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OX-221-9125-12M800

型号：

OX-221-9125-12M800

品牌：

MICROSEMI[ Microsemi ]

页数：

13 页

PDF大小：

705 K

下载PDF手册
OX-221-9125-12M800  
OCXO  
OX-221-9125-12M800  
Nominal frequency (f0)  
12.8 MHz  
Performance Specifications  
Frequency stabilities  
Parameter  
Min  
Typical  
Max  
Units  
ppm  
Condition  
-40...85◦C include: Temp. Stab,  
supply, load stab, initial, 20  
years aging ( GR1244  
Over all (df/f0)  
-1.5  
+1.5  
requirement: ±4.6ppm)  
vs. operating temp. range (df/f@25◦C)  
initial tolerance (df/f0)  
-5  
-200  
-2  
+5  
+200  
+2  
ppb  
ppb  
ppb  
ppb  
ppb  
ppb  
ppm  
-40...85◦C  
@25 ◦C  
vs. supply voltage change (df/f)  
vs. load change (df/f))  
static; 3.3 V ±5 %  
static; Load +5 % -5 %  
after 30 days ; @ 25 ◦C  
after 30 days ; @ 25 ◦C  
after 30 days ; @ 25 ◦C  
-2  
+2  
vs. aging / day (df/f)  
-0.5  
-80  
-0.8  
+0.5  
+80  
+0.8  
vs. aging / year (df/f)  
vs. aging / 20 years (df/f)  
over 24 hours and ±2.8◦C  
Holdover/Drift  
-1  
+1  
10  
ppb  
(according GR1244)  
ppb  
[pk-pk]  
over 24 hours; -40...85◦C  
S3E compliant according GR1244  
Note:  
RF output  
Parameter  
Signal  
Min  
Typical  
Max  
16.5  
Units  
pF  
Condition  
LVCMOS  
Load  
13.5  
15  
Fan out  
Rise Time  
Fall Time  
5
5
ns  
ns  
%
V
@10 to 90 %Vout  
@90 to 10 %Vout  
@1.65 V  
Duty cycle  
V Low  
45  
55  
0.4  
Page 1 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
RF output  
Parameter  
Parameter  
Min  
2.4  
Typical  
Max  
-90  
Units  
V
Condition  
Condition  
V High  
Spurious  
dBc  
Supply voltage  
Typical  
Min  
Max  
3.47  
400  
700  
950  
Units  
V
Supply voltage (Vs)  
3.14  
3.3  
Current consumption steady state  
mA  
mA  
mA  
@ Vsnom & 25 ◦C  
@ Vsnom & -40 ◦C  
@ Vs  
Current consumption during warm up  
Additional Parameters  
Parameter  
Warm up time  
Min  
Typical  
Max  
Units  
min  
Condition  
@ 25 ◦C to final frequency (  
within ±100ppb referenced to  
frequency reached after 24  
hours )  
5
Phase Noise  
-90  
-125  
-145  
-150  
-158  
-160  
5
-70  
-105  
-130  
-140  
-150  
-150  
9
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
E-12  
@1Hz  
@10Hz  
@100Hz  
@1kHz  
@10kHz  
@100kHz  
1.0 sec  
ADEV  
11  
12  
15  
15  
E-12  
E-12  
10.0 sec  
100.0 sec  
Processing & Packing  
handling&processing note  
Additional Environmental Conditions  
Description  
Parameter  
100% RoHS 6 compliant  
washable device  
RoHS compliance  
Washable  
1
MSL-Level  
JESD22-A114F Class 1C - 10* 2000V  
ESD HBM  
MIL-STD-202 Meth 213B Cond. C - 100g 6ms 6 shocks in each direction  
JESD22-B103 Cond.2 - 10g 10-2000Hz 4x in each 3 axis 4min sweep time  
JESD22-A113-B - only if > MSL 1  
Mechanical Shock  
Vibration, Sine  
Moisture Sen. Level  
Solderabiltiy  
J-STD-002C Cond. A, Trough hole device; Cond.B, SMD ( correspond to  
MIL-STD-883 Meth 2003) - 255◦C (diving Time 5 ±0,5sec.) Dip&Look with  
8h damp pre-treatment: solder wetting >95%  
MIL-STD-202 Meth108A Cond C - 1000h @ 105◦C under voltage  
IEC 60068-2-1 Cond. Ae - Ta= -40◦C, >1000 hours with bias for OCXO  
MIL-STD-202G Meth 210F Cond. K - Total 3x Lead free profile (for SMD)  
High temp operating life(HTOL)  
Low temp operating life(LTOL)  
Reflow Simulation Test  
MIL-STD-883G Meth.1010.8 Cond.B - 1000cycles -55/+125◦C; cycle time 30  
min.  
Temperature Cycling  
Page 2 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
Absolute Maximum Ratings  
Parameter  
Supply voltage (Vs)  
Min  
Typical  
Max  
5.5  
Units  
V
Condition  
Operable temperature range  
Storage temperature range  
-40  
-40  
+85  
+125  
◦C  
◦C  
Enclosure  
G275  
B0,2  
22  
B0,1  
(8,9  
)
2,5  
2
,
0
B
4
,
5
2
5
,
2
17,8  
7,62  
B0,1  
B0,1  
7,62  
17,8  
5
2
,
0
4
o
,
3
H
2
Co- Planarity  
spec (Ù0,1mm)  
E 0,1  
4
,
3
7
6
5
4
2,7  
land pattern  
recommendation  
top  
view  
1
2
3
all units in mm  
Enclosure Info  
Parameter  
Type  
Description  
G275D  
12.1 mm  
9 g  
Height (H)  
Weight  
Page 3 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
Enclosure Info  
Description  
Parameter  
1: I.C. (Do not connect)  
2: N.C.  
Pin Connections  
3: Vs (supply voltage input)  
4: RF-Output  
5: N.C.  
6: N.C.  
7: GND  
OX-221-9125  
12,800 MHz  
Ser.No. AYYWW *  
* pin-1 marking  
Metal  
Marking  
