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IXGR35N120BD1

型号:

IXGR35N120BD1

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

521 K

Advanced Technical Information  
IXGR 35N120BD1  
High Voltage IGBT  
with Diode  
VCES  
IC25  
= 1200 V  
= 54 A  
(Electrically Isolated Back Surface)  
VCE(sat) = 3.5 V  
tfi(typ)  
= 160 ns  
ISOPLUS247(IXGR)  
Symbol  
TestConditions  
Maximum Ratings  
VCES  
VCGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGE = 1 MΩ  
1200  
1200  
V
V
VGES  
VGEM  
Continuous  
Transient  
20  
30  
V
V
(TAB)  
G
C
E
IC25  
IC110  
TC = 25°C  
TC = 110°C  
54  
28  
A
A
IF110  
T
= 110°C  
8
A
A
ICM  
TCC = 25°C, 1 ms  
200  
G = Gate  
C = Collector  
TAB = Electrically  
Isolated  
E = Emitter  
SSOA  
V
= 15 V, TJ = 125°C, RG = 10 Ω  
ICM = 120  
A
(RBSOA)  
CGlaE mped inductive load  
@0.8 VCES  
Features  
PC  
TC = 25°C  
250  
W
z
Silicon chip on DCB substrate  
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
IGBT and anti-parallel FRED for  
resonant power supplies  
- Induction heating  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
z
VISOL  
50/60 Hz, RMS, t = 1 min  
ISOL = 1mA, t = 1 s  
2500  
3000  
V~  
V~  
- Rice cookers  
FC  
Mounting force  
22...130/5...29  
300  
N/lb  
z
z
MOS Gate turn-on  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
°C  
- drive simplicity  
Fast Recovery Expitaxial Diode (FRED)  
- soft recovery with low IRM  
Weight  
6
g
Advantages  
Symbol  
TestConditions  
Characteristic Values  
min. typ. max.  
z
Saves space (two devices in one  
(TJ = 25°C, unless otherwise specified)  
VGE(th)  
ICES  
package)  
IC = 250 µA, VCE = VGE  
2.5  
5.0  
V
z
Easy to mount  
z
VCE = V  
T=25°C  
50 µA  
Reduces assembly time and cost  
VGE = 0CVES  
T=125°C  
250 µA  
IGES  
VCE = 0 V, VGE = 20 V  
100 nA  
VCE(sat)  
IC  
= 35A, VGE = 15 V  
2.8  
3.5  
V
Note 2  
© 2004 IXYS All rights reserved  
DS99204(09/04)  
IXGR 35N120BD1  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
ISOPLUS247 Outline  
IC = 35A; VCE = 10 V,  
Note 2.  
28  
38  
S
Cies  
Coes  
Cres  
2300  
190  
80  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
Qg  
Qge  
Qgc  
140  
20  
50  
nC  
nC  
nC  
IC = 40A, VGE = 15 V, VCE = 0.5 VCES  
td(on)  
40  
ns  
Inductive load, TJ = 25°C  
IC = 35 A; VGE = 15 V  
VCE = 0.8 VCES; RG = Roff = 3 Ω  
Note 1.  
tri  
50  
ns  
Eon  
0.9  
mJ  
td(off)  
tfi  
Eoff  
270  
160  
3.8  
500 ns  
300 ns  
7.0 mJ  
td(on)  
tri  
Eon  
td(off)  
tfi  
45  
60  
1.9  
380  
400  
8.0  
ns  
ns  
mJ  
ns  
ns  
mJ  
Inductive load, TJ = 125°C  
IC = 35A; VGE = 15 V  
VCE = 0.8 VCES; RG = Roff = 3 Ω  
Note 1  
Eoff  
RthJC  
RthCK  
0.5 K/W  
K/W  
0.25  
ReverseDiode(FRED)  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Symbol  
VF  
TestConditions  
I = 10 A, VGE = 0 V  
3.3  
2.2  
V
V
IFF = 10 A, VGE = 0 V, TJ = 125°C  
IRM  
trr  
IF = 10 A; -diF/dt = 100 A/µs, VR = 100 V  
VGE = 0 V; TJ = 125°C  
4.0  
190  
A
ns  
trr  
IF = 1 A; -diF/dt = 100 A/µs; VR = 30 V, VGE = 0 V  
40  
ns  
RthJC  
2.5 K/W  
Notes: 1. Switching times may increase for VCE (Clamp) > 0.8 • VCES, higher TJ  
or increased RG.  
2. Pulse test, t 300 µs, duty cycle d 2 %.  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
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