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PXFC191507FCV1R0XTMA1

型号:

PXFC191507FCV1R0XTMA1

品牌:

INFINEON[ Infineon ]

页数:

8 页

PDF大小:

1039 K

PXFC191507FC  
Thermally-Enhanced High Power RF LDMOS FET  
150 W, 28 V, 1805 – 1990 MHz  
Description  
PXFC191507FC  
Package H-37248G-4/2  
The PXFC191507FC is a 150-watt LDMOS FET intended for use  
in multi-standard cellular power amplifier applications in the 1805  
to 1990 MHz frequency band. Features include input and output  
matching, high gain and thermally-enhanced package with earless  
flanges. Manufactured with Infineon's advanced LDMOS process,  
this device provides excellent thermal performance and superior  
reliability.  
Features  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 960 mA, VGS = 2.65 V,  
ƒ = 1990 MHz, 3GPP WCDMA signal,  
PAR = 8 dB, 10 MHz carrier spacing,  
BW 3.84 MHz  
Broadband internal input and output matching  
Typical Pulsed CW performance, 1990 MHz, 28 V,  
10 µs pulse width, 10% duty cycle, class AB test  
- Output power at P  
- Efficiency = 54%  
- Gain = 19.5 dB  
= 140 W  
1dB  
22  
21  
20  
19  
18  
17  
16  
60  
50  
40  
30  
20  
10  
0
Gain  
Typical single-carrier WCDMA performance,  
1990 MHz, 28 V, 10 dB PAR @ 0.01% CCDF, Test  
Model 1 with 16DPCH  
- Output power = 32 W avg  
- Efficiency = 34%  
- Gain = 20 dB  
- ACPR = –31 dBc@ 5 MHz  
Efficiency  
Capable of handling 10:1 VSWR @28 V, 150 W  
(CW) output power  
Integrated ESD protection : Human Body Model,  
c191507fc_g1  
Class 1C (per JESD22-A114)  
29  
33  
37  
41  
45  
49  
53  
Low thermal resistance  
Output Power (dBm)  
Pb-free and RoHS compliant  
RF Characteristics  
Two-carrier WCDMA Specifications (tested in Infineon production test fixture)  
= 28 V, I = 960 mA, P = 32 W avg, ƒ = 1980 MHz, ƒ = 1990 MHz, 3GPP signal, channel bandwidth = 3.84 MHz,  
V
DD  
DQ  
OUT  
1
2
peak/average = 8 dB @ 0.01% CCDF  
Characteristic  
Gain  
Symbol  
Min  
19  
Typ  
20.5  
31  
Max  
Unit  
dB  
G
ps  
Drain Efficiency  
Intermodulation Distortion  
hD  
29  
%
IMD  
–33  
–31  
dBc  
All published data at T  
= 25°C unless otherwise indicated  
CASE  
ESD: Electrostatic discharge sensitive device—observe handling precautions!  
Data Sheet 1 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
DC Characteristics (each side)  
Characteristic  
Conditions  
Symbol  
Min  
65  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
Drain Leakage Current  
V
GS  
= 0 V, I = 10 mA  
V(  
BR)DSS  
DS  
V
= 28 V, V = 0 V  
I
I
0.05  
1
µA  
µA  
W
DS  
DS  
GS  
DSS  
DSS  
V
= 63 V, V = 0 V  
10  
GS  
On-State Resistance  
Operating Gate Voltage  
Gate Leakage Current  
V
GS  
= 10 V, V = 0.1 V  
R
0.05  
2.6  
DS  
DS(on)  
V
= 26 V, I  
= 960 mA  
V
GS  
2.3  
2.9  
1
V
DS  
DQ  
V
GS  
= 10 V, V = 0 V  
I
GSS  
µA  
DS  
Maximum Ratings  
Parameter  
Symbol  
Value  
65  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Operating Voltage  
V
DSS  
V
–6 to +10  
0 to +32  
225  
V
GS  
DD  
V
V
Junction Temperature  
Storage Temperature Range  
T
°C  
J
T
STG  
–65 to +150  
0.43  
°C  
Thermal Resistance (T  
= 70°C, 140 W CW)  
R
qJC  
°C/W  
CASE  
Ordering Information  
Type and Version  
Order Code  
Package Description  
Shipping  
PXFC191507FC V1 R0  
PXFC191507FC V1 R250  
PXFC191507FCV1R0XTMA1  
PXFC191507FCV1R250XTMA1  
H-37248G-4/2, earless flange  
H-37248G-4/2, earless flange  
Tape & Reel, 50 pcs  
Tape & Reel, 250 pcs  
Data Sheet  
2 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
