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IX3180G

型号：

IX3180G

品牌：

IXYS[ IXYS CORPORATION ]

页数：

11 页

PDF大小：

254 K

下载PDF手册
IX3180  
2.5A Output Current  
High Speed Gate Driver Optocoupler  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
• 2.5A Maximum Peak Output Current  
• 20ns Typical Pulse Width Distortion  
• 10kV/µs Minimum Common Mode Rejection (CMR)  
The IX3180 is a high speed MOSFET gate drive  
optocoupler. It consists of an input infrared LED that is  
optically coupled to an integrated power gate driver  
that is capable of sourcing and sinking 2.5A of peak  
current. The IX3180 is ideally suited for high frequency  
driving of power MOSFETs used in high performance  
DC/DC converters, motor control inverter applications,  
and high performance switching power supplies.  
at 1500V  
CM  
• Wide Operating Voltage Range: 10V to 20V  
• Under Voltage Lockout with Hysteresis  
• 3750V  
Input to Output Isolation  
rms  
• Wide Temperature Range: -40°C to +100°C  
• 200ns Maximum Propagation Delay Over  
Temperature Range  
The IX3180 is available in an 8-pin DIP package and  
an 8-pin surface mount package.  
Applications  
• Isolated Power MOSFET Gate Drive  
• Switch Mode Power Supplies  
• Industrial Inverters  
Approvals  
• UL Recognized Component: File E76270  
Ordering Information  
• Motor Drivers  
Part  
Description  
IX3180G  
8-Pin DIP Package (50/Tube)  
IX3180GS  
IX3180GSTR  
8-Pin Surface Mount (50/Tube)  
8-Pin Surface Mount Tape & Reel (1000/Reel)  
Figure 1. IX3180 Block Diagram  
VCC  
1
2
3
4
8
7
6
5
N/C  
VO  
VO  
ANODE  
CATHODE  
N/C  
VEE  
Note: A 0.1F bypass capacitor must  
be connected between pins 5 & 8.  
DS-IX3180-R02  
www.ixysic.com  
1
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings @ 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.5 Electrical Specifications (DC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
1.6 Switching Characteristics (AC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1.7 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3. Test Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.5 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.5.1 IX3180G 8-Pin DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.5.2 IX3180GS 8-Pin Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
4.5.3 IX3180GSTR Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2
www.ixysic.com  
R02  
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications  
1.1 Package Pinout  
1.2 Pin Description  
Pin#  
Name  
Description  
No connection  
VCC  
N/C  
8
1
1
2
3
4
5
N/C  
ANODE  
CATHODE  
N/C  
Anode of input LED  
Cathode of input LED  
No connection  
VO  
VO  
2
3
4
ANODE  
CATHODE  
N/C  
7
6
5
V
Negative Supply Voltage  
EE  
V
6
7
8
Gate Drive Output  
Gate Drive Output  
Positive Supply Voltage  
O
V
O
VEE  
V
CC  
1.3 Absolute Maximum Ratings @ 25°C  
Parameter  
Supply Voltage  
Symbol  
- V  
Limit  
Units  
V
V
-0.5 to 25  
CC EE  
V
0 to V  
Output Voltage  
V
O(PEAK)  
CC  
1
I
- 2.5  
2.5  
5
A
“High” Peak Output Current  
OH(PEAK)  
1
I
A
“Low” Peak Output Current  
Reverse Input Voltage  
Average Input Current  
OL(PEAK)  
V
V
R
I
20  
mA  
F(AVG)  
Peak Transient Input Current  
(<1s pulse width, 300pps)  
I
1
A
F(TRAN)  
