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WZ10150

型号：

WZ10150

品牌：

SEOUL[ Seoul Semiconductor ]

页数：

15 页

PDF大小：

366 K

下载PDF手册
XZ10150  
Z1  
Description  
Features  
• Super high Flux output  
and high Luminance  
Z-Power series is designed for high  
current operation and high flux output  
applications.  
• Designed for high  
current operation  
• Low thermal resistance  
• SMT solderbility  
Z-Power LED's thermal management  
perform exceeds other power LED  
solutions.  
• Lead Free product  
• RoHS compliant  
It incorporates state of the art SMD design  
and Thermal emission material.  
Z Power LED is ideal light sources for general  
Illumination applications, custom designed  
solutions, automotive large LCD backlights  
Applications  
• Mobile phone flash  
• Automotive interior  
/ exterior lighting  
• Automotive signal lighting  
• Automotive forward lighting  
• General Torch  
• Architectural lighting  
• LCD TV / Monitor Backlight  
• Projector light source  
• Traffic signals  
• Task lighting  
• Decorative / Pathway lighting  
• Remote / Solar powered lighting  
• Household appliances  
*The appearance and specifications of the product may be changed  
for improvement without notice.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Full Code of Z-Power LED Series  
Full code form : X1 X2 X3 X4 X5 X6 X7 – X8 X9 –X10X11 X12 X13X14  
1. Part Number  
- X1 : Color  
- X2 : New Z-Power LED - ‘Z’  
- X3 : New Z-Power LED series number  
- X4 : LENS type  
- X5 : Chip quantity (or Power Dissipation)  
- X6 : Package outline size  
-X7: Type of PCB  
2. Internal Number  
- X8  
- X9  
3. Code Labeling  
- X10 : Luminous flux (or Radiant flux for royal blue)  
- X11 X12 X13: Dominant wavelength (or x,y coordinates rank code)  
- X1 4: Forward voltage  
4. Sticker Diagram on Reel & Aluminum Vinyl Bag  
X X X X X X X – X X  
9
PART NO. :  
QUANTITY : ###  
LOT NUMBER : ##########  
1
2
3
4
5
6
7
8
X10 X11 X12 X13 X14  
BIN CODE :  
For more information about binning and labeling, refer to the Application Note -1  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Outline Dimension  
1. Flat Type  
Notes :  
1. All dimensions are in millimeters. (tolerance : ±0.2 )  
2. Scale : none  
3. Thermal pad is isolated.  
4. Paste thickness:(0.2±0.05)mm  
Rev. 10  
*The appearance and specifications of the product may be changed for improvement without  
notice.  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z-Power LED  
1. Pure White (WZ10150)  
1-1 Electro-Optical characteristics at IF=400mA, TA=25ºC  
Value  
Typ  
100  
Parameter  
Symbol  
Unit  
Min  
Max  
[1]  
[2]  
Luminous Flux  
90  
-
-
lm  
K
ФV  
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
6300  
68  
-
-
-
-
[4]  
Forward Voltage  
VF  
-
3.6  
4.25  
V
View Angle  
2Θ ½  
RθJ-B  
RθJ-C  
120  
deg.  
ºC /W  
ºC /W  
[5]  
Thermal resistance  
16.5  
11.0  
[6]  
Thermal resistance  
1-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
W
Forward Current  
IF  
Pd  
450  
1.67  
125  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
[7]  
ESD Sensitivity  
±10,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of ±10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT ±5% tester tolerance  
[4] A tolerance of ±0.06V on forward voltage measurements  
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)  
RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC)  
Break voltage of Metal PCB is 6.5kVAC  
[7] It is included the zener chip to protect the product from ESD.  
--------------------------Caution--------------------------  
1. Please do not drive at rated current more than 5 sec. without proper heat sink.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z-Power LED  
2. Warm White (NZ10150)  
2-1 Electro-Optical characteristics at IF=400mA, TA=25ºC  
Value  
Typ  
76  
Parameter  
Symbol  
Unit  
Min  
Max  
[1]  
[2]  
Luminous Flux  
-
-
-
-
-
lm  
K
ФV  
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
3000  
80  
-
-
-
[4]  
Forward Voltage  
VF  
3.6  
4.25  
V
View Angle  
2Θ ½  
RθJ-B  
RθJ-C  
120  
16.5  
11.0  
deg.  
ºC /W  
ºC /W  
[5]  
Thermal resistance  
[6]  
Thermal resistance  
2-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
mA  
W
Forward Current  
IF  
Pd  
450  
1.67  
125  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Tj  
ºC  
ºC  
ºC  
-
Topr  
Tstg  
-
-40 ~ +85  
-40 ~ +100  
[7]  
ESD Sensitivity  
±10,000V HBM  
*Notes :  
[1] SSC maintains a tolerance of ±10% on flux and power measurements.  
[2] ФV is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT ±5% tester tolerance  
[4] A tolerance of ±0.06V on forward voltage measurements  
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC)  
RθJ-C is measured with only emitter.(25 ºC ≤TJ ≤ 110 ºC)  
Break voltage of Metal PCB is 6.5kVAC  
[7] It is included the zener chip to protect the product from ESD.  
--------------------------Caution--------------------------  
1. Please do not drive at rated current more than 5 sec. without proper heat sink  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Color Spectrum, TA=25ºC  
1. Pure White  
1.0  
Standard eye response curve  
0.8  
0.6  
0.4  
0.2  
0.0  
300  
400  
500  
600  
700  
800  
Wavelength (nm)  
2. Warm White  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
300  
400  
500  
600  
700  
800  
Wavelength (nm)  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Junction Temperature Characteristics  
1. Relative Light Output vs. Junction Temperature at IF=400mA  
160  
Pure White  
Warm White  
140  
120  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