Typical Performance (data taken in a production test fixture)  
Two-carrier WCDMA Drive-up  
Two-carrier WCDMA Drive-up  
VDD = 28 V, IDQ = 960 mA, VGS = 2.65 V,  
ƒ = 1990 MHz, 3GPP WCDMA signal,  
PAR = 8 dB, 10 MHz carrier spacing,  
BW 3.84 MHz  
V
DD = 28 V, IDQ = 960 mA, VGS = 2.65V,  
3GPP WCDMA signal, PAR = 8 dB,  
10 MHz carrier spacing, BW 3.84 MHz  
-10  
-20  
-30  
-40  
-50  
-60  
-5  
-15  
-25  
-35  
-45  
-55  
-65  
60  
50  
40  
30  
20  
10  
0
1930 IMDL  
1930 IMDU  
1960 IMDL  
1960 IMDU  
1990 IMDL  
IMD Low  
IMD Up  
ACPR  
Efficiency  
c191507fc_g3  
c191507fc_g2  
29  
33  
37  
41  
45  
49  
53  
29  
33  
37  
41  
45  
49  
53  
Output Power (dBm)  
Output Power (dBm)  
Pulsed CW Performance  
Pulsed CW Performance  
at various VDD  
VDD = 28 V, IDQ = 960 mA  
IDQ = 960 mA, ƒ = 1990 MHz  
1930 Gain  
1960 Gain  
1990 Gain  
1930 Eff  
1960 Eff  
1990 Eff  
VDD = 24 V Gain  
DD = 28 V Gain  
DD = 32 V Gain  
DD = 24 V Eff  
DD = 28 V Eff  
DD = 32 V Eff  
V
V
V
V
V
22  
60  
22  
21  
20  
19  
18  
17  
16  
60  
50  
40  
30  
20  
10  
0
21  
20  
19  
18  
17  
16  
50  
40  
30  
20  
10  
0
Gain  
Gain  
Efficiency  
42  
Efficiency  
c191507fc_g5  
c191507fc_g4  
27  
32  
37  
47  
52  
57  
30  
35  
40  
45  
50  
55  
Output Power (dBm)  
Output Power (dBm)  
Data Sheet  
3 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
Typical Performance (cont.)  
Small Signal CW Performance  
Gain & Input Return Loss  
VDD = 28 V, IDQ = 960 mA  
22  
21  
20  
19  
18  
17  
0
Gain  
-5  
-10  
-15  
-20  
-25  
IRL  
c191507fc_g6  
1800 1850 1900 1950 2000 2050 2100  
Frequency (MHz)  
Broadband Circuit Impedance  
D
Z Source W  
Z Load W  
Freq  
[MHz]  
Z Source  
Z Load  
R
jX  
R
jX  
1930  
1960  
1990  
1.34  
1.28  
1.25  
–4.30  
–4.15  
–4.04  
1.55  
1.54  
1.52  
–3.14  
–2.99  
–2.86  
G
S
Load Pull Performance  
Main Side Load Pull Performance – Pulsed CW signal: 100 µs, 10% duty cycle, V  
= 28 V, I  
= 960 mA  
DD  
DQ  
P
1dB  
Max Output Power  
Max PAE  
Zs  
[W]  
Freq  
[MHz]  
Zl  
[W]  
Gain  
[dB]  
P
P
PAE  
[%]  
Zl  
[W]  
Gain  
[dB]  
P
P
OUT  
PAE  
OUT  
OUT  
OUT  
[dBm]  
52.30  
52.10  
52.10  
52.00  
[W]  
170  
164  
162  
157  
[dBm]  
50.40  
50.50  
50.20  
50.60  
[W]  
110  
112  
104  
116  
[%]  
65.7  
64.8  
63.7  
62.8  
1805 1.00 – j3.39 1.36 – j2.81  
1880 1.38 – j3.80 1.26 – j3.35  
1930 1.88 – j4.65 1.14 – j3.38  
1990 2.85 – j4.62 1.31 – j3.40  
18.2  
17.8  
17.6  
18.4  
58.1  
54.7  
52.1  
56.4  
2.82 – j2.46  
2.48 – j2.33  
2.25 – j2.06  
1.81 – j2.40  
20.4  
20.2  
20.1  
19.9  
Data Sheet  
4 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
Reference Circuit , 1930 – 1990 MHz  
C802  
R804  
R803  
(61)  
R802  
R801  
RO4350, .020  
(61)  
C801  
S2  
S1  
S3  
C803  
R805  
C101  
C204  
C201 C202 C203  
C102  
VDD  
C209  
R101  
C211  
C104  
RF_IN  
RF_OUT  
C214  
C213  
C103  
C212  
VDD  
R102  
C206  
C207 C208  
C205  
C106  
C210  
C105  
RO4350, .020  
PXFC191507FC_IN_01  
PXFC191507FC_OUT_01  
c
1 9 1 5 0 7 f c _ C D _ 0 8 - 2 6 - 2 0 1 4  
Reference circuit assembly diagram (not to scale)  
Data Sheet  
5 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
Reference Circuit (cont.)  
Reference Circuit Assembly  
DUT  
PXFC191507FC V1  
Test Fixture Part No.  
PCB  
LTN/PXFC191507FC V1  
Rogers 4350, 0.508 mm [0.020”] thick, 2 oz. copper, εr = 3.66, ƒ = 1930 – 1990 MHz  
