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1SS355-L0RRG

型号:

1SS355-L0RRG

品牌:

TSC[ TAIWAN SEMICONDUCTOR COMPANY, LTD ]

页数:

3 页

PDF大小:

163 K

1SS355  
Taiwan Semiconductor  
Small Signal Product  
200mW High Speed SMD Switching Diode  
FEATURES  
- Fast switching device (trr<4.0ns)  
- Surface Mount Device Type  
- Moisture sensitivity level 1  
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate  
- Pb free version and RoHS compliant  
- Packing code with suffix "G" means  
green compound (halogen-free)  
SOD-323F  
MECHANICAL DATA  
- Case: Flat lead SOD-323F small outline plastic package  
- Terminal: Matte tin plated, lead free,  
solderable per MIL-STD-202, Method 208 guaranteed  
- High temperature soldering guaranteed: 260°C/10s  
- Polarity: Indicated by cathode band  
- Weight: 6 ± 0.5mg  
- Marking code: S4  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25unless otherwise noted)  
PARAMETER  
VALUE  
200  
90  
SYMBOL  
UNIT  
mW  
V
Power Dissipation  
PD  
VRRM  
VR  
Repetitive Peak Reverse Voltage  
Reverse Voltage  
80  
V
Minimum Breakdown Voltage at IR = 100μA  
Forward Current  
VBR  
IF  
80  
V
250  
150  
500  
100  
1.2  
mA  
mA  
mA  
nA  
V
Continue Forward Current  
IO  
Repetitive Peak Forward Voltage  
Maximum Reverse Leakage Current at VR = 80V  
Maximum Forward Voltage at IF = 100mA  
IFSM  
IR  
VF  
Maximum Reverse Recovery Time  
at IF = 10mA, VR = 6V, RL = 100 Ohms  
trr  
4
ns  
Maximum Junction Capacitance at VR = 0.5V, f = 1MHz  
OperatingTemperature Range  
Cj  
4
pF  
oC  
oC  
TOPR  
TSTG  
- 65 to +150  
- 65 to +150  
Storage Temperature Range  
Note : These ratings are limiting values above which the serviceability of the diode may be impaired  
Document Number: DS_S1412036  
Version: B14  
1SS355  
Taiwan Semiconductor  
Small Signal Product  
ORDERING INFORMATION  
PACKING CODE  
SUFFIX  
PART NO.  
SUFFIX  
PACKING CODE  
PACKAGE  
PACKING  
PART NO.  
RR  
R9  
3K / 7" Reel  
-xx  
(Note 1)  
1SS355  
G
SOD-323F  
10K / 13" Reel  
Note 1: Part No. Suffix „-xx “ would be used for special requirement  
EXAMPLE  
PACKING CODE  
SUFFIX  
PART NO.  
SUFFIX  
PREFERRED P/N  
PACKING CODE  
DESCRIPTION  
PART NO.  
Multiple manufacture  
source  
Green compound  
1SS355 RRG  
1SS355  
RR  
G
G
G
Defined manufacture  
source  
Green compound  
1SS355-L0 RRG  
1SS355-B0 RRG  
1SS355  
1SS355  
-L0  
-B0  
RR  
RR  
Defined manufacture  
source  
Green compound  
PACKAGE OUTLINE DIMENSIONS  
SOD-323F  
Unit (mm)  
Unit (inch)  
DIM.  
Min  
1.15  
2.30  
0.25  
1.60  
0.80  
0.05  
Max  
1.35  
2.80  
0.40  
1.80  
1.10  
0.25  
Min  
Max  
0.053  
0.110  
0.016  
0.071  
0.043  
0.010  
A
B
C
D
E
F
0.045  
0.091  
0.010  
0.063  
0.031  
0.002  
SUGGEST PAD LAYOUT  
Unit (mm)  
Unit (inch)  
DIM.  
Typ.  
1.280  
0.710  
2.700  
0.403  
Typ.  
0.050  
0.028  
0.106  
0.016  
G
X
X1  
Y
Document Number: DS_S1412036  
Version: B14  
1SS355  
Taiwan Semiconductor  
Small Signal Product  
Notice  
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,  
assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied,to  
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of  
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,  
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,  
merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or seling these products for use in such applications do so at their own risk and agree to fully  
indemnify TSC for any damages resulting from such improper use or sale.  
Document Number: DS_S1412036  
Version: B14  
厂商 型号 描述 页数 下载

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