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IXGR12N60C

型号:

IXGR12N60C

品牌:

IXYS[ IXYS CORPORATION ]

页数:

2 页

PDF大小:

58 K

HiPerFASTTM IGBT  
V
= 600 V  
IXGR 12N60C  
CES  
ISOPLUS247TM  
I
= 15 A  
= 2.7 V  
C25  
V
t
CE(sat)= 55 ns  
(Electrically Isolated Back Surface)  
fi(typ)  
Symbol  
TestConditions  
Maximum Ratings  
ISOPLUS 247  
E153432  
VCES  
VCGR  
TJ = 25°C to 150°C  
600  
600  
V
V
TJ = 25°C to 150°C; RGE = 1 MΩ  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G
C
E
Isolated Backside*  
IC25  
IC90  
ICM  
TC = 25°C  
15  
8
A
A
A
TC = 90°C  
G = Gate  
E = Source  
C = Drain  
TC = 25°C, 1 ms  
48  
SSOA  
(RBSOA)  
VGE = 15 V, TVJ = 125°C, RG = 33 Ω  
Clamped inductive load, L = 300 µH  
ICM = 24  
@ 0.8 VCES  
A
* Patent pending  
PC  
TC = 25°C  
55  
W
TJ  
-40 ... +150  
150  
°C  
°C  
°C  
Features  
TJM  
Tstg  
l
Silicon chip on Direct-Copper-Bond  
substrate  
-40 ... +150  
- High power dissipation  
-Isolatedmountingsurface  
-2500Velectricalisolation  
Lowcollectortotabcapacitance  
(<35pF)  
3rd generation HDMOSTM process  
VCE (sat)  
VISOL  
Isolation Voltage  
2500  
5
V
g
Weight  
l
l
l
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Ruggedpolysilicongatecellstructure  
Applications  
l
PFCcircuits  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
l
AC motor control  
l
Switched-mode and resonant-mode  
power supplies, UPS, no screws, or  
isolationfoils  
BVCES  
VGE(th)  
IC = 250 µA, VGE = 0 V  
IC = 250 µA, VGE = VGE  
600  
2.5  
V
V
l
DC choppers  
5.0  
Advantages  
ICES  
VCE = 0.8 VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
200 µA  
1.5 mA  
l
Easy assembly  
l
Low capacitance to ground, low EMI  
IGES  
VCE = 0 V, VGE = ±20 V  
±100 nA  
VCE(sat)  
IC = IT, VGE = 15 V  
2.7  
V
98663B (02/02)  
© 2002 IXYS All rights reserved  
IXGR 12N60C  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
ISOPLUS247OUTLINE  
IC = IT; VCE = 10 V,  
Pulse test, t 300 µs, duty cycle 2 %  
7
11  
S
Cies  
Coes  
Cres  
860  
64  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
15  
Qg  
32  
10  
10  
nC  
nC  
nC  
Qge  
Qgc  
IC = IT, VGE = 15 V, VCE = 0.5 VCES  
td(on)  
tri  
td(off)  
tfi  
20  
20  
ns  
ns  
ns  
ns  
mJ  
Inductive load, TJ = 25°C  
1 Gate, 2 Drain (Collector)  
3 Source (Emitter)  
4 no connection  
IC = IT, VGE = 15 V, L = 300 µH  
VCE = 0.8 VCES, RG = Roff = 18 Ω  
60  
Remarks: Switching times may increase  
for VCE (Clamp) > 0.8 VCES, higher TJ or  
increased RG  
55  
Dim.  
Millimeter  
Inches  
Min. Max. Min. Max.  
Eoff  
0.09  
A
A1  
A2  
4.83  
2.29  
1.91  
5.21  
2.54  
2.16  
.190 .205  
.090 .100  
.075 .085  
td(on)  
tri  
20  
20  
ns  
ns  
mJ  
ns  
ns  
Inductive load, TJ = 125°C  
b
b1  
b2  
1.14  
1.91  
2.92  
1.40  
2.13  
3.12  
.045 .055  
.075 .084  
.115 .123  
IC = IT, VGE = 15 V, L = 300 µH  
Eon  
td(off)  
tfi  
0.15  
V
CE = 0.8 VCES, RG = Roff = 18 Ω  
C
D
E
0.61  
0.80  
20.80 21.34  
15.75 16.13  
.024 .031  
.819 .840  
.620 .635  
85 180  
85 180  
Remarks: Switching times may increase  
for VCE (Clamp) > 0.8 VCES, higher TJ or  
increased RG  
e
L
L1  
5.45 BSC  
19.81 20.32  
.215 BSC  
.780 .800  
.150 .170  
Eoff  
0.27 0.60 mJ  
2.27 K/W  
3.81  
4.32  
RthJC  
RthCK  
Q
R
5.59  
4.32  
6.20  
4.83  
.220 .244  
.170 .190  
0.15  
K/W  
Note: IT = 12A  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETSandIGBTsarecoveredbyoneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715 6,306,728B1  
5,381,025  
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