Package cover material  
Package base material  
FR4  
Solder profile  
TP: max 260°C (@ solder joint,  
customer board level)  
Tp: max: 10…30 sec  
Additional Information:  
This SMD oscillator has been  
designed for pick and place reflow  
soldering  
SMD oscillators must be on the top  
side of the PCB during the reflow  
process.  
Page 4 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
Standard shipping method  
Position in tape  
Pin1  
4.0  
K
A
1.75±0.1  
Unwinding direction  
B
B
cross-section  
A - A  
A
P
A
if W < 32mm only upper hole line existent  
cross-section  
B - B  
Dimension in mm:  
A, B and K are dependent uppon component dimensions  
production tolerance complying DIN IEC 286-3  
All dimensions in millimeters unless otherwise stated  
Tape Info  
Quantity per reel  
175  
Tape width W [mm] Quantity per meter  
P [mm]  
28  
A [mm]  
22.5  
B [mm]  
25.9  
K [mm]  
12.8  
44  
35.7  
W2  
N
D
A
C
W1  
B
Reel Info  
A [mm]  
330  
B [mm]  
1.5  
Size C [mm]  
13  
D [mm]  
20.2  
N [mm]  
100  
W1 [mm]  
45.5  
W2 [mm]  
49.1  
Page 5 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
Notes: Unless otherwise stated all values are valid after warm-up time and refer to typical conditions for supply voltage,  
frequency control voltage, load, temperature (25◦C).  
Subject to technical modification.  
Microsemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers  
a comprehensive portfolio of semiconductor and system solutions for aerospace & defense,  
communications, data center and industrial markets. Products include high-performance and  
radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power  
management products; timing and synchronization devices and precise time solutions, setting the  
world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise  
storage and communication solutions, security technologies and scalable anti-tamper products;  
Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities  
and services. Learn more at www.microsemi.com.  
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products  
and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of  
Microsemi Headquarters  
One Enterprise, Aliso Viejo, CA 92656 USA  
Within the USA: +1 (800) 713-4113  
Outside the USA: +1 (949) 380-6100  
Sales: +1 (949) 380-6136  
any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing  
and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed  
to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone  
and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters  
provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the  
same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated  
with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses,  
or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in  
this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document  
or to any products and services at any time without notice.  
Fax: +1 (949) 215-4996  
email: sales.support@microsemi.com  
www.microsemi.com  
c
ꢀ2018 Microsemi,  
a wholly owned subsidiary of Microchip Technology Inc. All rights reserved. Microsemi and the Mi-  
crosemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their  
respective owners  
Disclaimer  
We reserve the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under  
any patent accompany the sale of any such product(s) or information.  
Page 6 of 6  
Vectron International • http://www.vectron.com • modified 2017-10-25 index: 1 • printed 2018-08-02  
Appendix  
List of appendices  
Appendix_OX-221-9125_12M80  
II  
Appendix handling&processing note  
IV  
Appendix Page I of VII  
Vectron International • http://www.vectron.com  
Typical Performance Data  
Typical MTIE  
OX-221-9125-12M800  
1E-06  
1E-07  
1E-08  
1E-09  
1E-10  
1E-11  
1E-12  
1E-01  
1E+00  
1E+01  
tau [s]  
no Filter  
1E+02  
1E+03  
1E+04  
1E+05  
Telcordia GR-1244 Fig 5-5  
0,3mHz  
1mHz  
3mHz  
Typical TDEV  
OX-221-9125-12M800  
1E-07  
1E-08  
1E-09  
1E-10  
1E-11  
1E-12  
1E-13  
1E-01  
1E+00  
1E+01  
1E+02  
1E+03  
1E+04  
1E+05  
tau [s]  
Telcordia GR-1244 Fig 5-4  
no Filter  
0,3mHz  
1mHz  
3mHz  
Filtered (0.3mHz, 1mHz,3mHz) curves are simulated base on measured frequency / Phase data  
Appendix Page II of VII  
Vectron International • http://www.vectron.com  
Typical Phase Noise and Jitter  
