IXFN50N120SiC
preliminary
MOSFET
Ratings
min. typ. max.
1200
Symbol Definitions
Conditions
drain source breakdown voltage
VDSS
VGS = 0 V, ID = 200µA
V
max transient gate source voltage
continous gate source voltage
VGSM
VGS
-10
-5
+25
+20
V
V
recommended operational value
VGS = 20 V
drain current
ID25
ID80
ID100
TC = 25°C
TC = 80°C
TC = 100°C
47
35
30
A
A
A
static drain source on resistance
gate threshold voltage
RDSon
VGS(th)
IDSS
ID = 40 A; VGS = 20 V
ID = 10 mA; VGS = VDS
VDS = 1200 V; VGS = 0 V
VDS = 0 V; VGS = 20 V
TVJ = 25°C
TVJ = 150°C
40
75
50
mΩ
mΩ
TVJ = 25°C
TVJ = 150°C
2.0
2.6
2.1
4.0
V
V
drain source leakage current
TVJ = 25°C
TVJ = 150°C
2
20
200
µA
µA
gate source leakage current
internal gate resistance
IGSS
RG
TVJ = 25°C
0.5
4.8
µA
Ω
input capacitance
output capacitance
reverse transfer (Miller) capacitance
Ciss
Coss
Crss
1900
160
13
pF
pF
pF
VDS = 1000 V; VGS = 0 V; f = 1 MHz TVJ = 25°C
VDS = 800 V; ID = 40 A; VGS = 0/20 V TVJ = 25°C
total gate charge
gate source charge
gate drain (Miller) charge
Qg
Qgs
Qgd
100
22
36
nC
nC
nC
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
reverse recovery losses at turn-off
td(on)
tr
td(off)
tf
Eon
Eoff
Erec(off)
23
9
75
ns
ns
ns
Inductive switching
VDS = 800 V; ID = 40 A
TVJ = 25°C
19
ns
VGS = -5 / 20 V; RG = 10 Ω (external)
1.08
0.29
0.04
mJ
mJ
mJ
Freewheeling diode is Mosfet's body diode
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
reverse recovery losses at turn-off
td(on)
tr
td(off)
tf
Eon
Eoff
Erec(off)
23
9
100
22
1.48
0.35
0.10
ns
ns
ns
Inductive switching
VDS = 800 V; ID = 40 A
VGS = -5 / 20 V; RG = 10 Ω (external)
Freewheeling diode is Mosfet's body diode
TVJ = 150°C
ns
mJ
mJ
mJ
thermal resistance junction to case
thermal resistance junction to heatsink
RthJC
RthJH
0.55
K/W
K/W
with heatsink compound; IXYS test setup
0.62
Source-Drain Diode
Symbol Definitions
Ratings
Conditions
min. typ. max.
forward voltage drop
VSD
IF = 40 A; VGS = -5 V
TVJ = 25°C
TVJ = 150°C
5.2
4.6
V
V
reverse recovery time
trr
QRM
IRM
16
330
35
ns
nC
A
VGS = -5 V; IF = 40 A; VR = 800 V
Mosfet gate drive:
VGS = -5 / 20 V; RG = 10 Ω
TVJ = 25°C
reverse recovery charge (intrinsic diode)
max. reverse recovery current
current slew rate
dIF/dt
4800
A/µs
reverse recovery time
trr
QRM
IRM
26
810
45
ns
nC
A
VGS = -5 V; IF = 40 A; VR = 800 V
Mosfet gate drive:
VGS = -5 / 20 V; RG = 10 Ω
TVJ = 150°C
reverse recovery charge (intrinsic diode)
max. reverse recovery current
current slew rate
dIF/dt
4600
A/µs
Note:
When using SiC Body Diode the maximum recommended VGS = -5V
IXYS reserves the right to change limits, test conditions and dimensions.
20180223b
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