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NXQ1TXA5/404J

型号:

NXQ1TXA5/404J

品牌:

NXP[ NXP ]

页数:

15 页

PDF大小:

143 K

NXQ1TXA5  
One-chip 5 V Qi wireless transmitter  
Rev. 1.2 — 10 September 2015  
Product short data sheet  
1. General description  
The NXQ1TXA5 is a controller/driver IC for a 5 V Qi-certified/compliant low-power  
wireless charger. It offers a fully integrated solution that includes a 5 V full-bridge power)  
stage, as defined in Wireless Power Consortium (WPC) 5 V Qi standards A5, A11, A12  
and A16.  
The NXQ1TXA5 uses dedicated analog ping circuitry to detect devices, according to the  
Qi standard, achieving extremely low standby power consumption. If a Qi-compliant  
receiver is detected, the NXQ1TXA5 starts to communicate with it. If the receiver is  
recognized, it safely initiates wireless power transfer from the transmitter to the receiver,  
while monitoring for fault conditions such as overheating or interference from metal  
objects. The device is optimized to operate from a USB power supply and uses Smart  
Power Limiting (SPL) to adjust the output power automatically to compensate for  
power-limited supplies. The device supports Foreign Object Detection (FOD).  
LED outputs and a buzzer output are available for the user interface. The LED outputs  
feature a number of blinking modes. Static Power Reduction (SPR) allows multiple  
NXQ1TXA5-based transmitters to operate from a single USB power supply by limiting  
power consumption per device.  
The NXQ1TXA5 is available in a 5 mm 5 mm, 32-pin HVQFN package.  
2. Features and benefits  
One-chip WPC 1.1.2 Qi-compliant device for A5/A11/A12/A16 5 V single-coil  
low-power transmitter  
Operates from 5 V supply  
Integrated high-efficiency full-bridge power stage with low EMI radiation meeting  
EN55022 radiated and conducted emission limits  
Very few external components required, minimizing cost and board space  
Extremely low-power receiver detection circuitry; standby power 10 mW (typical)  
Power stage fully protected against overcurrents and overtemperature  
Fully integrated accurate coil current measurement  
Demodulates and decodes communication packages from Qi-compliant receivers  
PID regulation for closed-loop power drive and control  
Internal 1.8 V digital supply generation  
LED (2) and buzzer outputs  
NTC input for external temperature check and protection  
On-chip thermal protection  
Small HVQFN 32-pin package (5 5 mm) with 0.5 mm pitch  
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
FOD with automatic switching between V1.1 and V1.0 for legacy receiver support  
FOD levels can be adjusted using external resistors to compensate for application  
differences to meet Qi certification requirements  
Smart Power Limiting (SPL) function to adapt to power-limited 5 V supplies  
Static Power Reduction (SPR) function to limit power consumption  
Supports Near Field Communication (NFC) TAG applications with delayed start-up  
3. Applications  
Wireless Power Consortium (WPC) certified/compliant Qi wireless power transmitters  
4. Quick reference data  
Table 1.  
Symbol  
VDDP  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
power supply voltage  
power supply current  
on pins VDDP1 and VDDP2  
on pins VDDP1 and VDDP2  
Ping mode (average current)  
Power_Transfer mode (no load)  
Power_Transfer mode (with load)  
3.5  
-
5.25  
V
IDDP  
-
-
-
2
2.8  
-
mA  
mA  
A
15  
-
5
5. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
NXQ1TXA5  
HVQFN32  
plastic thermal enhanced very thin quad flat package; no leads;  
SOT617-3  
32 terminals; body 5 5 0.85 mm  
5.1 Ordering options  
Table 3.  
Ordering options  
Type number Orderable part  
number  
Package  
Packing method  
Minimum  
ordering quantity  
Temperature  
NXQ1TXA5  
NXQ1TXA5/404J  
HVQFN32 reel 7" Q1/T1,  
*standard mark SMD  
1500  
Tamb = 20 C to +85 C  
non-dry-pack  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
2 of 15  
 