OX-221-9125-12M800  
Appendix Page III of VII  
Vectron International • http://www.vectron.com  
Handling and Processing Note Oscillators  
Application  
Application  
Unless otherwise noted, the products listed in the catalogue are designed for use with ordinary  
electrical devices, such as stationary and portable communication, control, measurement  
equipment etc.. They are designed and manufactured to meet a high degree of reliability  
(lifetime more than 15 years) under normal „commercial“ application conditions. Products  
dedicated for automotive and H-Rel applications are specifically identified for these applications.  
If you intend to use these „commercial“ products for airborne, space or critical transport  
applications, nuclear power control, medical devices with a direct impact on human life, or other  
applications which require an exceptionally high degree of reliability or safety, please contact the  
manufacturer.  
Electrostatic Sensitivity  
Crystal oscillators are electrostatic sensitive devices. Proper handling according to the  
established ESD handling rules as in IEC 61340-5-1 and EN 100015-1 is mandatory to avoid  
degradations of the oscillator performance due to damages of the internal circuitry by  
electrostatics. If not otherwise stated, our oscillators meet the requirements of the Human Body  
Model (HBM) according to JESD22-A114F.  
Handling  
Excessive mechanical shocks during handling as well as manual and automatic assembly have  
to be avoided. If the oscillator was unintentionally dropped or otherwise subject to strong shocks,  
please verify that the electrical function is still within specification.  
Improper handling may also detoriate the coplanarity of bended leads of SMD components.  
Soldering  
Oscillators can be processed using conventional soldering processes such as wave soldering,  
convection, infrared, and vapour phase reflow soldering under normal conditions. Solderability is  
guaranteed for one year storage under normal climatic conditions (+5°C to +35°C @ 40% to  
75% relative humidity), however typically sufficient solderability –depending on the process – is  
maintained also for longer time periods. In cases of doubt, components older than one year  
should undergo a sample solderability test.  
The recommended reflow solder profile for SMT componets is according IPC/JEDEC J-STD-  
020 (latest revision)  
SMD oscillators must be on the top side of the PCB during the reflow process.  
After reflow soldering the frequency of the products may have shifted several ppm, which  
relaxes after several hours or days, depending on the products. For details please contact the  
manufacturer.  
Appendix Page IV of VII  
Vectron International • http://www.vectron.com  
Cleaning  
Cleaning is only allowed for hermetically sealed oscillators. Devices with non hermetical  
enclosures (e.g. with trimmer holes) shall not be cleaned by soaking or in vapour, because  
residues from the cleaning process may penetrate into the interior, and degrade the  
performance.  
Our products are laser marked. The marking of our oscillators is resistant to usual solvents, such  
as given in IEC 60068-2-45 Test XA. For applicable test conditions see IEC 60679-1.  
Ultrasonic cleaning is usually not harmful to oscillators at ultrasonic frequencies of 20kHz at the  
sound intensities conventional in industry. Sensitive devices may suffer mechanical damage if  
subjected to 40kHz ultrasound at high sound pressure. In cases of doubt, please conduct tests  
under practical conditions with the oscillators mounted on the PC board.  
Hermetical Seal  
If the device is specified as hermetically sealed, it meets the requirements of IEC 60679-1, i.e.  
for enclosures with a volume smaller than 4000mm³ the leak rate is below 5*10-8 bar cm3/s, for  
larger enclosures it is below 1*10-6 bar c bar cm3/s, tested according to IEC 60068-2-17 Test  
Qk.  
Glass feed-throughs may be damaged as a result of mechanical overload, such as bending the  
connection leads or cutting them with an unappropriated tool. In order to avoid microcracking,  
the wire must be held fixed in position by a pressure pad between glass feed-through and the  
bending point during the bending process. Check: there should be no damaged edges on the  
glass feed-through after the bending.  
