Standard Shipping Method (OX-601)
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Enclosure Type
Tape Width W (mm)
24
Quantity per meter
83.3
Quantity per reel
850
Dimension P
12
OX-601 (4.1 mm)
Reflow Profile
TP: max 250°C (@ solder joint, customer board level)
TP: max 250°C (@ solder joint, customer board level)
Tp: max: 10…40 sec
Tp: max: 10…40 sec
Additional Information:
This SMD oscillator has been designed for pick and place
Additional Information:
reflow soldering
This SMD oscillator has been designed for pick and place re-
SMD oscillators must be on the top side of the PCB during
flow soldering
the reflow process.
SMD oscillators must be on the top side of the PCB during the
reflow process.
Additional Environmental Conditions
Parameter
Description
JESD22-A104-D Cond.G - 500cycles -40/+125C;cycle time 30min
Temperature Cycling
Vibration, Sine
MIL-STD-883 Meth 2007 Cond A - 20g 20-2000Hz 4x in each 3 axis 4min sweep time
MIL-STD-202 Meth 213B Cond. F - 1500g 0,5ms 6 shocks in each direction
Mechanical Shock
Solderability
J-STD-002C Cond. A, Trough hole device; Cond.B, SMD ( correspond to MIL-STD-883 Meth 2003) - 255C (diving Time 5
0,5sec.) Dip&Look with 8h damp pre-treatment: solder wetting >95ꢀ
Solvent resistance
ESD
MIL-STD-883 Meth 2003) - 255C (diving Time 5 0,5sec.) Dip&Look with
8h damp pre-treatment: solder wetting >95ꢀ
JESD22-A113-B - only if > MSL 1
Moisture Sensit.
RoHS compliance
Washable
100ꢀ RoHS 6 compliant
non-washable device
High temp operating
life(HTOL)
MIL-STD-202 Meth108A Cond C - 1000h @ 105C power on
Low temp operating
life(LTOL)
IEC 60068-2-1 Cond. Ae - 1000h @ -40C power on
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