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
6. Block diagram  
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Fig 1. Block diagram  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
3 of 15  
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
7. Pinning information  
7.1 Pinning  
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For enhanced thermal and electrical performance the exposed die-pad, and pins GNDP. GNDD  
must be connected to top layer board ground, and exposed die-pad must also be connected to  
bottom layer board ground with plated-through vias (see Section 12.4)  
Fig 2. Pin configuration  
7.2 Pin description  
Table 4.  
Symbol  
SPR1  
Pin description[1]  
Pin  
1
Type Description  
I
static power reduction 1  
SPR2  
2
I
static power reduction 2  
SDA  
3
I/O  
I2C-bus data input/output; should be left open or grounded under  
normal operating conditions (I2C-bus included for test purposes)  
SCL  
4
I
I2C-bus clock input; should be left open or grounded under normal  
operating conditions (I2C-bus included for test purposes)  
BUZZER  
NFC_FD  
LED_G  
LED_R  
FOD1  
5
O
I
buzzer output  
6
NFC field detect input (active LOW)  
green LED output  
7
O
O
I
8
red LED output  
9
FOD level configuration  
FOD2  
10  
11  
12  
13  
14  
I
FOD loss configuration 1  
FOD3  
I
FOD loss configuration 2  
CONFIG  
NTC  
I
LED and buzzer configuration  
temperature measurement using NTC  
standby function; connect to ground when not used  
I
STBY  
I
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
4 of 15  
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
Table 4.  
Pin description[1] …continued  
Symbol  
VDDP2  
OUT2  
Pin  
Type Description  
15, 16  
17, 18  
P
power supply pin 2  
O
transmitter output 2  
power ground  
GNDP[1]  
19, 20, P  
21, 22  
OUT1  
23, 24  
25, 26  
27  
O
P
transmitter output 1  
power supply pin 1  
digital ground  
VDDP1  
GNDD[1]  
CDEC  
P
28  
P
decoupling connection for internal LDO  
crystal input  
XTAL_IN  
29  
I
XTAL_OUT 30  
O
I/O  
O
crystal output  
TEST  
31  
32  
test pin; connect to ground  
NFC disable function  
NFC_DIS  
[1] For enhanced thermal and electrical performance, the exposed die-pad, and pins GNDP. GNDD must be  
connected to top layer board ground. The exposed die-pad must also be connected to bottom layer board  
ground with plated-through vias (see Section 12.4).  
8. Functional description  
8.1 Device operation  
The NXQ1TXA5 is a 5 V wireless charger with an integrated full-bridge power stage. It  
integrates all the functions required to control the power transfer between a  
WPC-compliant Qi transmitter and a WPC-compliant Qi receiver efficiently. It can deliver  
up to 8 W continuous power into the WPC-compliant Qi type A5, A11, A12 or A16  
transmitter coil.  
A block diagram of the NXQ1TXA5 is shown in Figure 1. It is operational when a 5 V  
supply is connected and pin STBY is LOW. Internal 1.8 V biasing is activated and the  
NXQ1TXA5 starts checking for a device on the transmitter base station. Power  
consumption is extremely low (typically 10 mW) during this phase. When a device is  
detected, the low-power DSP core starts up and sets up communications with the  
detected device. Power transfer is initiated if the device is identified as a WPC-compliant  
Qi receiver. The NXQ1TXA5 ensures that the correct power transfer level is maintained  
with frequency and duty cycle control according to the WPC Qi specifications.  
The power transfer can be monitored via the LED and BUZZER outputs. The external  
temperature can be monitored via the NTC input to protect the application from  
overheating when charging Qi-V1.0 receivers that do not support Foreign Object  
Detection (FOD).  
Additional inputs are provided to select the LED mode, configure FOD according to the  
application design and coil/capacitor selection, set the SPR level and enable/disable SPL.  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
5 of 15  
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
8.2 Protection mechanisms  
The following protection circuits are included in the NXQ1TXA5:  
OverTemperature Protection (OTP)  
OverCurrent Protection (OCP)  
Foreign Object Detection (FOD)  
Negative Temperature Coefficient (NTC)  
8.2.1 OverTemperature Protection (OTP)  
8.2.1.1 Software OTP  
A temperature protection circuit embedded in the NXQ1TXA5 keeps track of the  
temperature inside the device. If the temperature exceeds 110 C, the output power is  
limited to prevent the device from being damaged. Normal power transfer is resumed  
when the temperature drops below 80 C.  
8.2.1.2 Hardware OTP  
Additional hardware OTP is triggered when the junction temperature exceeds the  
temperature protection threshold of between 125 C and 140 C. When this happens, the  
output stages are set floating. Because the software OTP mechanism reacts at lower  
temperatures, it is expected that this additional hardware OTP is only triggered under  
abnormal load conditions. It acts as an extra safety mechanism.  
8.2.2 OverCurrent Protection (OCP)  
In the NXQ1TXA5, the power stages are protected against excessive currents. If the  
output current exceeds the maximum OCP threshold of 5 A, the output current is limited  
by reversing the current in the output stage that is drawing excessive current.  
8.2.3 Foreign Object Detection (FOD)  
The NXQ1TXA5 features FOD functionality according to the Qi 1.1.2 standard. If the  
received power level reported by the receiver is not in line with the transmitted power level  
measured by the NXQ1TXA5, the NXQ1TXA5 switches to FOD mode.  
If the difference between reported (as perceived by the receiver) and transmitted power  
level is greater than the selected FOD threshold, the NXQ1TXA5 enters FOD mode. To  
avoid the heating up of metal objects placed between the transmitter and the receiver,  
power transfer is suspended in FOD mode.  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
6 of 15  
 