Tape & Reel  
The packing in tape and reel is according to IEC 60286-3.  
Details see tape & reel data sheets.  
Qualification  
Vectron products are undergoing regular qualification/reliability tests as per product family  
definition. Results are available upon request. Customer specific qualification tests are subject to  
agreement.  
If not otherwise stated, the product qualifications are performed according to IEC 60679-5 or  
other valid industry standards.  
Screening  
Our oscillators are 100% tested, and all key manufacturing processes are controlled by  
Statistical Process Control (SPC). Additional screening is therefore usually not required.  
On request, we can perform screening tests according to MIL-PRF-55310, class B for discrete or  
hybrid constructions of commercial (COTS) products. For special requirements see the High  
Reliability Clock section.  
Appendix Page V of VII  
Vectron International • http://www.vectron.com  
Demounting/Desoldering of Ocsillator device for analysis:  
The removal or desoldering of oscillators from customer application after SMT process may cause  
damage to the device if not handeld appropriately. It may lead to parametric change such as  
frequency shift (like OCXO: up to +/- 200 ppb) . It is utmost important to minimize the direct heat  
exposure to the device in order to avoid such effects. Use of hot air gun for desoldering should be  
avoided.  
A mechanical stress could also destroy the part, if exposed to excessive mechanical shock after  
removal process. Appropriate shock protection & ESD designated packaging must be used to  
avoid any external mechanical shock for FA return process.  
Mechanical & Climatic Tests  
In general, the products* withstand the tests listed in the following Table 1, which are based on  
valid industry standards.  
*Additional note: Test conditions could vary for different product families and individual product  
specifications depending on the customer as well as product requirements.  
Appendix Page VI of VII  
Vectron International • http://www.vectron.com  
Recommended Environmental Test Conditions  
Table 1  
Test  
Test condition  
Test Standard  
Dimensions  
External visual  
Internal visual  
Electrostatic discharge 10 discharges, both  
(ESD) sensitivity testing polarities, 1kV...8kV  
Human Body Model  
acc. outline drawing  
no visible damage  
30-50x  
MIL-STD-883 Meth2016  
MIL-STD-883 Meth2009  
MIL-STD-883 Meth2014  
JESD 22-A114F  
(HBM)  
only for hermetically  
sealed parts 100%  
tested  
MIL-STD-883 Meth1014 A1/C4  
Seal Fine/Gross  
Leak  
255°C (diving Time 5  
±0,5sec.) Dip&Look  
with 8h damp pre-  
treatment: solder  
wetting >95%  
J-STD-002C Cond. A, Trough hole  
device; Cond. B,  
SMD ( correspond to MIL-STD-883 Meth  
2003)  
Solderabiltiy  
Reflow Simulation Test 3X Lead free profile  
J-STD-020D  
Mechanical Shock  
1. 100g 6ms 6 shocks 1. MIL-STD-202 Meth 213B Cond. C;  
in each direction;  
2. 1500G 0,5ms 6  
shocks in each  
direction.  
2. MIL-STD-202 Meth 213B Cond. F (for  
ceramics parts).  
Free fall  
Test Ed procedure 1,  
2 drops from 1m  
height  
IEC 600068-2-32  
Vibration, Sine  
20g 20-2000Hz 4x in  
each 3 axis 4min  
sweep time  
MIL-STD-883 Meth 2007.3 Cond A  
Vibration, random  
optional on customers MIL-STD-202 Meth214A Figure 214-1  
request  
Temperature Cycling  
1.1000 cycles -  
55/+125°C; cycle time  
30 min.;  
1. MIL-STD-883G Meth1010.8 Cond. B  
2. JESD22-A104-D Cond. G  
2.1000 cycles -  
40/+125°C;cycle time  
30 min.  
Low temperature  
operating Life (LTOL)  
Steady State  
'Ta= -40°C, >1000 h  
IEC 60068-2-1  
Non hermetic parts  
JESD22-A101-C  
Temperature Humidity 85°C/85% RH 1008h  
Bias Life Test  
High Temperature  
1000h @ 105°C under MIL-STD-202 Meth108A Cond C  
Storage Operating Life voltage  
(HTOL))  
Aktive Aging at  
1000h @ 85°C with fit MIL-PRF-55310 Meth.4.8.35  
Elevated Temperatures calculation (for not  
OCXO)  
Aktive Aging at Room  
Temperture  
1000h with fit  
MIL-PRF-55310 Meth.4.8.35  
calculation- only for  
OCXO @crystal  
operating temp.  
Immersion in cleaning  
solvents  
IEC 60068-2-45 Test Xa ;  
IEC 60068-2-70 Test Xb (rubbing finger)  
Appendix Page VII of VII  
Vectron International • http://www.vectron.com  
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