  
Figure 7  
Adaptive gate driver timing diagram  
Datasheet  
17  
Revision 2.3, 2015-10-21  
PX3519  
Enable timing diagram  
8
Enable timing diagram  
VPWM_H  
VPWM_L  
PWM  
V
EN_H  
V
EN_L  
EN  
tPDEN  
tPDEN  
GH  
GL  
Figure 8  
Enable Vs PWM timing diagram  
Datasheet  
18  
Revision 2.3, 2015-10-21  
PX3519  
Mechanical drawing  
9
Mechanical drawing  
Figure 9  
Mechanical dimensions  
Datasheet  
19  
Revision 2.3, 2015-10-21  
PX3519  
Mechanical drawing  
Figure 10 Footprint and solder stencil recommendations  
Datasheet  
20  
Revision 2.3, 2015-10-21  
w w w . i n f i n e o n . c o m  
Published by Infineon Technologies AG  
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