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QT60160

型号：

QT60160

描述：

デコーダIC[ 触摸传感ic ]

品牌：

QT[ QT OPTOELECTRONICS ]

页数：

24 页

PDF大小：

605 K

下载PDF手册

QT60160, QT60240

RELIMINARY

NFORMATION

16 AND 24 KEY QMATRIX™ TOUCH IC

! Second generation QMatrix technology

! Keys individually adjustable for sensitivity, response

time, and many other critical parameters

! Panel thicknesses to 50mm through any dielectric

! 100% autocal for life - no adjustments required

32 31 30 29 28 27 26 25

M_SYNC

DETECT

VSS

Y1B

Y0B

! I²C slave interface or shift register output

! AKS™ - Patented Adjacent Key Suppression feature

! Spread-spectrum modulation for high noise immunity

! Mix and match key sizes and shapes in one panel

! Low power modes

QT60240

QT60160

VDD

VSS

VDD

VSS

VDD

MLF-32

VDD

9 10 11 12 13 14 15 16

! Low external component count

! Low cost per key

! +1.8V to +5V single supply operation

! 32-pin RoHS compliant MLF package

APPLICATIONS

! Security keypanels

! Industrial keyboards

! Appliance controls

! Outdoor keypads

! ATM machines

! Touchscreens

! Automotive panels

! Machine tools

These digital charge-transfer (“QT”) QMatrix™ ICs are designed to detect human touch on up to 16 or 24 keys when used with

a scanned, passive X-Y matrix. They will project touch keys through almost any dielectric, e.g. glass, plastic, stone, ceramic,

and even wood, up to thicknesses of 5cm or more. The touch areas are defined as simple two-part interdigitated electrodes of

conductive material, like copper or screened silver or carbon deposited on the rear of a control panel. Key sizes, shapes and

placement are almost entirely arbitrary; sizes and shapes of keys can be mixed within a single panel of keys and can vary by a

factor of 20:1 in surface area. The sensitivity of each key can be set individually via simple functions over the serial port by a

host microcontroller. Key setups are stored in an onboard EEPROM and do not need to be reloaded with each powerup.

These devices are designed specifically for appliances, electronic kiosks, security pan els, portable instruments, machine tools,

or similar products that are subject to environmental influences or even vandalism. They permit the construction of 100%

sealed, watertight control panels that are immune to humidity, temperature, dirt accumulation, or the physical deterioration of

the panel surface from abrasion, chemicals, or abuse. To this end they contain Quantum-pioneered adaptive auto

self-calibration, drift compensation, and digital filtering algorithms that make the sensing function robust and survivable.

Common PCB materials or flex circuits can be used as the circuit substrate; the overlying panel can be made of any

nonconducting material. External circuitry consists of only a few passive parts . Control and data transfer is via I²C.

These devices make use of an important new variant of charge-transfer sensing, transverse charge-transfer, in a matrix format

that minimizes the number of required scan lines. Unlike older methods, it does not require one IC per key.

AVAILABLE OPTIONS

Part Number

QT60160-XSG

QT60240-XSG

Keys

T_A

-40⁰C to +85⁰C

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Contents

1 Overview

5 I2C Operation

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

. . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.2 Transferring Data Bits

1.1 Introduction

5.1 Interface Bus

. . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Part Differences

. . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . 13

5.3 START and STOP Conditions

5.4 Address Packet Format

2 Hardware and Functional

. . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . 13

. . . . . . . . . . . . . . . . . . . . . 13

. . . . . . . . . . . . . . . . . . . . . . . 13

2.1 Matrix Scan Sequence

. . . . . . . . . . . . . . . . . . . . . .

2.2 Disabling Keys - Burst Paring

2.3 Sample Capacitors - Saturation

2.4 Sample Resistors

5.5 Data Packet Format

. . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . .

5.6 Combining Address and Data Packets Into a

^Transmiss.^ion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . .

6 Setups

2.5 Signal Levels

6.1 Introduction

. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.6 Matrix Series Resistors

2.7 Key Design

. . . . . . . . . . . . . . . . . . . . .

6.2 Negative Threshold - NTHR

. . . . . . . . . . . . . . . . . . . 15

. . . . . . . . . . . . . . . . . . . . . . . . . . .

6.3 Positive Threshold - PTHR

. . . . . . . . . . . . . . . . . . . 15

2.8 PCB Layout, Construction

. . . . . . . . . . . . . . . . . . . .

6.4 Positive Recalibration Delay - PRD

. . . . . . . . . . . . . . . 15

2.8.1 Overview

. . . . . . . . . . . . . . . . . . . . . . . . . .

6.5 Drift Compensation - NDRIFT, PDRIFT

. . . . . . . . . . . . . 16

2.8.2 LED Traces and Other Switching Signals

2.8.3 PCB Cleanliness

. . . . . . . . . . . . .

6.6 Detect Integrators - NDIL, FDIL

. . . . . . . . . . . . . . . . . 16

. . . . . . . . . . . . . . . . . . . . . . .

6.7 Negative Recal Delay - NRD

. . . . . . . . . . . . . . . . . . . 17

2.9 Power Supply Considerations

. . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . .

6.8 Burst Length - BL

. . . . . . . . . . . . . . . . . . . . . . . . 17

2.10 Startup / Calibration Times

2.11 Reset Input

6.9 Adjacent Key Suppression - AKS

. . . . . . . . . . . . . . . . 17

. . . . . . . . . . . . . . . . . . . . . . . . . .

6.10 Oscilloscope Sync - SSYNC

. . . . . . . . . . . . . . . . . . 17

2.12 Spread Spectrum Acquisitions

. . . . . . . . . . . . . . . . .

6.11 Mains Sync - MSYNC

. . . . . . . . . . . . . . . . . . . . . 17

2.13 Detection Integrators

2.14 Sleep

. . . . . . . . . . . . . . . . . . . . . .

6.12 Sleep Duration - SLEEP

. . . . . . . . . . . . . . . . . . . . 18

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.13 Wake on Key Touch - WAKE

. . . . . . . . . . . . . . . . . . 18

2.15 Wiring

6.14 Awake Timeout - AWAKE

. . . . . . . . . . . . . . . . . . . 18

3 Interfaces

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6.15 Drift Hold Time - DHT

. . . . . . . . . . . . . . . . . . . . . 18

3.1 Introduction

. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6.16 Setups Block

. . . . . . . . . . . . . . . . . . . . . . . . . 19

3.2 Shift Register Output

3.3 I2C Port

. . . . . . . . . . . . . . . . . . . . . . 10

7 Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . 22

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.1 Absolute Maximum Electrical Specifications

. . . . . . . . . . . 22

4 Control Commands

. . . . . . . . . . . . . . . . . . . . . . . 11

7.2 Recommended Operating Conditions

. . . . . . . . . . . . . . 22

4.1 Introduction

. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

7.3 DC Specifications

. . . . . . . . . . . . . . . . . . . . . . . . 22

4.2 Writing Data to the Device

. . . . . . . . . . . . . . . . . . . . 11

7.4 Timing Specifications

. . . . . . . . . . . . . . . . . . . . . . 22

4.3 Reading Data From the Device

4.4 Report Detections for All Keys

4.5 Raw Data Commands

. . . . . . . . . . . . . . . . . 11

. . . . . . . . . . . . . . . . . . 11

7.5 Mechanical Dimensions

. . . . . . . . . . . . . . . . . . . . . 22

7.6 Marking

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

. . . . . . . . . . . . . . . . . . . . . 12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.6 Cal All

4.7 Setups

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Unused keys are always pared from the burst sequence in

order to optimize speed. Similarly, in a given part a lesser

number of enabled keys will cause any unused acquisition

burst timeslots to be pared from the sampling sequence to

optimize acquire speed. Thus, if only 14 keys are actually

enabled, only 14 timeslots are used for scanning.

