(3/6)
Conformity to RoHS Directive
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA2010 Type
FEATURES
MATERIAL CHARACTERISTICS
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
Y material: High frequency range type intended for the 100MHz
region and above.
APPLICATIONS
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
MZA 2010 D 121 C
T
(1) (2) (3) (4) (5) (6)
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
TYPICAL MATERIAL CHARACTERISTICS
2000
D
1800
1600
HANDLING AND PRECAUTIONS
Y
1400
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
1200
1000
F
S
800
600
400
200
0
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
B
10
100
Frequency(MHz)
1000
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-03 / 20110509 / e9421_mza
