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VUB135-22NO1

型号:

VUB135-22NO1

品牌:

LITTELFUSE[ LITTELFUSE ]

页数:

7 页

PDF大小:

464 K

VUB135-22NO1  
3~  
Rectifier  
Brake  
Chopper  
High Voltage Standard Rectifier Module  
VRRM  
V V  
CES  
= 2200  
= 1700 V  
A
A
IDAV  
150  
IC25  
113 A  
=
=
=
=
V
1.9  
IFSM  
1100  
VCE(sat)  
3~ Rectifier Bridge + Brake Unit + NTC  
Part number  
VUB135-22NO1  
Backside: isolated  
24+25  
29  
30  
45+46  
NTC  
~14+15  
~10+11  
~ 6+7  
3
21+22  
41 40 48+49  
E2-Pack  
Features / Advantages:  
Applications:  
Package:  
Package with DCB ceramic  
Improved temperature and power cycling  
Planar passivated chips  
Very low forward voltage drop  
Very low leakage current  
NTC  
3~ Rectifier with brake unit  
for drive inverters  
Isolation Voltage:  
Industry standard outline  
RoHS compliant  
Soldering pins for PCB mounting  
Height: 17 mm  
Base plate: Copper  
internally DCB isolated  
V~  
3600  
Advanced power cycling  
Phase Change Material available  
Terms and Conditions of Usage  
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and  
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The  
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns  
the specific application of your product, please contact your local sales office.  
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.  
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend  
- to perform joint risk and quality assessments;  
- the conclusion of quality agreements;  
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Ratings  
Rectifier  
Symbol  
VRSM  
Definition  
Conditions  
min. typ. max. Unit  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 150°C  
TVJ = 25°C  
2300  
2200  
100  
2
V
V
max. non-repetitive reverse blocking voltage  
max. repetitive reverse blocking voltage  
VRRM  
IR  
reverse current  
VR =2200 V  
µA  
mA  
V
VR =2200 V  
IF = 50 A  
IF = 150 A  
IF = 50 A  
IF = 150 A  
TC = 105°C  
rectangular  
forward voltage drop  
1.20  
1.68  
1.13  
1.74  
150  
VF  
V
TVJ  
=
°C  
V
125  
V
bridge output current  
TVJ = 150°C  
TVJ = 150°C  
A
IDAV  
d =  
0.79  
V
VF0  
threshold voltage  
slope resistance  
for power loss calculation only  
6.4 mΩ  
0.5 K/W  
K/W  
rF  
thermal resistance junction to case  
thermal resistance case to heatsink  
RthJC  
RthCH  
Ptot  
0.1  
TC = 25°C  
TVJ = 45°C  
VR = 0 V  
250  
1.10  
1.19  
935  
W
kA  
kA  
A
total power dissipation  
max. forward surge current  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
VR = 400 V; f = 1 MHz  
IFSM  
TVJ = 150°C  
VR = 0 V  
1.01  
kA  
value for fusing  
TVJ = 45°C  
VR = 0 V  
I²t  
6.05 kA²s  
5.89 kA²s  
4.37 kA²s  
4.25 kA²s  
pF  
TVJ = 150°C  
VR = 0 V  
TVJ = 25°C  
37  
CJ  
junction capacitance  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Ratings  
Brake IGBT + Diode  
Symbol  
VCES  
Definition  
Conditions  
min. typ. max. Unit  
collector emitter voltage  
TVJ  
=
25°C  
1700  
V
V
max. DC gate voltage  
20  
30  
VGES  
VGEM  
IC25  
max. transient gate emitter voltage  
collector current  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
TVJ = 25°C  
TVJ = 125°C  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 125°C  
113  
A
80  
A
IC80  
total power dissipation  
445  
W
V
P
tot  
collector emitter saturation voltage  
IC = 75 A; VGE = 15 V  
1.9 2.13  
2.8  
VCE(sat)  
V
gate emitter threshold voltage  
collector emitter leakage current  
IC = 3 mA; VGE = VCE  
VCE = VCES; VGE = 0 V  
5.2  
5.8  
6.4  
V
VGE(th)  
ICES  
0.6 mA  
mA  
0.6  
gate emitter leakage current  
total gate charge  
VGE = 20 V  
400  
nA  
nC  
ns  
IGES  
VCE = 900 V; V = 15 V; IC = 75 A  
