F-214
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0,80 mm) .0315"
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Board Mates:
QSE
Standard stack heights
from 5 mm to 25 mm
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Cable Mates:
EQCD, EQDP, EQRF
(See Also Available note)
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
11.6 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
QTE/QSE
Type
5 mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
9 GHz / 18 Gbps
14 GHz / 28 Gbps
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles: 100
–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
RoHS Compliant: Yes
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
LEAD
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
TYPE
QTE
A
For applications requiring
more than two connectors per
board contact ipg@samtec.com
STYLE
RECOGNITIONS
Specify
LEAD
STYLE
from
–K
For complete scope
of recognitions see
www.samtec.com/quality
= (7,00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–020, –040, –060
–F
–D
(40 total pins per bank = –D)
= Gold Flash
= Single-Ended
on Signal Pins and
Ground Plane,
Matte Tin on tails
chart
–014, –028, –042
–D–DP
= Differential Pair
(–01 only)
(14 pairs per bank = –D–DP)
FILE NO: 090871_0_000
–TR
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
ALSO AVAILABLE
–L
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(MOQ Required)
–D = (No. of Positions per Row/20)
x (20,00) .7875
QTE
LEAD
STYLE
HEIGHT
WITH
QSE*
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
A
(20,00) .7875
01
–L
(4,27) (5,00)
.168 .197
–C*
–01
–02
–03
–04
–05
–07
= Latching
Option
(5,97)
.235
(7,11)
.280
= Electro-Polished
Selective
(7,26) (8,00)
.286 .315
(N/A on –042 &
–060 positions)
50µ" (1,27 µm) min
Au over 150µ"
(10,27) (11,00)
.404 .433
02
(0,80)
.0315
(0,20)
.008
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
(15,25) (16,00)
.600 .630
(18,26) (19,00)
.718 .748
A
(24,24) (25,00)
.954 .984
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Guide Posts, Screw Down
& Friction Lock
• Retention Option
Contact Samtec.
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
*Processing conditions
will affect mated height.
(0,76)
.030
OTHER
SOLUTIONS
*Note: –C Plating passes
10 year MFG testing
(0,64)
.025
(0,89)
.035 DIA
Note: Some lengths, styles
and options are non-standard,
non-returnable.
• Board Spacing Standoffs.
See SO Series
–L
WWW.SAMTEC.COM