1 Overview

1.1 Introduction

QT60xx0 devices are digital burst mode charge-transfer (QT)

sensors designed specifically for matrix geometry touch

controls; they include all signal processing functions

necessary to provide stable sensing under a wide variety of

changing conditions. Only a few external parts are required

for operation. The entire circuit can be built within a few

square centimeters of single-sided PCB area. CEM-1 and

FR1 punched, single-sided materials can be used for the

lowest possible cost. The PCB’s rear can be mounted flush

on the back of a glass or plastic panel using a conventional

adhesive, such as 3M VHB two-sided adhesive acrylic film.

2 Hardware and Functional

2.1 Matrix Scan Sequence

The circuit operates by scanning each key sequentially, key

by key. Key scanning begins with location X=0 / Y=0 (key #0).

X axis keys are known as rows while Y axis keys are referred

to as columns. Keys are scanned sequentially by row, for

example the sequence X0Y0 X1Y0 .... X7Y0, X0Y1, X1Y1...

etc. Keys are also numbered from 0...23. Key 0 is located at

X0Y0. Table 4.3, page 12 shows the key numbering.

Figure 1.1 Field Flow Between X and Y Elements

overlying panel

Each key is sampled in a burst of acquisition pulses whose

length is determined by the Setups parameter BL (page 17),

which can be set on a per-key basis. A burst is completed

entirely before the next key is sampled; at the end of each

burst the resulting signal is converted to digital form and

processed. The burst length directly impacts key gain; each

key can have a unique burst length in order to allow tailoring

of key sensitivity on a key-by-key basis.

element

2.2 Disabling Keys - Burst Paring

Keys that are disabled by setting NDIL =0 (Section 6.6, page

16) have their bursts pared from the scan sequence to save

time. This has the consequence of affecting the scan rate of

the entire matrix as well as the time required for initial matrix

calibration.

QT60xx0 parts employ transverse charge-transfer ('QT')

sensing, a technology that senses changes in electrical

charge forced across an electrode by a pulse edge

(Figure 1.1). QT60xx0 devices allow a wide range of key sizes

and shapes to be mixed together in a single touch panel.

The devices use an I²C interface to allow key data to be

extracted and to permit individual key parameter setup. The

command structure is designed to minimize the amount of

data traffic while maximizing the amount of information

conveyed.

Reducing the number of enabled keys also reduces the time

required to calibrate an individual key once the matrix is initially

calibrated after power-up or reset, since the total cycle time is

proportional to the number of enabled keys.

2.3 Sample Capacitors - Saturation

In addition to normal operating and setup functions the device

can also report back actual signal strengths .

The charge sampler capacitors on the Y pins should be the

values shown (Figure 2.7, page 9). They should be X7R or

NP0 ceramics or PPS film. The value of these capacitors is

not critical but 4.7nF is recommended for most cases.

QmBtn™ software for the PC can be used to program the

operation of the IC, as well as read back key status and

signal levels in real time.

Cs voltage saturation is shown in Figure 2.1. This nonlinearity

is caused by excessive negative voltage on Cs inducing

conduction in the pin protection diodes. This badly saturated

signal destroys key gain and introduces a strong thermal

coefficient which can cause 'phantom' detection. The cause of

this is usually from the burst length being too long, the Cs

value being too small, or the X-Y coupling being too large.

Solutions include loosening up the interdigitation of key

structures, separating X and Y lines on the PCB more,

increasing Cs, and decreasing the burst length.

1.2 Part Differences

The QT60160 and QT60240 are electrically identical, with the

exception of the number of keys which may be sensed.

Versions of the device are capable of a maximum of 16 or 24

keys (QT60160 and QT60240 respectively).

For QT60160, only Y0 and Y1 can be used to determine the

placement of a maximum of 16 keys. For QT60240, Y0, Y1

and Y2 can be used to determine the placement of a

maximum 24 keys.

Increasing Cs will make the part slower; decreasing burst

length will make it less sensitive. A better PCB layout and a

looser key structure (up to a point) have no negative effects.

The length of the setup blocks are different:

•

83 bytes on the QT60160

123 bytes on the QT60240

Cs voltages should be observed on an oscilloscope with the

matrix layer bonded to the panel material; if the Rs side of

any Cs ramps more negative than -0.25 volts during any burst

(not counting overshoot spikes which are probe artifacts),

there is a potential saturation problem.

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Figure 2.2 shows a defective waveform similar to that of 2.1,

but in this case the distortion is caused by excessive stray

capacitance coupling from the Y line to AC ground. For

example, from running too near and too far alongside a

ground trace, ground plane, or other traces. The excess

coupling causes the charge-transfer effect to dissipate a

significant portion of the received charge from a key into the

stray capacitance. This phenomenon is more subtle; it can be

best detected by increasing BL to a high count and watching

what the waveform does as it descends towards and below

-0.25V. The waveform will appear deceptively straight, but it

will slowly start to flatten even before the -0.25V level is

reached.

Figure 2.1 VCs - Non-Linear During Burst

(Burst too long, or Cs too small, or X-Y capacitance too large)

Figure 2.2 VCs - Poor Gain, Non-Linear During

Burst

A correct waveform is shown in Figure 2.3. Note that the

bottom edge of the bottom trace is substantially straight

(ignoring the downward spikes).

(Excess capacitance from Y line to Gnd)

Unlike other QT circuits, the Cs capacitor values on QT60xx0

devices have no effect on conversion gain. However, they do

affect conversion time.

Unused Y lines should be left open.

2.4 Sample Resistors

There are three sample resistors (Rs) (two on the QT60160)

used to perform single-slope ADC conversion of the acquired

charge on each Cs capacitor. These resistors directly control

acquisition gain; larger values of Rs will proportionately

Figure 2.3 VCs - Correct

increase signal gain. Values of Rs can range from 380K

1M . 470K is a reasonable value for most purposes.

✡ to

✡

Unused Y lines do not require an Rs resistor.

2.5 Signal Levels

Quantum’s QmBtn software makes it is easy to observe the

absolute level of signal received by the sensor on each key.