Find Gerber files for this test fixture on the Infineon Web site at http://www.infineon.com/rfpower  
Components Information  
Component  
Input  
Description  
Suggested Manufacturer  
P/N  
C101, C104, C105,  
C102, C106  
C103  
Capacitor, 33 pF  
Capacitor, 10 µF  
Capacitor, 1.0 pF  
Capacitor, 1000 pF  
Capacitor, 10 ohms  
Resistor, 1200 Ohm  
Resistor, 1300 Ohm  
Capacitor, 100 ohms  
Transistor  
ATC  
ATC800A330JT250  
UMK325C7106MM-T  
ATC800A1R0BT250  
ECJ-1VB1H102K  
ERJ-8GEYJ100V  
ERJ-3GEYJ122V  
ERJ-3GEYJ132V  
ERJ-8GEYJ101V  
BCP56  
Taiyo Yuden  
ATC  
C801, C802, C803  
R101, R102, R805  
R801  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Panasonic Electronic Components  
Infineon Technologies  
Bourns Inc.  
R802  
R803, R804  
S1  
S2  
Potentiometer, 2k W  
Voltage Regulator  
3224W-1-202E  
LM7805  
S3  
Texas Instruments  
Output  
C201, C202, C203,  
C204, C205, C206,  
C207, C208  
Capacitor, 10 µF  
Taiyo Yuden  
UMK325C7106MM-T  
C209, C210  
C211, C212, C213  
C214  
Capacitor, 220 µF  
Capacitor, 0.3 pF  
Capacitor, 33 pF  
Panasonic Electronic Components  
EEE-FP1V221AP  
ATC800A0R3BT250  
ATC800A330JT250  
ATC  
ATC  
Data Sheet  
6 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC  
Package Outline Specifications  
Package H-37248G-4/2  
21.72  
[.855]  
D
45° x 0.64  
[.025]  
3.00  
[.118]  
2X  
50°  
C
L
2X 2.29  
[.090]  
4X 3.49±0.20  
[.138±.008]  
V
V
D
G
(16.76  
[.660])  
9.78  
[.385]  
C
L
C
L
+0.38  
4X R0.51  
-0.13  
+.015  
-.005  
R.020  
[
]
C
L
2X 15.72  
[.619]  
3.76±0.25  
[.148±.010]  
19.81±0.20  
[.780±.008]  
SPH 1.57  
[.062]  
1.02  
[.040]  
H-37248G-4/2_sl_01_04-17-2013  
S
20.57  
[.810]  
Diagram Notes—unless otherwise specified:  
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.  
2. Primary dimensions are mm. Alternate dimensions are inches.  
3. All tolerances 0.127 [.005] unless specified otherwise.  
4. Pins: D – drain; G – gate; S – source; V – VDD.  
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].  
6. Gold plating thickness: 1.14 0.38 micron [45 15 microinch].  
Find the latest and most complete information about products and packaging at the Infineon Internet page  
http://www.infineon.com/rfpower  
Data Sheet  
7 of 8  
Rev. 02.1, 2016-06-22  
PXFC191507FC V1  
Revision History  
Revision  
Date  
Data Sheet Type  
Advance  
Page  
Subjects (major changes since last revision)  
01  
02  
2014-04-11  
2014-08-26  
All  
Data Sheet reflects advance specification for product development  
Production  
All  
All  
Data Sheet reflects released product specification  
Revised all data and includes final specs, typical performance graphs, loadpull, reference circuit  
02.1  
2016-06-22  
Production  
2
Updated ordering information  
We Listen toYour Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to:  
highpowerRF@infineon.com  
To request other information, contact us at:  
+1 877 465 3667 (1-877-GO-LDMOS) USA  
or +1 408 776 0600 International  
Edition 2016-06-22  
Published by  
Infineon Technologies AG  
85579 Neubiberg, Germany  
© 2014 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.  
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the  
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com/rfpower).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of In-  
fineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device  
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Data Sheet  
8 of 8  
Rev. 02.1, 2016-06-22  
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