Junction Temperature, TJ [oC]  
2. Forward Voltage Shift vs. Junction Temperature at IF=400mA  
0.0  
-0.2  
-0.4  
-0.6  
-0.8  
Pure White & Warm White  
-1.0  
25  
50  
75  
100  
125  
Junction Temperature, TJ [oC]  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Optical characteristics  
1. Forward Voltage vs. Forward Current, TA=25℃  
Pure / Warm White  
400  
300  
200  
100  
0
0
1
2
3
4
5
6
Forward Voltage [V]  
2. Forward Current vs. Normalized Relative Luminous Flux TA=25℃  
1.2  
Pure / Warm White  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
100  
200  
300  
400  
500  
Forward Current [mA]  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Ambient Temperature vs Allowable Forward Current  
1. Pure White,Warm white (TJMAX = 125 ℃, 400mA)  
500  
400  
RjaT = 20oC/W  
300  
RjaT = 30oC/W  
RjaT = 40oC/W  
200  
100  
0
0
25  
50  
75  
100  
125  
Ambient Temperature [oC]  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Typical Flat Type Radiation pattern  
1. Pure White, Warm white  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
30  
60  
90  
-80  
-60  
-40  
-20  
0
Angle(deg.)  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Packing  
0.8  
0.6  
0.4  
0.2  
0 . 2  
4
0 .  
6
8
0 .  
0 .  
Note:  
1)Quantity : 500 or 1000pcs/Reel  
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm  
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is  
turned off from the carrier tape at the angle of 10 to the carrier tape  
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof  
Package  
5) The appearance and specifications of the product may be changed for improvement without  
notice.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
● Reel Packing Structure  
Reel  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
SEOUL SEMICONDUCTOR CO., LTD.  
HUMIDITY INDICATOR  
DESI PAK  
Aluminum Vinyl Bag  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
SEOUL SEMICONDUCTOR CO., LTD.  
Outer Box Structure  
Material : Paper(SW3B(B))  
SIZE (mm)  
TYPE  
a
c
b
245 220 102  
245 220 142  
7inch  
SIDE  
1
c
TUV  
MADE IN KOREA  
1
QUANTITY : XXXX  
Acriche  
Semiconductor EcoLight  
LOT NUMBER : XXXXXXXXXX  
RoHS  
b
PART NUMBER :  
a
SEOUL SEMICONDUCTOR CO., LTD.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Soldering  
1. Reflow Soldering Conditions / Profile  
[
]
Tm : Reflow machine setting temp (max 30 sec.)  
Ts : Surface temp of PCB (max)  
Ts : Surface temp of PCB (recommend)  
Ts : Surface temp of PCB (min)  
260  
240  
220  
200  
Cooling  
-5 °C/sec  
Rising  
5 °C/sec  
Pre-heating  
180  
150  
0
Time  
[Hr]  
2. Hand Soldering conditions  
Lead : Not more than 3 seconds @MAX280℃  
Slug : Use a thermal-adhesives  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairing should not be done after the LEDs have been soldered. When  
repairing is unavoidable, suitable tools have to be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30  
degrees Centigrade. Humidity 50% maximum.  
• Precaution after opening packaging  
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect  
the light transmission efficiency, causing the light intensity to drop.  
Attention in followed.  
a. Soldering should be done right after opening the package(within 24Hrs).  
b. Keeping of a fraction  
- Sealing  
- Temperature : 5 ~ 40℃ Humidity : less than 30%  
c. If the package has been opened more than 1week or the color of desiccant changes,  
components should be dried for 10-12hr at 60±5℃  
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling  
process to normal temp. after soldering.  
• Please avoid rapid cooling after soldering.  
• Components should not be mounted on warped direction of PCB.  
• Anti radioactive ray design is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA(Isopropyl Alcohol) should be used.  
• When the LEDs are illuminating, operating current should be decided after considering the  
package maximum temperature.  
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• Attaching LEDs, don’t use adhesives to generate organic vapor.  
Rev. 10  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Handling of Silicone Resin LEDs  
(1) During processing, mechanical stress on the surface should be minimized as much as  
possible. Sharp objects of all types should not be used to pierce the sealing compound.  
(2) In general, LEDs should only be handled from the side. By the way, this also applies  
to LEDs without a silicone sealant, since the surface can also become scratched.  
(3) When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that mechanical pressure on the  
surface of the resin must be prevented.  
This is assured by choosing a pick and place nozzle which is larger than the LED’s  
reflector area.  
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.  
These conditions must be considered during the handling of such devices. Compared to  
standard encapsulants, silicone is generally softer, and the surface is more likely to  
attract dust.  
As mentioned previously, the increased sensitivity to dust requires special care  
during processing. In cases where a minimal level of dirt and dust particles cannot be  
guaranteed, a suitable cleaning solution must be applied to the surface after the  
soldering of components.  
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it  
must be assured that these solvents do not dissolve the package or resin.  
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the  
Rev. 10  
LED.  
October. 2010  
www.acriche.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
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