GE  
850  
250  
70  
QG(on)  
td(on)  
tr  
turn-on delay time  
current rise time  
ns  
inductive load  
TVJ = 125°C  
turn-off delay time  
670  
420  
29  
ns  
td(off)  
tf  
VCE =900 V; IC = 75 A  
VGE = 15 V; RG = 18 Ω  
current fall time  
ns  
turn-on energy per pulse  
turn-off energy per pulse  
reverse bias safe operating area  
mJ  
mJ  
Eon  
17  
Eoff  
VGE = 15 V; RG = 18 Ω  
TVJ = 125°C  
TVJ = 125°C  
RBSOA  
ICM  
VCEK = 1700 V  
150  
10  
A
short circuit safe operating area  
short circuit duration  
SCSOA  
tSC  
VCEK = 1700 V  
VCE = 900 V; V = 15 V  
GE  
µs  
A
short circuit current  
RG = 18 ; non-repetitive  
340  
ISC  
thermal resistance junction to case  
thermal resistance case to heatsink  
0.28 K/W  
K/W  
RthJC  
RthCH  
0.10  
Brake Diode  
max. repetitive reverse voltage  
TVJ = 25°C  
TC = 25°C  
1700  
75  
V
A
A
V
V
VRRM  
IF25  
IF80  
VF  
forward current  
forward voltage  
reverse current  
50  
TC = 80°C  
TVJ = 25°C  
TVJ = 125°C  
TVJ = 25°C  
TVJ = 125°C  
IF = 60 A  
3.05  
2.20  
V = VRRM  
R
0.1 mA  
IR  
6
mA  
µC  
A
reverse recovery charge  
VR = 900 V  
-diF /dt = 1000A/µs  
IF = 60A  
18  
70  
Qrr  
max. reverse recovery current  
reverse recovery time  
TVJ = 125°C  
IRM  
900  
8
ns  
trr  
reverse recovery energy  
mJ  
Erec  
RthJC  
RthCH  
thermal resistance junction to case  
thermal resistance case to heatsink  
0.65 K/W  
K/W  
0.25  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Ratings  
Package E2-Pack  
Symbol  
IRMS  
Definition  
Conditions  
min. typ. max. Unit  
per terminal  
40  
150  
125  
125  
A
°C  
°C  
°C  
g
RMS current  
-40  
-40  
-40  
TVJ  
virtual junction temperature  
Top  
operation temperature  
storage temperature  
Tstg  
176  
Weight  
MD  
3
6
Nm  
mounting torque  
terminal to terminal  
terminal to backside  
6.0  
12.0  
mm  
mm  
V
dSpp/App  
dSpb/Apb  
creepage distance on surface | striking distance through air  
t = 1 second  
3600  
3000  
V
isolation voltage  
ISOL  
50/60 Hz, RMS; IISOL 1 mA  
t = 1 minute  
V
2D Data Matrix  
XXXXXXXXXX yywwx  
Logo  
UL Part number Date Code Location  
Ordering  
Standard  
Ordering Number  
Marking on Product  
VUB135-22NO1  
Delivery Mode  
Quantity Code No.  
VUB135-22NO1  
Box  
6
503948  
105  
Temperature Sensor NTC  
Symbol Definition  
Conditions  
min. typ. max. Unit  
104  
resistance  
TVJ = 25°  
4.75  
5
5.25  
kΩ  
R25  
R
temperature coefficient  
3375  
K
B25/50  
[ ]  
103  
TVJ = 150°C  
Equivalent Circuits for Simulation  
* on die level  
Rectifier  
V0  
102  
I
R0  
0
25  
50  
75  
100 125 150  
TC [°C]  
threshold voltage  
slope resistance *  
0.79  
3.3  
V
V0 max  
R0 max  
Typ. NTC resistance vs. temperature  
mΩ  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Outlines E2-Pack  
D
A
3,5 0,5  
Ø 6  
Vor der Montage typ. 100 µm konvex über 75 mm  
Before mounting typ. 100 µm convex over 75 mm  
Detail C  
Detail D  
Ø 2,5-0,3  
Detail A  
Ø 2,1-0,3  
1,5 +0,3  
0,8 0,2  
15° 1°  
1,2 0,05  
93 0,2  
79,2  
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26  
45  
46  
47  
25  
15.24  
11,.43  
24  
23  
0
48  
49  
50  
22  
21  
7,.62  
Index  
11,.43  
20  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19  
C
0
107,5 0,3  
Bemerkung / Note:  
- Nichttolerierte Maße nach / Measure without tolerances according DIN ISO 2768-T1-m  
- PCB-Lochmuster / PCB hole pattern: see pin position  
- Toleranz Pin-Position und PCB-Lochmuster /Tolerance of pin position and PCB hole pattern:  
- Montageanleitung / Mounting instruction: www.ixys.com Application note IXAN0024  
0.1  
Detail A: PCB-Montage / Mounting on PCB  