The signal values should normally be in the range of 250 to

750 counts with properly designed key shapes and values of

Rs. However, long adjacent runs of X and Y lines can also

artificially boost the signal values, and induce signal

saturation; this is to be avoided. The X-to-Y coupling should

come mostly from intra-key electrode coupling, not from stray

X-to-Y trace coupling.

Figure 2.4 X-Drive Pulse Roll-off and Dwell Time

Lost charge due to

inadequate settling

before end of dwell time

X drive

QmBtn software is available free of charge on Quantum’s

website www.qprox.com.

Dwell time

Y gate

The signal swing from the smallest finger touch should

preferably exceed 10 counts, with 15 being a reasonable

target. The signal threshold setting (NTHR) should be set to a

value guaranteed to be less than the signal swing caused by

the smallest touch.

Increasing the burst length (BL) parameter will increase the

signal strengths as will increasing the sampling resistor (Rs)

values.

2.6 Matrix Series Resistors

The X and Y matrix scan lines should use series resistors

(referred to as Rx and Ry respectively) for improved EMI

performance (Figure 2.7, page 9).

X drive lines require them in most cases to reduce edge rates

and thus reduce RF emissions. Typical values range from

1K✡ to 20K✡.

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Figure 2.5 Probing X-Drive Waveforms With a

Coin

Figure 2.6 Recommended Key Structure

‘T’ should ideally be similar to the complete thickness the

fields need to penetrate to the touch surface. Smaller

dimensions will also work but will give less signal strength. If

in doubt, make the pattern coarser.

One way to determine X line settling time is to monitor the

fields using a patch of metal foil or a small coin over the key

(Figure 2.5). Only one key along a particular X line needs to

be observed, as each of the keys along that X line will be

identical. The 375ns dwell time should exceed the observed

95% settling of the X-pulse by 25% or more.

In almost all case, Ry should be set equal to Rx, which will

ensure that the charge on the Y line is fully captured into the

Cs capacitor.

Y lines need them to reduce EMC susceptibility problems and

in some extreme cases, ESD. Typical Y values are about

1K✡. Y resistors act to reduce noise susceptibility problems

by forming a natural low-pass filter with the Cs capacitors.

2.7 Key Design

It is essential that the Rx and Ry resistors and Cs capacitors

be placed very close to the chip. Placing these parts more

than a few millimeters away opens the circuit up for high

frequency interference problems (above 20MHz) as the trace

lengths between the components and the chip start to act as

RF antennae.

Circuits can be constructed out of a variety of materials

including flex circuits, FR4, and even inexpensive

single-sided CEM-1.

The actual internal pattern style is not as important as the

need to achieve regular X and Y widths and spacings of

sufficient size to cover the desired graphical key area or a

little bit more; ~3mm oversize is acceptable in most cases,

since the key’s electric fields drop off near the edges anyway.

The overall key size can range from 10mm x 10mm up to

100mm x 100mm but these are not hard limits. The keys can

be any shape including round, rectangular, square, etc. The

internal pattern can be as simple as a single bar of Y within a

solid perimeter of X, or (preferably) interdigitated as shown in

Figure 2.6.

The upper limits of Rx and Ry are reached when the signal

level and hence key sensitivity are clearly reduced. The limits

of Rx and Ry will depend on key geometry and stray

capacitance, and thus an oscilloscope is required to

determine optimum values of both.

Dwell time is the duration in which charge coupled from X to

Y is captured. Increasing Rx values will cause the leading

edge of the X pulses to increasingly roll off, causing the loss

of captured charge (and hence loss of signal strength) from

the keys.

For better surface moisture suppression, the outer perimeter

of X should be as wide as possible, and there should be no

ground planes near the keys. The variable ‘T’ in this drawing

represents the total thickness of all materials that the keys

must penetrate.

The dwell time of these parts is fixed at 375ns. If the X pulses

have not settled within 375ns, key gain will be reduced; if this

happens, either the stray capacitance on the X line(s) should

be reduced (by a layout change, for example by reducing X

line exposure to nearby ground planes or traces), or, the Rx

resistor needs to be reduced in value (or a combination of

both approaches).

2.8 PCB Layout, Construction

2.8.1 Overview

It is best to place the chip near the touch keys on the same

PCB so as to reduce X and Y trace lengths, thereby reducing

the chances for EMC problems. Long connection traces act

as RF antennae. The Y (receive) lines are much more

susceptible to noise pickup than the X (drive) lines.

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Even more importantly, all signal related discrete parts

(resistors and capacitors) should be very close to the body of

the chip. Wiring between the chip and the various resistors

and capacitors should be as short and direct as possible to

suppress noise pickup.

A single ceramic 0.1uF bypass capacitor should be placed

very close to supply pins 3, 4, 5 and 6 of the IC. Pins 18, 20,

and 21 do not require bypassing.

Vdd can range from +1.8V to +5V nominal.

2.10 Startup / Calibration Times

The devices require initialization times of <1ms. A calibration

takes one matrix scan.

Ground planes and traces should NOT

be used around the keys and the Y lines

from the keys. Ground areas, traces, and

other adjacent signal conductors that act

Disabled keys are subtracted from the burst sequence and

thus the cal time is shortened. The scan time should be

measured on an oscilloscope.

as AC ground (such as Vdd and LED drive

lines etc) will absorb the received key signals and

reduce signal-to-noise ratio (SNR) and thus will be

counterproductive. Ground planes around keys will also

make water film effects worse.

2.11 Reset Input

The /RST pin can be used to reset the device to simulate a

power down cycle, in order to bring the part up into a known

state should communications with the part be lost. The pin is

active low, and a low pulse lasting at least 10µs must be

applied to this pin to cause a reset.

Ground planes, if used, should be placed under or around the

QT chip itself and the associated resistors and capacitors in

the circuit, under or around the power supply, and back to a

connector, but nowhere else.

The reset pin has an internal 30K✡ - 60K✡ resistor. A 2.2µF

capacitor plus a diode to Vdd can be connected to this pin as

a traditional reset circuit, but this is not required.

If an external hardware reset is not used, the reset pin may

be connected to Vdd or left floating.

2.8.2 LED Traces and Other Switching Signals

Digital switching signals near the Y lines will induce transients

into the acquired signals, deteriorating the SNR perfomance

of the device. Such signals should be routed away from the Y

lines, or the design should be such that these lines are not

switched during the course of signal acquisition (bursts).

2.12 Spread Spectrum Acquisitions

QT60xx0 devices use spread-spectrum burst modulation.

This has the effect of drastically reducing the possibility of

EMI effects on the sensor keys, while simultaneously

spreading RF emissions. This feature is hard-wired into the

device and cannot be disabled or modified.

LED terminals which are multiplexed or switched into a

floating state and which are within or physically very near a

key structure (even if on another nearby PCB) should be

bypassed to either Vss or Vdd with at least a 10nF capacitor

of any type, to suppress capacitive coupling effects which can

induce false signal shifts. LED terminals which are constantly

connected to Vss or Vdd do not need further bypassing.

