SPECIFICATIONS
mPGA478 Socket
BGA Series CPU Socket
Vertical, SMT Type
1.27mm [.050”] Pitch
478 Pos.
Mechanical
Socket Engagement/Disengagement Force: 4.5Kg max.
Durability: 50 Cycles min.
Socket Retention Force: 10g min.
Solder Ball Shear Force: 500g min.
Chip Unmating Force: 6Kg min.
Electrical
Contact Resistance: 25mΩ max.
Dielectric Withstanding Voltage: 360V
Insulation Resistance: 800MΩ min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Thermoplastic, UL 94V-0 rated, Brown Color
Cap: Thermoplastic, UL 94V-0 rated, Brown Color
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +125℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: P Z 4 7 8 0 * - 2 7 4 8 - * 1
Actual Loading
No. of Pos.
Pick-up Package
1=Cap
478=478 Pos.
Package
0=Hard Tray
Termination Type & Length
Actuaction & Body Type
0=BGA Type(63/37 Sn/Pb)
8=Handle Design (Plastic Cam)
Contact Area Plating
Base color
7=15u" Gold
4=Black
Grid Array Type
27=26X26 for Nothwood
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
8
