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EZANPE470M

型号:

EZANPE470M

品牌:

PANASONIC[ PANASONIC ]

页数:

5 页

PDF大小:

121 K

Chip Capacitor Networks  
Chip Capacitor Networks  
Type:  
EZANP  
GND  
GND  
Features  
Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology.  
8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing  
for high density automatic placing  
Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole)  
Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement  
during reflow soldering  
● RoHS compliant  
<Effect of high density placing, PWB space saving>  
I/O  
I/O  
I/O  
I/O  
No Through Hole  
0.635 mm  
Chip Capacitor Network EZANP  
Conventional Chip Capacitors  
Recommended Applications  
Digital equipment such as PCs, word processors, printers, HDD, PPC, and PDAs  
Digital audio and video equipment such as CD, MD, DAT, digital cameras, digital video and digital TV  
Communication equipment, cordless phones, automobile phones, GSM, PHS, DECT  
Electronic musical instruments, and other digital devices  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
E
Z
A
N
P
E
1
0
1
M
Product Code  
Dimensions and  
Circuit Configuration  
Temperature  
Characteristics  
Capacitance Value  
Capacitance  
Tolerance  
Suffix for Special  
Requirement  
Thick Film Noise  
Suppression and  
Filtering Components  
8 Capacitors,  
Common  
terminal type  
The first two digits are  
significant figures of  
capacitance value, and  
the third one denotes the  
number of zeroes fellow.  
ex. 101100 pF  
+20 %/–55 %  
(–25 °C to +85 °C)  
20 %  
6.4 mm  
҂3.1 mm  
E
M
NP  
+30 %  
in the case of 22 pF  
–20 %  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Capacitor Networks  
Construction  
Dimensions in mm (not to scale)  
fD  
A1  
F1  
Alumina substrate  
Protective coating  
GND  
Electrode  
(Outer)  
GND  
Electrode  
(Outer)  
PIOI  
PIOI  
P
L
T
Electrode  
(Outer)  
F2  
A2  
Circuit Configuration  
Mass (Weight) [1000 pcs.] : 52 g  
A1 B1 E1 F1  
10  
2
9
8
7
5
Type  
L
W
T
(inches)  
EZANP  
(2512)  
0.2  
0.2  
+0.20  
0.2  
0.2  
0.2  
0.2  
GND 1  
6 GND  
6.4  
3.1  
0.75  
0.7  
0.4  
0.8  
0.4  
–0.10  
3
4
f
D
A2  
B2  
E2  
F2  
P
0.20  
0.2  
0.2  
0.2  
0.10  
+0.1  
0.56  
0.4  
0.8  
0.3  
1.27  
0.4  
–0.2  
Ratings  
Item  
Specification  
Capacitance Values (25 °C, 1 kHz(1), 1 Vrms)  
Capacitance Tolerance  
22 pF, 47 pF, 100 pF, 220 pF  
+30 ꢀ  
20 ꢀ (  
in the case of 22 pF)  
–20 ꢀ  
Temperature Characteristics  
Dissipation Factor  
E Characteristic: +20 ꢀ/–55 ꢀ (–25 °C to +85 °C)  
Less than 2 ꢀ (25 °C, 1 kHz(1), 1 Vrms)  
25 V  
Rated Voltage  
Category Temperature Range (Operating Temperature Range)  
–25 °C to +85 °C  
(1) In measuring at 1 MHz, Capacitance Value and Dissipation Factor are different.  
Attenuation Characteristics  
Measurement Circuit  
0
10  
20  
30  
40  
50  
50 ȑ  
EZANP  
50 ȑ  
~
1M  
10M  
100M  
1G  
3G  
Frequency (Hz)  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Capacitor Networks  
Packaging Methods (Taping)  
Standard Quantity  
Type  
Kind of Taping  
Pitch (P1)  
4 mm  
Quantity  
EZANP  
Embossed Carrier Taping  
4000 pcs./reel  
Embossed Carrier Taping  
Taping Reel  
T
t1  
Compartment  
Sprocket hole  
f
D0  
fC  
A
f
D1  
t2  
P1 P2 P0  
Tape running direction  
Chip component  
fA  
W
f
f
f
C
A
B
W
F
E
P0  
A
B
Dimensions  
(mm)  
Dimensions  
(mm)  
0.20  
0.20  
0.05  
0.30  
0.20  
0.05  
0.20  
0.20  
0.10  
+0  
1.0  
3.50  
6.80  
12.00  
5.50  
1.75  
4.00  
180.0  
60 min.  
13.0  
−3.0  
f
f
P1  
P2  
2.00  
D0  
t1  
t2  
D1  
W
T
Dimensions  
(mm)  
Dimensions  
(mm)  
0.10  
+0.10  
−0  
+0.10  
−0  
1.0  
2.0  
4.00  
1.50  
0.25  
1.30  
1.50  
13.0  
15.4  
Recommended Land Pattern Design  
b
P
(0.20)  
: Land pattern  
a
b
c
d
Dimensions  
2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8  
(mm)  
f
g
P
c
g
Dimensions  
(mm)  
4.2 to 4.6 7.5 to 7.9  
1.27  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Chip Capacitor Networks  
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
For soldering (Example : Sn/Pb)  
Temperature  
140 °C to 160 °C  
Reflow soldering shall be performed a maximum of  
two times.  
·
Time  
· Please contact us for additional information when  
used in conditions other than those specified.  
· Please measure the temperature of the terminals  
and study every kind of solder and printed circuit  
board for solderability before actual use.  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Above 200 °C  
235 5 °C  
For lead-free soldering (Example : Sn/Ag/Cu)  
Peak  
Temperature  
150 °C to 180 °C  
Above 230 °C  
max. 260 °C  
Time  
Preheating  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Heating  
Time  
Please contact us regarding flow soldering.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,  
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.  
1. Take measures against mechanical stress during and after mounting of Chip Capacitor Networks (hereafter called the  
capacitor networks) so as not to damage their electrodes and protective coatings.  