Spread spectrum is configured as a frequency chirp over a

wide range of frequencies for robust operation.

2.13 Detection Integrators

See also Section 6.6, page 16.

2.8.3 PCB Cleanliness

All capacitive sensors should be treated as highly sensitive

circuits which can be influenced by stray conductive leakage

paths. QT devices have a basic resolution in the femtofarad

range; in this region, there is no such thing as ‘no clean flux’.

Flux absorbs moisture and becomes conductive between

solder joints, causing signal drift and resultant false

detections or transient losses of sensitivity or instability.

Conformal coatings will trap in existing amounts of moisture

which will then become highly temperature sensitive.

The devices feature a detection integration mechanism, which

acts to confirm a detection in a robust fashion. A per-key

counter is incremented each time the key has exceeded its

threshold and stayed there for a number of acquisitions.

When this counter reaches a preset limit the key is finally

declared to be touched.

For example, if the limit value is 10, then the device has to

exceed its threshold and stay there for 10 acquisitions in

succession without going below the threshold level, before

the key is declared to be touched. If on any acquisition the

signal is not seen to exceed the threshold level, the counter is

cleared and the process has to start from the beginning.

The designer should specify ultrasonic cleaning as part of the

manufacturing process, and in cases where a high level of

humidity is anticipated, the use of conformal coatings after

cleaning to keep out moisture.

The QT60xx0 uses a two-tier confirmation mechanism having

two such counters for each key. These can be thought of as

‘inner loop’ and ‘outer loop’ confirmation counters.

2.9 Power Supply Considerations

As these devices use the power supply itself as an analog

reference, the power should be very clean and come from a

separate regulator. A standard inexpensive Low Dropout

(LDO) type regulator should be used that is not also used to

power other loads such as LEDs, relays, or other high current

devices. Load shifts on the output of the LDO can cause Vdd

to fluctuate enough to cause false detection or sensitivity

shifts.

The ‘inner’ counter is referred to as the ‘fast-DI’; this acts to

attempt to confirm a detection via rapid successive

acquisition bursts, at the expense of delaying the sampling of

the next key. Each key has its own fast-DI counter and limit

value; these limits can be changed via the Setups block on a

per-key basis.

QT60240-XSG X7.04/0706

Preliminary information; subject to change

The ‘outer’ counter is referred to as the ‘normal-DI’; this DI

counter increments whenever the fast-DI counter has reached

its limit value. If a fast-DI counter failed to reach its terminal

count, the corresponding normal-DI counter is also reset. The

normal-DI counter also has a limit value which is settable on

a per-key basis. If a normal-DI counter reaches its terminal

count, the corresponding key is declared to be touched and

becomes ‘active’. Note that the normal-DI can only be

incremented once per complete keyscan cycle, i .e. more

slowly, whereas the fast-DI is incremented ‘on the spot’

without interruption.

A new communication with the device while it is asleep will

cause it to wake up, service the communication and scan the

matrix. At least one full matrix scan is always performed after

waking up and before returning to sleep.

At the end of each matrix scan, the part will return to sleep

unless recent activity demands further attention. If there has

been recent activity, the part will perform another complete

matrix scan and then attempt to sleep once again. This

process is repeated indefinitely until the activity stops and the

part returns to sleep.

Key touch activity will prevent the part from sleeping, as will

recent communications by the host. The part will not sleep if

any touch events were detected at any key in the most recent

scan of the key matrix.

The net effect of this mechanism is a multiplication of the

inner and outer counters and hence a highly noise-resistance

sensing method. If the inner limit is set to 5, and the outer to

3, the net effect is 5x3=15 successive threshold crossings to

declare a key as active.

A recent communication from the host will also prevent the

part from sleeping. The device tracks the time elapsed since

the last host communication and prevents the part from

sleeping while the elapsed time is less than the ‘Awake

Timeout’; this helps prevent the part from falling asleep part

way through a host communication. The ‘Awake Timeout’ can

be configured.

2.14 Sleep

The device will sleep whenever possible to conserve power.

Periodically, the part will wake automatically, scan the matrix,

and return to sleep unless there is activity which demands

further attention. The part will always return to sleep

automatically once all activity has ceased. The time for which

the part will sleep before automatically awakening can be

configured.

QT60240-XSG X7.04/0706

Preliminary information; subject to change

2.15 Wiring

Table 2.1 Pin Listing

Function

M_SYNC

DETECT

Vss

I/O

Comments

If Unused, Connect To...

Mains Sync input

Vdd

Detect output

Leave open

Supply ground

Vdd

Power, +1.8V to +5V

Supply ground

Vss

Vdd

Power, +1.8V to +5V

X matrix drive line

Leave open

X matrix drive line

Leave open

LATCH

Vref

S_SYNC

Shift Register Latch Output

Ground

Leave open

Scope Sync: Synchronization test signal

X matrix drive line

Leave open

X matrix drive line

Leave open

X matrix drive line

Leave open

X matrix drive line

Leave open

X matrix drive line

Leave open

X matrix drive line

Leave open

Vdd

Power, +1.8V to +5V

Com port address 1

Power, +1.8V to +5V

Supply ground

Vdd

Vss

Com port address 0

Y line connection

Leave open

Y0B

Y1B

Y2B

SMP

SDA

SCL

/RST

Y0A

Y1A

Y2A

Y line connection

Y line connection (QT60240 only)

Sample output.

I/O

Serial Interface Data

Serial Interface Clock

Reset low; has internal 20K - 100K pullup

Y line connection

Leave open or Vdd

Leave open

Y line connection

Y line connection (QT60240 only)

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Figure 2.7 Wiring Diagram

See Table 2.1 for further connection information.

VDD

+1.8V to +5V

Vunreg

VREG

*RX7

follow regulator manufacturers

*RX6

VDD

recommended values for input and

output bypass capacitors; keep output

capacitor close to QT60xx0 pin 4 and 6.

If not possible, add a 100nF capacitor

next to those pins.

*RX5

*RX4

QT60240

QT60160

*RX3

10K 10K

*RX2

*RX1

SDA

SCL

I2C

*RX0

DETECT

LATCH

* optional - for emission suppression

** optional - for RF susceptibility improvement

**RY0

MAINS SYNC

SCOPE SYNC

CS0

CS1

CS2

4.7nF

**RY1

Note

**RY2

RS2 RS1 RS0

Note: Leave Y2A, Y2B unconnected

for QT60160

QT60240-XSG X7.04/0706

Preliminary information; subject to change

The shift register data is output over the duration of a matrix

scan, as each key is being processed, and it is latched at the

end of the scan. The overall communication time depends on

the matrix scan time.

3 Interfaces

3.1 Introduction

The QT60xx0 can be configured to communicate either over

an I²C bus or a shift register type SPI. See Table 3.1 for

interface details.