 
 
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
8.2.4 Negative Temperature Coefficient (NTC)  
The NTC input is used to monitor the voltage level on an external NTC resistor network.  
The NXQ1TXA5 stops delivering power if the input level on the NTC input pin drops below  
0.8 V and starts charging again when the level rises above 1.1 V again. The NXQ1TXA5  
automatically compensates for variations in the 5 V supply.  
If the NXQ1TXA5 detects a voltage level below 150 mV on the NTC input pin when  
charging starts, the temperature sensing function via the NTC is disabled completely.  
A standard NTC input resistor network does not reach levels below 150 mV for normal  
operation. So, disabling the NTC temperature protection function can be done by  
connecting the NTC input pin to ground. The NTC input pin can also be connected to  
VDDP. As the sensing function then remains active and the input voltage level never  
drops below 0.8 V, the NXQ1TXA5 power delivery is not stopped. Disabling the NTC  
temperature sensing by connecting the NTC pin to ground is easier for a PCB layout.  
The NTC input pin must always be connected to either the VDDP pin, ground, or the NTC  
network. It must never be left floating.  
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VDDP  
power supply voltage  
on pin VDDP1 and  
VDDP2  
0.3  
+6.0  
V
Tj  
junction temperature  
-
150  
+150  
+85  
+2  
C  
C  
C  
kV  
Tstg  
Tamb  
VESD  
storage temperature  
55  
20  
2  
ambient temperature  
electrostatic discharge voltage  
Human Body Model  
(HBM)  
Charge Device Model  
(CDM)  
500  
+500  
V
10. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Typ  
30  
Unit  
K/W  
thermal resistance from  
junction to ambient  
2-layer application board positioned  
horizontally in free air; dimensions  
45 mm 45 mm 0.8 mm; natural  
convection; copper coverage on each layer  
> 95 %; copper thickness each layer 70 m  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
7 of 15  
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
11. Characteristics  
Table 7.  
DC characteristics  
Tamb = 25 C, default settings unless otherwise specified  
Symbol  
VDDP  
IDDP  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
power supply voltage  
power supply current  
on pin VDDP1 and VDDP  
on pins VDDP1 and VDDP2:  
Ping mode (peak current)  
Ping mode (average current)  
Standby mode (STBY HIGH)  
Power_Transfer mode (no load)  
3.5  
-
5.25  
V
[1]  
[1]  
-
-
-
-
-
1
-
A
2
2.8  
30  
-
mA  
A  
mA  
A
2
[1]  
15  
-
Power_Transfer mode (average  
current with load)  
2
Power_Transfer mode (absolute  
peak current with load)  
-
-
5
A
[1] Current consumption in the NXQ1TXA5_SDS; no external load connected between terminals OUT1 and OUT2.  
Table 8.  
AC characteristics  
Tamb = 25 C, default settings unless otherwise specified  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
BTL power stage  
fsw  
switching frequency  
Start-up and Power_Transfer modes  
110  
-
205  
-
kHz  
Hz  
%
fsw(step)  
switching frequency step size Start-up and Power_Transfer modes  
-
500  
-
duty cycle  
Start-up and Power_Transfer modes  
Start-up and Power_Transfer modes  
0
50  
duty cycle step size  
-
0.1  
-
%
step  
STBY pin  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
Standby mode  
1.2  
-
-
-
VDDP  
0.6  
V
V
VIL  
Operating mode  
FOD1, FOD2, FOD3, CONFIG and NTC pins  
[1]  
[2]  
[2]  
VI  
input voltage  
operating range  
0
-
1.5  
V
LED_G, LED_R and NFC_DIS outputs  
VO  
output voltage  
load current  
set externally  
400  
-
-
-
VDDP  
20  
mV  
mA  
Iload  
open-drain output  
BUZZER output  
VO  
output voltage  
load current  
set externally  
400  
-
-
-
VDDP  
20  
mV  
mA  
Iload  
open-drain output  
NFC_FD, SPR1 and SPR2 pins  
VIH  
HIGH-level input voltage  
1
-
1.8  
-
VDDP  
0.6  
V
V
VIL  
LOW-level input voltage  
I2C pins: SCL and SDA  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
1
-
-
-
3.6  
0.6  
V
V
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
8 of 15  
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
Table 8.  
AC characteristics …continued  
Tamb = 25 C, default settings unless otherwise specified  
Symbol  
Oscillator: pins XTAL_IN and XTAL_OUT  
VI input voltage  
External crystal requirements  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
-
-
1.8  
V
fnom  
DL  
nominal frequency  
drive level  
32  
-
32.768 33.5  
kHz  
W  
pF  
-
1
[3]  
CL  
load capacitance  
8
12  
14  
[1] The nominal operating range is from 0 V to 1.5 V. However, any level between 1.5 V and VDDP has the same effect (as 1.5 V).  
[2] The output voltage at maximum load current is guaranteed not to exceed 400 mV.  
[3] The load capacitors are embedded in the NXQ1TXA5_SDS.  
12. Application information  
12.1 Crystal oscillator  
The NXQ1TXA5 uses an external low-cost 32.768 kHz crystal, with a 1 % accuracy. The  
crystal should support a load capacitance of 12 pF (the load capacitance is embedded  
in the NXQ1TXA5). Do not connect the crystal to the NXQ1TXA5 using vias, but directly  
on the top layer of the PCB. If possible, shield the crystal by connecting the casing to  
ground. The crystal is connected to the oscillator input pin (XTAL_IN) via a 2.2 pF series  
capacitor.  
12.2 Supply decoupling  
Effective supply decoupling is required. The decoupling capacitors must to be chosen  
such that the effective capacitance is at least 10 F at a DC bias voltage of 5.5 V and a  
frequency of 205 kHz for each supply pin. To improve HF behavior and reduce EMI,  
mount smaller (10 nF) high-quality capacitors in parallel with the larger capacitors.  
12.3 Snubber network  
Snubber RC networks are connected to outputs OUT1 and OUT2. Each snubber network  
consists of a 6.8 nF capacitor in series with a 1 resistor to ground (see Figure 3).  
12.4 Exposed die-pad ground and thermal connection  
For optimal thermal and electrical performance, the device bottom exposed die-pad  
MUST be soldered to a PCB solder land under the exposed die-pad. To have good  
electrical contact and thermal flow from the device to the bottom copper layer, the PCB  
solder land under the device MUST be connected with plated-through vias to the copper  
bottom layer of the PCB. In this way, the PCB bottom copper layer can provide heat  
sinking for the device dissipation.  
In the NXQ1TXA5 application note examples are provided for recommended layouts with  
good thermal and electrical performance.  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
9 of 15  
 