- Empfohlene, selbstschneidende Schraube /Recommended, self-tapping screw:EJOT PT® (Größe / size: K25)  
- Max. Schraubenlänge / Max. screw length: PCB-Dicke / thickness + 6 mm (max. Lochtiefe / hole depth)  
- Empfohlenes Drehmoment /Recommended mounting torque:1.5 Nm  
24+25  
29  
NTC  
30  
45+46  
~14+15  
~10+11  
~ 6+7  
3
21+22  
41 40 48+49  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Rectifier  
900  
800  
700  
600  
500  
400  
104  
200  
TVJ = 125°C  
TVJ 25°C  
=
TVJ= 45°C  
TVJ = 45°C  
150  
I2t  
[A2s]  
IF  
IFSM  
[A]  
TVJ= 150°C  
100  
[A]  
50  
TVJ = 150°C  
50Hz, 80% VRRM  
103  
0
0.001  
0.01  
0.1  
1
1
2
3
4
5 6 7 8 10  
0.0  
0.5  
1.0  
1.5  
[V]  
2.0  
V
t [s]  
t [ms]  
Fig. 3 I2t vs. time per diode  
F
Fig. 1 Forward current vs.  
voltage drop per diode  
Fig. 2 Surge overload current  
vs. time per diode  
140  
DC =  
1
RthA:  
80  
60  
40  
20  
0
0.1 K/W  
0.3 K/W  
0.6 K/W  
1.0 K/W  
1.5 K/W  
2.5 K/W  
DC =  
1
120  
100  
80  
60  
40  
20  
0
0.5  
0.4  
0.5  
0.33  
0.17  
0.08  
0.4  
0.33  
0.17  
0.08  
IdAV  
[A]  
Ptot  
[W]  
0
10 20 30 40 50 60 70  
0
20 40 60 80 100 120 140 160  
0
25 50 75 100 125 150  
IdAVM [A]  
Tamb [°C]  
TC [°C]  
Fig. 4 Power dissipation vs. forward current  
and ambient temperature per diode  
Fig. 5 Max. forward current vs.  
case temperature per diode  
0.6  
0.5  
0.4  
Constants for ZthJC calculation:  
ZthJC  
i
Rth (K/W)  
ti (s)  
[K/W]  
0.2  
1
2
3
4
5
0.040  
0.003  
0.140  
0.120  
0.197  
0.004  
0.010  
0.030  
0.300  
0.080  
0.1  
0.0  
1
10  
100  
1000  
10000  
t [s]  
Fig. 6 Transient thermal impedance junction to case vs. time per diode  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
VUB135-22NO1  
Brake IGBT + Diode  
VGE = 19 V  
VCE = 20 V  
140  
120  
100  
80  
140  
120  
100  
140  
120  
100  
80  
13 V  
17 V  
15 V  
25°C  
11 V  
125°C  
TVJ = 125°C  
IC  
IC  
IC  
[A]  
80  
[A]  
[A]  
60  
40  
20  
0
60  
60  
9 V  
40  
20  
0
40  
125°C  
25°C  
20  
0
6
7
8
9
10 11 12 13  
0
1
2
3
0
1
2
3
4
VCE [V]  
Fig.1 Output characteristics IGBT  
VCE [V]  
VGE [V]  
Fig. 3 Typ. transfer charact.  
IGBT  
Fig.2 Typ. output characteristics  
IGBT  
120  
100  
80  
80  
60  
400  
40  
30  
800  
RG = 18 Ohm  
VCE = 900 V  
25°C  
VGE  
= 15 V  
td(off)  
TVJ = 125°C  
300  
600  
td(on)  
125°C  
Eoff  
t
Eon  
40  
[mJ]  
tr  
200  
tf  
IF  
60  
40  
20  
0
20  
400  
[ns]  
[A]  
[ns]  
[mJ]  
tr  
20  
0
100  
10  
0
200  
RG = 18 Ohm  
VCE = 900 V  
VGE  
= 15 V  
Eon  
Eoff  
TVJ = 125°C  
0
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0  
0
40  
80  
120  
160  
0
40  
80  
120  
160  
IC [A]  
IC [A]  
VF [V]  
Fig. 6 Typ. forward characteristics  
Diode  
Fig. 4 Typ. turn-on energy & switch.  
times vs. collector current  
Fig. 5 Typ. turn-off energy & switch.  
times vs. collector current  
1
10  
200  
TVJ = 125°C  
RG =18 Ohm  
10  
8
100  
VR = 900 V  
VR = 900 V  
TVJ = 125°C  
Erec  
IF  
= 60 A  
Diode  
8
Erec  
6
160  
120  
80  
Irr  
Irr  
60  
ZthJC  
[K/W]  
Erec  
6
[mJ]  
IGBT  
[A]  
Irr  
[mJ]  
4
80  
4
2
0
40  
20  
0
[A]  
Diode  
IGBT  
Erec  
Irr  
0.1  
Ri  
t
i
Ri  
ti  
2
0
40  
0
0.010 0.001  
0.050 0.001  
0.240 0.021  
0.350 0.090  
0.010 0.001  
0.030 0.008  
0.120 0.045  
0.070 0.100  
1
10  
100  
1000 10000  
0
20 40 60 80 100 120 140  
10  
20  
30  
40  
50  
IF [A]  
RG [Ohm]  
t [ms]  
Fig. 8 Typ. reverse recovery  
characteristics Diode  
Fig. 9 Transient thermal  
resistance junction to case  
Fig. 7 Typ. reverse recovery  
characteristics Diode  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20180615f  
© 2018 IXYS all rights reserved  
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