Table 3.2 Shift Register

Parameter

Units

Table 3.1 Interface Details

SCL pulse width

LATCH pulse width

SDA data to SCL clock hold time

250ns min

Vss

Vdd

Vss

Vdd

Vss

Vdd

Interface

Shift Register

I²C Address 7

I²C Address 17

I²C Address 117

3.3 I²C Port

These devices use I²C communications, in slave mode only.

Pin 2 (DETECT) is a push-pull output and can be used in

conjunction with the I²C interface to alert the host to key

touches. Every key can be configured to wake the host. This

output is set active when any key configured so confirms a

touch. The device will also set this output active to keep the

host advised of touch changes on any key if the host is

keeping the device awake by communicating. Pin 2 is set

inactive when the host performs a read from any location. Pin

2 is active high (Vdd) to alert the host. This output is useful

with the I²C interface only and should be ignored if the Shift

The QT60160/60240 will only respond to the correct address

match. I²C operating parameters are as follows:

Max Data Transfer:

Address:

100KHz

7-bit

The match address is selected via pins A0 and A1. Table 3.1

shows the address map.

The QT60160/60240 allows multiple byte transmissions to

provide a more efficient communication. This is particularly

useful to retrieve several information bytes at once. Every

time the host retrieves data from the QT60160/60240, the

internal address is incremented.

3.2 Shift Register Output

When the option jumpers are both set at Vss, the device

disables the I²C interface and instead generates output

suitable for driving a shift register.

Therefore, the host only needs to write the initial address of

interest (the lowest address), followed by read cycles for as

many bytes as required.

The shift register data is output at pin 27 (SDA). The clock is

output at pin 28 (SCL). The data is clocked on the

positive-going transition of SCL. Data is transferred from the

shift registers to the latched outputs on the positive-going

transition of LATCH. An example shift register connection is

shown in Figure 3.1.

Figure 3.1 Shift Register Output

74HC595

QT60240

SDA

QT60160

SDA

SH_CP Q4

ST_CP

SH_CP

ST_CP

Outputs, keys 16 to 23

Outputs, keys 8 to 15

Outputs, keys 0 to 7

Outputs, keys 8 to 15

SCL

Latch

SCL

Latch

/Q7

74HC595

SH_CP

ST_CP

Outputs, keys 0 to 7

SH_CP

ST_CP

/Q7

74HC595

SH_CP

ST_CP

/Q7

Preliminary information; subject to change

QT60240-XSG X7.04/0706

The host initiates the transfer by sending the START

condition, and follows this by sending the slave address of

the device together with the Write-bit. The device sends an

ACK. The host then sends the memory address within the

device it wishes to write to. The device sends an ACK. The

host transmits one or more data bytes; each will be

acknowledged by the device.

4 Control Commands

4.1 Introduction

The devices feature a set of commands which are used for

control and status reporting.

As well as Tables 4.1 and 4.2, refer to Table 6.1, page 19 and

Table 6.2, page 20 for further details.

If the host sends more than one data byte, they will be written

to consecutive memory addresses. The device automatically

increments the target memory address after writing each data

byte. After writing the last data byte, the host should send the

STOP condition.

Table 4.1 Memory Map for QT60160

Address

Use

Access

Part Revision

Detect status for keys 0 to 7, one bit

per key

Read

The host should not try to write beyond address 255 because

the device will not increment the internal memory address

beyond this.

Detect status for keys 8 to 15, one bit

per key

Read

Write

4 to 84

125

Data for keys 0 to 15, in sequence.

Refer to Table 4.4 for details

Recalibrate all keys. Write 0x55 to

this address location to recalibrate all

the keys

4.3 Reading Data From the Device

The sequence of events required to read data from the device

is shown next.

130

Setups write-unlock. Write 0x55

immediately before writing setups

Setups - refer to Table 5.1 for details

Write

Host to Device

Device Tx to Host

SLA+R

131 to

213

Read/Write

SLA+W

Data 1

MemAddress A

Data 2

Data n

Table 4.2 Memory Map for QT60240

Key

SLA+W

MemAddress

Address

Use

Access

Start condition

Part Revision

Detect status for keys 0 to 7, one bit

per key

Read

Slave address plus write bit

Acknowledge bit

Target memory address within

device

Data from device

Detect status for keys 8 to 15, one bit

per key

Detect status for keys 16 to 23, one

bit per key

Data for keys 0 to 23, in sequence.

Refer to Table 4.4 for details

Recalibrate all keys. Write 0x55 to

this address location to recalibrate all

the keys

Read

Write

Data

SLA+R

Stop condition

Slave address plus read bit

Not Acknowledge bit/indicates

last byte transmission

4 to 124

125

The host initiates the transfer by sending the START

condition, and follows this by sending the slave address of

the device together with the Write-bit. The device sends an

ACK. The host then sends the memory address within the

device it wishes to read from. The device sends an ACK.

130

Setups write-unlock. Write 0x55

immediately before writing setups

Setups - refer to Table 5.2 for details

Write

131 to

253

Read/Write

The host must then send a STOP and a START condition

followed by the slave address again but this time

4.2 Writing Data to the Device

The sequence of events required to write data to the device is

shown next.

accompanied by the Read-bit. The device will return an ACK,

followed by a data byte. The host must return either an ACK

or NACK. If the host returns an ACK, the device will

subsequently transmit the data byte from the next address.

Each time a data byte is transmitted, the device automatically

increments the internal address. The device will continue to

return data bytes until the host responds with a NACK. The

host should terminate the transfer by issuing the STOP

condition.

Host to Device

MemAddress

Device Tx to Host

Data

SLA+W

Key

Start condition

SLA+W

MemAddress

Slave address plus write bit

Acknowledge bit

Target memory address within

device

Data to be written

Stop condition

4.4 Report Detections for All Keys

Address 1: detect status for keys 0 to 7

Address 2: detect status for keys 8 to 15

Address 3: detect status for keys 16 to 23 (QT60240 only)

Data

Each location indicates all keys in detection, if any, as a

bitfield; active keys report as 1’s, disabled keys report as

inactive (0).

Preliminary information; subject to change

QT60240-XSG X7.04/0706

4.6 Cal All

Table 4.3 Bits for Key Reporting and Numbering

A value of 0x55 must be written to the address 125. Upon

receiving this command the QT60xx0 will recalibrate all of the

keys. Recalibration will start at the beginning of the next full

matrix scan. The device will not sleep during the calibration

period.

Bit Number

Address

4.7 Setups

The location “Setups write-unlock”, address 130, allows write

access to the setups. Normally the setups are write-protected;

the write protection is engaged as soon as a read operation is

performed at any address. By writing a value of 0x55 to this

address, the write-protection is disengaged. This address is

located conveniently immediately before the setups so that

the write protection may be disengaged and the setups

written in a single I²C communication sequence. Reading this

address is undefined.