2
P
70  
mW  
mW  
Input Power Dissipation  
IN  
3
P
800  
Total Power Dissipation  
T
V
V
Isolation Voltage, Input to Output  
Operating Temperature  
3750  
IO  
rms  
T
-40 to +100  
-55 to +125  
°C  
°C  
A
T
Storage Temperature  
STG  
Notes:  
1 Maximum pulse width=10s, maximum duty cycle=0.2%.  
2 Derate linearly 0.66mW/°C  
3 Derate linearly 7.5mW/°C  
Absolute maximum ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
R02  
www.ixysic.com  
3
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.4 Recommended Operating Conditions  
Parameter  
Power Supply Voltage  
Input Current (ON)  
Symbol  
Min  
10  
Max  
20  
Units  
V
- V  
EE  
V
CC  
I
10  
16  
mA  
V
F(on)  
V
Input Voltage (OFF)  
-3.6  
-40  
0.8  
100  
F(off)  
T
Operating Temperature  
°C  
A
1.5 Electrical Specifications (DC)  
Over recommended operating conditions unless otherwise specified. Typical values are at T =25°C.  
A
Parameter  
Conditions  
Symbol Min  
Typ  
Max  
Units  
1
High Level Output Current  
- 0.5  
-
-
-
-
-
-
V =(V -4V)  
CC  
O
I
A
OH  
2
- 2  
V =(V -10V)  
CC  
O
1
Low Level Output Current  
0.5  
V =(V +2.5V)  
EE  
O
I
A
OL  
2
2
-
-
-
-
V =(V +10V)  
EE  
O
I =-100mA  
O
V
V - 1  
CC  
High Level Output Voltage  
Low Level Output Voltage  
V
V
OH  
I =100mA  
O
V
OL  
-
-
0.5  
6
6
8
-
Output Open, I =10 to 16mA  
F
I
CCH  
High Level Supply Current  
Low Level Supply Current  
-
-
-
3
mA  
Output Open, V =- 3 to +0.8V  
F
I
CCL  
3
I =0mA, V >5V  
O
I
FLH  
Threshold Input Current, Low-to-High  
Threshold Input Voltage, High-to-Low  
Input Forward Voltage  
-
mA  
V
O
V
-
0.8  
1
-
-
FHL  
I =10mA  
F
V
1.35  
-1.4  
-
1.7  
-
V
F
I =10mA  
F
V /T  
Temperature Coefficient of Forward Voltage  
Input Reverse Breakdown Voltage  
Input Capacitance  
mV/°C  
V
F
A
I =10A  
BV  
5
-
-
R
R
f=1MHz, V =0V  
F
C
30  
8.7  
8.1  
0.6  
-
pF  
IN  
V
UVLO Threshold  
-
-
UVLO+  
V >5V, I =10mA  
F
V
V
O
V
-
-
UVLO-  
V >5V, I =10mA  
F
UVLO  
HYS  
UVLO Hysteresis  
-
-
O
1
Maximum pulse width = 50s, maximum duty cycle = 0.5%.  
Maximum pulse width = 10s, maximum duty cycle = 0.2%.  
2
See “Test Circuits” on page 8 for more information.  
4
www.ixysic.com  
R02  
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.6 Switching Characteristics (AC)  
Over recommended operating conditions, unless otherwise specified.  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
Propagation Delay Time  
to High Output Level  
tPLH  
50  
85  
200  
Propagation Delay Time  
to Low Output Level  
tPHL  
50  
-
100  
20  
-
200  
65  
Pulse Width Distortion  
PWD  
|tPHL-tPLH  
RG=10, CG=10nF  
f=250kHz, Duty Cycle=50%  
ns  
|
Propagation Delay Difference  
Between any Two Parts1  
Rise Time  
PDD  
(tPHL-tPLH  
-90  
90  
)
tr  
-
-
-
-
25  
25  
2
-
-
-
-
Fall Time  
tf  
UVLO Turn-On Delay  
UVLO Turn-Off Delay  
VO>5V, IF=10mA  
VO<5V, IF=10mA  
tUVLO(on)  
tUVLO(off)  
s  
0.3  
Output High Level  
Common Mode Transient Immunity  
IF=10 to 16mA, VCM=1500V,  
VCC=20V, TA=25°C  
|CMH|  
|CML|  
10  
10  
-
-
-
-
kV/s  
Output Low Level  
Common Mode Transient Immunity  
VF=0V, VCM=1500V, VCC=20V,  
TA=25°C  
1 The difference between tPHL and tPLH of any two IX3180 devices operating under the same conditions and temperature.  