 
 
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
12.5 Application diagram  
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Fig 3. NXQ1TXA5 application diagram  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
10 of 15  
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
13. Package outline  
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Fig 4. Package outline SOT617-3 (HVQFN32)  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
11 of 15  
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
14. Revision history  
Table 9.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
NXQ1TXA5_SDS v.1.2  
Modifications:  
20150910  
Product data sheet  
-
NXQ1TXA5_SDS v.1.1  
Section 13 “Package outline” has been updated.  
NXQ1TXA5_SDS v.1.1  
NXQ1TXA5_SDS v.1  
20150909  
Product data sheet  
-
NXQ1TXA5_SDS v.1  
-
20150730  
Product data sheet  
-
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
12 of 15  
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
15.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
13 of 15  
 
 
 
 
 
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NXQ1TXA5_SDS  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product short data sheet  
Rev. 1.2 — 10 September 2015  
14 of 15  
 
 
NXQ1TXA5  
NXP Semiconductors  
One-chip 5 V Qi wireless transmitter  
17. Contents  
1
General description. . . . . . . . . . . . . . . . . . . . . . 1  
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
3
4
5
5.1  
6
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
8
8.1  
8.2  
8.2.1  
8.2.1.1  
8.2.1.2  
8.2.2  
8.2.3  
8.2.4  
Functional description . . . . . . . . . . . . . . . . . . . 5  
Device operation. . . . . . . . . . . . . . . . . . . . . . . . 5  
Protection mechanisms . . . . . . . . . . . . . . . . . . 6  
OverTemperature Protection (OTP) . . . . . . . . . 6  
Software OTP . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Hardware OTP . . . . . . . . . . . . . . . . . . . . . . . . . 6  
OverCurrent Protection (OCP) . . . . . . . . . . . . . 6  
Foreign Object Detection (FOD). . . . . . . . . . . . 6  
Negative Temperature Coefficient (NTC) . . . . . 7  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Thermal characteristics . . . . . . . . . . . . . . . . . . 7  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 8  
10  
11  
12  
Application information. . . . . . . . . . . . . . . . . . . 9  
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . 9  
Supply decoupling . . . . . . . . . . . . . . . . . . . . . . 9  
Snubber network . . . . . . . . . . . . . . . . . . . . . . . 9  
Exposed die-pad ground and thermal  
12.1  
12.2  
12.3  
12.4  
connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Application diagram . . . . . . . . . . . . . . . . . . . . 10  
12.5  
13  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V. 2015.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 10 September 2015  
Document identifier: NXQ1TXA5_SDS  
 
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