4.5 Raw Data Commands

Addresses 4 to 84 inclusive for the QT60160 and 4 to 124 for

the QT60240 allow data to be read for each key. The

QT60160 has a total of 16 keys and 5 bytes of data per key,

yielding a total of 80 addresses. The QT60240 has a total of

24 keys and 5 bytes of data per key, yielding a total of 120

addresses. These addresses are read-only.

The data for the keys is mapped in sequence, starting with

key 0 at addresses 4 to 8. The data for key 15 is located at

addresses 80 to 84, and that for key 23 is located at

addresses 120 to 124. Table 4.4 summarizes this.

Addresses 131 to 212 on the QT60160 and addresses 131 to

252 on the QT60240 provide read/write access to the setups.

Details of different setups can be found in Section 5.

There are five bytes of data for each key. The first two are the

key’s 16-bit signal, and the second two are the key’s 16-bit

reference. These are followed by the Detect Integrator Count,

which is a 4-bit value stored in the lower nibble. In the case of

both the signal and reference, the 16-bit values are accessed

as two 8-bit bytes, stored LSB first.

When the host is writing a new setup block the values are

being recorded into EEPROM as they arrive from the host.

Table 4.4 Key Data

Address

Key #

Use

Signal LSB

Signal MSB

Reference LSB

Reference MSB

DetectCount (lower nibble)

Signal LSB

Signal MSB

Reference LSB

Reference MSB

DetectCount (lower nibble)

Signal LSB

Signal MSB

Reference LSB

Reference MSB

DetectCount (lower nibble)

Range of values

Signal LSB

19 to 119

120

121

122

123

124

3 to 22

Signal MSB

Reference LSB

Reference MSB

DetectCount (lower nibble)

Preliminary information; subject to change

QT60240-XSG X7.04/0706

5 I²C Operation

5.1 Interface Bus

5.3 START and STOP Conditions

The host initiates and terminates a data transmission. The

transmission is initiated when the host issues a START

condition on the bus, and is terminated when the host issues

a STOP condition. Between START and STOP conditions, the

bus is considered busy. As shown below, START and STOP

conditions are signaled by changing the level of the SDA line

when the SCL line is high.

More detailed information about I²C is available from

www.i2C-bus.org. Devices are connected onto the I²C bus as

shown in Figure 5.1. Both bus lines are connected to Vdd via

pull-up resistors. The bus drivers of all I²C devices must be

open-drain type. This implements a wired-AND function which

allows any and all devices to drive the bus, one at a time. A

low level on the bus is generated when a device outputs a

zero.

Figure 5.3 START and STOP Conditions

Figure 5.1 I²C Interface Bus

SDA

SCL

Vcc

Device 1 Device 2 Device 3

Device n

START

STOP

SDA

SCL

5.4 Address Packet Format

All address packets are 9 bits long, consisting of 7 address

bits, one READ/WRITE control bit and an acknowledge bit. If

the READ/WRITE bit is set, a read operation is performed,

otherwise a write operation is performed. When the device

recognizes that it is being addressed, it will acknowledge by

pulling SDA low in the ninth SCL (ACK) cycle. An address

packet consisting of a slave address and a READ or a

WRITE bit is called SLA+R or SLA+W, respectively.

Table 5.1 I²C Bus Specifications

Parameter

Unit

Address space

7-bit

Maximum bus speed (SCL)

Hold time START condition

Setup time for STOP condition

Bus free time between a STOP and START

condition

100 kHz

The most significant bit of the address byte is transmitted

first. The address sent by the host must be consistent with

that selected with the option jumpers.

4µs min.

4.7µs min.

Figure 5.4 Address Packet Format

Addr MSB

Addr LSB R/W

ACK

5.2 Transferring Data Bits

SDA

SCL

Each data bit transferred on the bus is accompanied by a

pulse on the clock line. The level of the data line must be

stable when the clock line is high; The only exception to this

rule is for generating start and stop conditions.

START

Figure 5.2 Data Transfer

5.5 Data Packet Format

All data packets are 9 bits long, consisting of one data byte

and an acknowledge bit. During a data transfer, the host

generates the clock and the START and STOP conditions,

while the Receiver is responsible for acknowledging the

reception. An acknowledge (ACK) is signaled by the Receiver

pulling the SDA line low during the ninth SCL cycle. If the

Receiver leaves the SDA line high, a NACK is signaled.

SDA

SCL

Data Stable

Data Change

Preliminary information; subject to change

QT60240-XSG X7.04/0706

Figure 5.6 shows a typical data transmission. Note that

several data bytes can be transmitted between the SLA+R/W

and the STOP.

5.6 Combining Address and Data Packets

Into a Transmission

A transmission consists of a START condition, an SLA+R/W,

one or more data packets and a STOP condition. The

wired-ANDing of the SCL line is used to implement

handshaking between the host and the device. The device

extends the SCL low period by pulling the SCL line low

whenever it needs extra time for processing between the data

transmissions.

Figure 5.5 Data Packet Format

Data MSB

Data LSB ACK

Aggregate

SDA

SDA from

Transmitter

SDA from

Receiver

SCL from

Master

STOP,

Data Byte

SLA+R/W

Next Data Byte

Figure 5.6 Packet Transmission

Addr MSB

Addr LSB R/W

ACK

Data MSB

Data LSB ACK

SDA

SCL

START

SLA+R/W

Data Byte

STOP

Preliminary information; subject to change

QT60240-XSG X7.04/0706

6.3 Positive Threshold - PTHR

6 Setups

6.1 Introduction

The devices calibrate and process all signals using a

number of algorithms specifically designed to provide for

high survivability in the face of adverse environmental

challenges. They provide a large number of processing

options which can be user-selected to implement very

flexible, robust keypanel solutions.

The positive threshold is used to provide a mechanism for

recalibration of the reference point when a key's signal

moves abruptly to the positive. This condition is not

normal, and usually occurs only after a recalibration when

an object is touching the key and is subsequently removed.

The desire is normally to recover from these events

quickly.

Positive hysteresis: PHYST is fixed at 12.5% of the

positive threshold value and cannot be altered.

User-defined Setups are employed to alter these

algorithms to suit each application. These setups are

loaded into the device over the I²C serial interfaces. The

Setups are stored in an onboard EEPROM array.

Positive threshold levels are all fixed at 6 counts of signal

and cannot be modified.

Many setups employ lookup-table value translation.

Table 6.3, the Setups Lookup Table on page 21 shows all

translation values. The default values are the factory

defaults.

6.4 Positive Recalibration Delay - PRD

A recalibration occurs automatically if the signal swings

more positive than the positive threshold level. This

condition can occur if there is positive drift but insufficient

positive drift compensation, or, if the reference moved

negative due to a NRD auto-recalibration, and thereafter

the signal rapidly returned to normal (positive excursion).

Refer to Table 6.1, page 19 and Table 6.2, page 20 for all

Setups.

As an example of the latter, if a foreign object or a finger

contacts a key for period longer than the Negative Recal

Delay (NRD), the key is by recalibrated to a new lower

reference level. Then, when the condition causing the

negative swing ceases to exist (e.g. the object is removed)

the signal suddenly swings positive to its normal reference.