Be careful not to misplace the capacitor networks on the land patterns. Otherwise, solder bridging may occur.  
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitor networks'  
performance and/or reliability.  
3. Perform sufficient preheating so that the difference of the solder temperature and the capacitor networks chip surface  
°
°
temperature becomes 100 C or less. Maintain the temperature difference within 100 C during rapid cooling by immersion  
into solvent after soldering.  
4. When soldering with a soldering iron, never touch the capacitor networks' bodies with the tip of the soldering iron.  
When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at  
°
350 C max.).  
5. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor networks increases,  
causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.  
6. Do not apply shock to the capacitor networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the  
capacitor networks' protective coatings and bodies may be chipped, affecting their performance.  
7. Avoid excessive bending of printed circuit boards in order to protect the capacitor networks from abnormal stress.  
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to  
dielectric materials having a high dielectric constant.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])  
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written  
agreement on the specifications with us in advance. The design and specifications in this catalog are subject  
to change without prior notice.  
• Do not use the products beyond the specifications described in this catalog.  
• This catalog explains the quality and performance of the products as individual components. Before use, check  
and evaluate their operations when installed in your products.  
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment  
where a defect in these products may cause the loss of human life or other significant damage, such as damage to  
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating  
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.  
Systems equipped with a protection circuit and a protection device  
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault  
(1) Precautions for use  
• These products are designed and manufactured for general and standard use in general electronic equipment  
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)  
• These products are not intended for use in the following special conditions. Before using the products,  
carefully check the effects on their quality and performance, and determine whether or not they can be used.  
1. In liquid, such as water, oil, chemicals, or organic solvent  
2. In direct sunlight, outdoors, or in dust  
3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
4. Electric Static Discharge (ESD) Environment  
2
2
3
2
2
These components are sensitive to static electricity and can be damaged under static shock (ESD).  
Please take measures to avoid any of these environments.  
Smaller components are more sensitive to ESD environment.  
5. Electromagnetic Environment  
Avoid any environment where strong electromagnetic waves exist.  
6. In an environment where these products cause dew condensation  
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with  
resin or other materials  
• These products generate Joule heat when energized. Carefully position these products so that their heat will  
not affect the other components.  
• Carefully position these products so that their temperatures will not exceed the category temperature range due  
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components  
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).  
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the  
performance or reliability of the products.  
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance  
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water  
residues. Otherwise, the insulation performance may be deteriorated.  
(2) Precautions for storage  
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival  
at your company, provided that they remain packed as they were when delivered and stored at a temperature  
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the  
date of arrival at your company)  
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on  
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %  
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a  
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of  
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.  
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,  
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping  
materials) may be deformed or deteriorated, resulting in mounting failures.  
2
2
3
2
2
1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
2. In direct sunlight  
<Package markings>  
Package markings include the product number, quantity, and country of origin.  
In principle, the country of origin should be indicated in English.  
Feb. 2006  
– EX2 –  
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