Figure 2. Timing Waveforms  
IF  
tr  
tf  
90%  
50%  
10%  
VOUT  
tPLH  
tPHL  
1.7 Package Characteristics  
Parameter  
Conditions  
Symbol Rating  
Units  
Isolation Test Voltage  
VISO  
Vrms  
-
3750  
Input-Output Momentary Withstand  
Voltage  
RH < 50%, t = 1 min,  
TA = 25°C  
VISO  
Vrms  
3750  
1012  
0.6  
Resistance (Input-Output), Typical  
Capacitance (Input-Output), Typical  
VI-O = 500VDC  
f = 1 MHz  
RI-O  
CI-O  
pF  
R02  
www.ixysic.com  
5
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
2. Performance Data  
IOH vs.Temperature  
VOH vs. IOH  
VOH vs.Temperature  
(IF=10mA,VOUT=VCC-4V,VCC=10V,VEE=0V)  
(IF=10mA,VCC=10V,VEE=0V)  
(IOH= -100mA, IF=10mA to 16mA,VCC=10V to 20V,VEE=0V)  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
-1  
-2  
-3  
-4  
-5  
0.20  
0.15  
0.10  
0.05  
0.00  
TA= -40ºC  
TA= 25ºC  
TA= 100ºC  
-50  
-25  
0
25  
50  
Temperature (ºC)  
75  
100 125  
0.0  
0.5  
1.0  
1.5  
Output Current (A)  
2.0  
2.5  
3.0  
3.5  
100  
-40  
-20  
0
20  
40  
Temperature (ºC)  
60  
80  
100  
IOL vs.Temperature  
VOL vs. IOL  
VOL vs.Temperature  
(VF(off)=-3V to 0.8V, VOUT=2.5V,VCC=10V,VEE=0V)  
(VF(off)=-3V to 0.8V, VCC=10V,VEE=0V)  
(IOL= 100mA,VF(off)=-3V to 0.8V, VCC=10V to 20V,VEE=0V)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
5
4
3
2
1
0
0.20  
0.15  
0.10  
0.05  
0.00  
TA= 100ºC  
TA= 25ºC  
TA= -40ºC  
-50  
-25  
0
25 50  
Temperature (ºC)  
75  
100 125  
0.0  
0.5  
1.0  
1.5  
2.0  
Output Current (A)  
2.5  
3.0  
-40  
-20  
0
20 40  
Temperature (ºC)  
60  
80  
100  
IF Low-to-highThreshold vs.Temperature  
Supply Current - ICC vs. Supply Voltage - VCC  
ICC vs.Temperature  
(VCC=20V,VEE=0V)  
(VCC=10V to 20V,VEE=0V, Output=Open)  
(TA=25ºC,VEE=0V)  
3.5  
3.0  
2.5  
2.0  
1.5  
4
3
2
1
0
4
3
2
1
0
ICCH (IF=10mA)  
ICCL (IF=0mA)  
ICCH (IF=10mA)  
ICCL (IF=0mA)  
-40  
-20  
0
20  
40  
Temperature (ºC)  
60  
80  
10  
12  
14  
16  
18  
20  
22  
-40  
-20  
0
20 40  
Temperature (ºC)  
60  
80  
100  
VCC (V)  
Propagation Delay vs.Temperature  
(IF=10mA,VCC=20V,VEE=0V, RG=10Ω, CG=10nF, f=250kHz)  
Propagation Delay vs. IF  
(VCC=20V,VEE=0V, RG=10Ω, CG=10nF, f=250kHz, Duty Cycle=50%)  
250  
Propagation Delay vs.VCC  
(IF=10mA, RG=10Ω, CG=10nF, f=250kHz, Duty Cycle=50%)  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
200  
150  
100  
50  
tPHL  
tPHL  
tPHL  
tPLH  
tPLH  
tPLH  
0
0
0
-40  
-20  
0
20 40  
Temperature (ºC)  
60  
80  
100  
10  
15  
20  
25  
8
10  
12  
14  
16  
18  
VCC (V)  
IF (mA)  
6
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R02  
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Propagation Delay vs. RG  
Propagation Delay vs. CG  
(VCC=20V, IF=10V, CG=10nF, f=250kHz, Duty Cycle=50%)  
(VCC=20V, IF=10mA, RG=10Ω, f=250kHz, Duty Cycle=50%)  
Transfer Characteristic  
150  
130  
110  
90  
150  
130  
110  
90  
25  
20  
15  
10  
5
tPHL  
tPHL  
tPLH  
tPLH  
70  
70  
50  
50  
0
5
10  
15  
20  
25  
10  
15  
20  
25  
30  
35  
40  
45  
50  
0
1
2
3
4
5
CG (nF)  
RG (Ω)  
IF - Forward LED Current (mA)  
Input Current vs. Forward Voltage  
(TA=25ºC)  
50  
40  
30  
20  
10  
0
0.8  
0.9  
1.0  
1.1 1.2  
Forward Voltage (V)  
1.3  
1.4  
1.5  
R02  
www.ixysic.com  
7
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3. Test Circuits  