6.2 Negative Threshold - NTHR

The negative threshold value is established relative to a

key’s signal reference value. The threshold is used to

determine key touch when crossed by a negative-going

signal swing after having been filtered by the detection

integrator. Larger absolute values of threshold desensitize

keys since the signal must travel farther in order to cross

the threshold level. Conversely, lower thresholds make

keys more sensitive.

It is almost always desirable in these cases to cause the

key to recalibrate quickly so as to restore normal touch

operation. The time required to do this is governed by

PRD. In order for this to work, the signal must rise through

the positive threshold level PTHR continuously for the PRD

period.

As Cx and Cs drift, the reference point drift-compensates

for these changes at a user-settable rate; the threshold

level is recomputed whenever the reference point moves,

and thus it also is drift compensated.

After the PRD interval has expired and the auto-

recalibration has taken place, the affected key will once

again function normally. PRD is fixed at 1 second for all

keys, and cannot be altered.

The amount of NTHR required depends on the amount of

signal swing that occurs when a key is touched. Thicker

panels or smaller key geometries reduce ‘key gain’, i .e.

signal swing from touch, thus requiring smaller NTHR

values to detect touch.

PRD Accuracy:

to within ± 50ms

The negative threshold is programmed on a per-key basis

using the Setup process. See Table 6.3, page 21.

Negative hysteresis: NHYST is fixed at 12.5% of the

negative threshold value and cannot be altered.

Typical values:

3 to 8

(7 to 12 counts of threshold; 4 is internally added to

NTHR to generate the threshold).

Default value:

(10 counts of threshold)

Figure 6.1 Thresholds and Drift Compensation

Reference

Hysteresis

Threshold

Signal

Output

Preliminary information; subject to change

QT60240-XSG X7.04/0706

To suppress false detections caused by spurious events

like electrical noise, the device incorporates a 'detection

integrator' or DI counter mechanism that acts to confirm a

detection by consensus (all detections in sequence must

agree). The DI mechanism counts sequential detections of

a key that appears to be touched, after each burst for the

key. For a key to be declared touched, the DI mechanism

must count to completion without even one detection

failure.

6.5 Drift Compensation - NDRIFT, PDRIFT

Signals can drift because of changes in Cx and Cs over

time and temperature. It is crucial that such drift be

compensated, else false detections and sensitivity shifts

can occur.

Drift compensation (Figure 6.1) is performed by making the

reference level track the raw signal at a slow rate, but only

while there is no detection in effect. The rate of adjustment

must be performed slowly, otherwise legitimate detections

could be ignored. The devices drift compensate using a

slew-rate limited change to the reference level; the

threshold and hysteresis values are slaved to this

reference.

The DI mechanism uses two counters. The first is the ‘fast

DI’ counter FDIL. When a key’s signal is first noted to be

below the negative threshold, the key enters ‘fast burst’

mode. In this mode the burst is rapidly repeated for up to

the specified limit count of the fast DI counter. Each key

has its own counter and its own specified fast-DI limit

(FDIL), which can range from 1 to 15. When fast-burst is

entered the QT device locks onto the key and repeats the

acquire burst until the fast-DI counter reaches FDIL, or, the

detection fails beforehand. After this the device resumes

normal keyscanning and goes on to the next key.

When a finger is sensed, the signal falls since the human

body acts to absorb charge from the cross-coupling

between X and Y lines. An isolated, untouched foreign

object (a coin, or a water film) will cause the signal to rise

very slightly due to an enhancement of coupling. This is

contrary to the way most capacitive sensors operate.

Once a finger is sensed, the drift compensation

mechanism ceases since the signal is legitimately

detecting an object. Drift compensation only works when

the signal in question has not crossed the neg ative

threshold level.

The ‘Normal DI’ counter counts the number of times the

fast-DI counter reached its FDIL value. The Normal DI

counter can only increment once per complete scan of all

keys. Only when the Normal DI counter reaches NDIL does

the key become formally ‘active’.

The drift compensation mechanism can be asymmetric; the

drift-compensation can be made to occur in one direction

faster than it does in the other simply by changing the

NDRIFT and PDRIFT Setup parameters. This can be done

on a per-key basis.

The net effect of this is that the sensor can rapidly lock

onto and confirm a detection with many confirmations,

while still scanning other keys. The ratio of ‘fast’ to ‘normal’

counts is completely user-settable via the Setups process.

The total number of required confirmations is equal to FDIL

times NDIL.

Specifically, drift compensation should be set to compensate

faster for increasing signals than for decreasing signals.

Decreasing signals should not be compensated quickly,

since an approaching finger could be compensated for

partially or entirely before even touching the touch pad.

However, an obstruction over the sense pad, for which the

sensor has already made full allowance, could suddenly be

removed leaving the sensor with an artificially suppressed

reference level and thus become insensitive to touch. In

this latter case, the sensor should compensate for the

object's removal by raising the reference level relatively

quickly.

If FDIL = 5 and NDIL = 2, the total detection confirmations

required is 10, even though the device only scanned

through all keys only twice.

The DI is extremely effective at reducing false detections at

the expense of slower reaction times. In some applications

a slow reaction time is desirable. The DI can be used to

intentionally slow down touch response in order to require

the user to touch longer to operate the key.

If FDIL = 1, the device functions conventionally. Each

channel acquires only once in rotation, and the normal

detect integrator counter (NDIL) operates to confirm a

detection. Fast-DI is in essence not operational.

Drift compensation and the detection time-outs work

together to provide for robust, adaptive sensing. The

time-outs provide abrupt changes in reference calibration

depending on the duration of the signal 'event'.

If FDIL m 2, then the fast-DI counter also operates in

addition to the NDIL counter.

NDRIFT Typical values:

(2 to 3.3 seconds per count of drift compensation)

NDRIFT Default value: 10

(2.5s / count of drift compensation)

9 to 11

If Signal [ NTHR: The fast-DI counter is incremented

towards FDIL due to touch.

If Signal >NTHR then the fast-DI counter is cleared due to

lack of touch.

PDRIFT Typical values:

3 to 5

Disabling a key: If NDIL =0, the key becomes disabled.

Keys disabled in this way are pared from the burst

sequence in order to improve sampling rates and thus

response time. See Section 2.2, page 3.

(

0.4 to 0.8 seconds per count of drift compensation;

translation via LUT, page )

PDRIFT Default value:

(0.6s / count of drift compensation)

NDIL Typical values:

NDIL Default value:

FDIL Typical values:

FDIL Default value:

2, 3

4 to 6

6.6 Detect Integrators - NDIL, FDIL

NDIL is used to enable or disable keys and to provide

signal filtering. To enable a key, its NDIL parameter should

be nonzero (ie NDIL=0 disables a key). See Section 2.2.