1
8
1
2
3
4
8
0.1μF  
0.1μF  
4V  
IOL  
IF=10 to 16mA  
2
+
-
7
6
5
7
VCC=10 to 20V  
VCC=10 to 20V  
+
-
+
-
2.5V  
+
-
3
4
6
5
IOH  
IOH Test Circuit  
IOL Test Circuit  
1
2
3
4
8
1
2
3
4
8
100mA  
0.1μF  
0.1μF  
IF=10 to 16mA  
VOH  
7
7
V
CC=10 to 20V  
VCC=10 to 20V  
+
-
+
-
6
5
6
5
VOL  
100mA  
VOH Test Circuit  
VOL Test Circuit  
1
2
3
4
8
1
2
3
4
8
IF  
0.1μF  
0.1μF  
IF=10mA  
7
7
VCC  
+
-
+
-
6
5
6
5
VCC=10 to 20V  
VO>5V  
VO>5V  
I
FLH Test Circuit  
UVLO Test Circuit  
1
8
0.1μF  
IF=10 to 16mA  
+
-
2
3
4
7
VCC=20V  
VO  
+
-
500Ω  
10kHz  
50%  
RG  
10Ω  
Duty Cycle  
6
5
CG  
10nF  
tPLH, tPHL, tr, tf Test Circuit  
8
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R02  
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4. Manufacturing Information  
4.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the  
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee  
proper operation of our devices when handled according to the limitations and information in that standard as well as  
to any limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to  
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
IX3180G / IX3180GS  
MSL 1  
4.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
4.3 Soldering Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of  
J-STD-020 must be observed.  
Device  
Maximum Temperature x Time  
Maximum Reflow Cycles  
IX3180G / IX3180GS  
250°C for 30 seconds  
3
4.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an  
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash  
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
R02  
www.ixysic.com  
9
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4.5 Package Mechanical Dimensions  
4.5.1 IX3180G 8-Pin DIP  
9.652 0.381  
(0.380 0.015)  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(0.100 0.005)  
(8-0.031 DIA.)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
(0.130 0.002)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
0.254 0.0127  
(0.010 0.0005)  
Dimensions  
0.813 0.102  
mm  
(0.032 0.004)  
(inches)  
4.5.2 IX3180GS 8-Pin Surface Mount  
9.652 0.381  
(0.380 0.015)  
PCB Land Pattern  
0.635 0.127  
(0.025 0.005)  
2.540 0.127  
3.302 0.051  
2.54  
(0.100 0.005)  
(0.10)  
(0.130 0.002)  
9.525 0.254  
(0.375 0.010)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
(0.0649)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
0.254 0.0127  
(0.010 0.0005)  
0.65  
(0.0255)  
4.445 0.127  
(0.175 0.005)  
Dimensions  
mm  
(inches)  
0.813 0.102  
(0.032 0.004)  
10  
www.ixysic.com  
R02  
IX3180  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4.5.3 IX3180GSTR Tape & Reel  
330.2 DIA.  
(13.00 DIA.)  
W=16.00  
(0.63)  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
Bo=10.30  
(0.406)  
Ao=10.30  
(0.406)  
P=12.00  
(0.472)  
K0=4.90  
(0.193)  
K1=4.20  
(0.165)  
User Direction of Feed  
Dimensions  
mm  
Embossed Carrier  
(inches)  
NOTES:  
1. Dimensions carry tolerances of EIA Standard 481-2  
Embossment  
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IX3180-R02  
©Copyright 2015, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
1/6/2015  
R02  
www.ixysic.com  
11  
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