Preliminary information; subject to change

QT60240-XSG X7.04/0706

6.7 Negative Recal Delay - NRD

6.9 Adjacent Key Suppression - AKS

These devices incorporate adjacent key suppression

(‘AKS’ - patent pending) that can be selected on a per-key

basis. AKS permits the suppression of multiple key

presses based on relative signal strength. This feature

assists in solving the problem of surface moisture which

can bridge a key touch to an adjacent key, causing multiple

key presses. This feature is also useful for panels with

tightly spaced keys, where a fingertip might inadvertently

activate an adjacent key.

If an object unintentionally contacts a key resulting in a

detection for a prolonged interval it is usually desirable to

recalibrate the key in order to restore its function, perhaps

after a time delay of some seconds.

The Negative Recal Delay timer monitors such detections;

if a detection event exceeds the timer's setting, the key will

be automatically recalibrated. After a recalibration has

taken place, the affected key will once again function

normally even if it is still being contacted by the foreign

object. This feature is set on a per-key basis using the

NRD setup parameter.

AKS works for keys that are AKS-enabled anywhere in the

matrix and is not restricted to physically adjacent keys; the

device has no knowledge of which keys are actually

physically adjacent. When enabled for a key, adjacent key

suppression causes detections on that key to be

NRD can be disabled by setting it to zero (infinite timeout)

in which case the key will never auto-recalibrate during a

continuous detection (but the host could still command it).

suppressed if any other AKS-enabled key in the panel has

a more negative signal deviation from its reference.

NRD is set using one byte per key, which can range in

value from 0...254. NRD above 0 is expressed in 0.5s

increments. Thus if NRD =120, the timeout value will

actually be 60 seconds. 255 is not a legal number to use.

This feature does not account for varying key gains (burst

length) but ignores the actual negative detection threshold

setting for the key. If AKS-enabled keys in a panel have

different sizes, it may be necessary to reduce the gains of

larger keys relative to smaller ones to equalize the effects

of AKS. The signal threshold of the larger keys can be

altered to compensate for this without causing problems

with key suppression.

NRD Typical values:

NRD Default value:

NRD Range:

20 to 60 (10 to 30 seconds)

20 (10 seconds)

0..254 (∞, 0.5...127s)

to within ± 250ms

NRD Accuracy:

Adjacent key suppression works to augment the natural

moisture suppression of narrow gated transfer switches

creating a more robust sensing method.

6.8 Burst Length - BL

The signal gain for each key is controlled by circuit

parameters as well as the burst length.

AKS Default value:

0 (Off)

The burst length is simply the number of times the

charge-transfer (‘QT’) process is performed on a given key.

Each QT process is simply the pulsing of an X line once,

with a corresponding Y line enabled to capture the

resulting charge passed through the key’s capacitance Cx.

6.10 Oscilloscope Sync - SSYNC

Pin 11 (S_SYNC) can output a positive pulse oscilloscope

sync that brackets the burst of a selected key. More than one

burst can output a sync pulse as determined by the Setups

parameter SSYNC for each key.

QT60xx0 devices use a fixed number of QT cycles which

are executed in burst mode. There can be up to 64 QT

cycles in a burst, in accordance with the list of permitted

values shown in Table 6.3, page 21.

This feature is invaluable for diagnostics; without it,

observing signals clearly on an oscilloscope for a particular

burst is very difficult.

Increasing burst length directly affects key sensitivity. This

occurs because the accumulation of charge in the charge

integrator is directly linked to the burst length. The burst

length of each key can be set individually, allowing for

direct digital control over the signal gains of each key

individually.

This function is supported in Quantum’s QmBtn PC software.

SSYNC Default value:

0 (Off)

6.11 Mains Sync - MSYNC

The Mains Sync feature uses M_SYNC pin 1.

Apparent touch sensitivity is also controlled by the

Negative Threshold level (NTHR). Burst length and NTHR

interact; normally burst lengths should be kept as short as

possible to limit RF emissions, but NTHR should be kept

above 6 to reduce false detections due to external noise.

The detection integrator mechanism also helps to prevent

false detections.

External fields can cause interference leading to false

detections or sensitivity shifts. Most fields come from AC

power sources. RFI noise sources are heavily suppressed

by the low impedance nature of the QT circuitry itself.

Noise such as from 50Hz or 60Hz fields becomes a

problem if it is uncorrelated with acquisition signal

sampling; uncorrelated noise can cause aliasing effects in

the key signals. To suppress this problem the M_SYNC

input allows bursts to synchronize to the noise source.

BL Typical values:

BL Default value:

BL Possible values:

2, 3 (48, 64 pulses / burst)

2 (48 pulses / burst)

0, 1, 2, 3 (16, 32, 48, 64

pulses/burst)

The noise synchronization operating mode is set by

parameter MSYNC in Setups.

The synchronization occurs only at the burst for the lowest

numbered enabled key in the matrix. The device waits for

the synchronization signal for up to 100ms after the end of

a preceding full matrix scan, then when a negative

synchronization edge is received, the matrix is scanned in

its entirety again.

Preliminary information; subject to change

QT60240-XSG X7.04/0706

The sync signal drive should be a buffered logic signal, or

perhaps a diode-clamped signal, but never a raw AC signal

from the mains. The device will synchronize to the falling

edge.

6.14 Awake Timeout - AWAKE

After each matrix scan, the part will automatically go to

sleep whenever possible, to conserve power, but the

awake timeout can be used to force the part to stay awake.

Since Noise synchronization is highly effective and

inexpensive to implement, it is strongly advised to take

advantage of it anywhere there is a possibility of

encountering low frequency (i.e. 50/60Hz) electric fields.

Quantum’s QmBtn software can show such noise effects

on signals, and will hence assist in determining the need to

make use of this feature.

If the I²C interface is selected, a recent communication

from the host will prevent the part from sleeping. The

device tracks the time elapsed since the last host

communication and prevents the part from sleeping while

the elapsed time is less than the 'Awake Timeout'; this

helps prevent the part from falling asleep partway through

a host communication. In other words, the Awake Timeout

interval defines the minimum period since the last

communication before the part will automatically return to

sleep.

If the synchronization feature is enabled but no

synchronization signal exists, the sensor will continue to

operate but with a delay of 100ms before the start of each

matrix scan, and hence will have a slow response time. All

synchronization signals are ignored during sleep.

A touch on a key marked to self-wake will cause the part to

remain awake for a longer period than would otherwise be

the case. The part then has a much faster key response

time because it continually scans the matrix rather than

returning to sleep immediately after the key touch has

finished. Subsequent key touches further prolong the

awake time. In other words, once the part has been woken

by touching a wake key, the key response time will be fast

while the keyboard is in use. Once key touches have

finished and there have been no key touches for the

Awake Timeout, the part will return to sleep.

SYNC Default value:

SYNC Possible range:

0 (Off)

0, 1 (Off, On)

6.12 Sleep Duration - SLEEP

The QT60xx0 is designed to sleep as much as possible to

conserve power. Periodically, the part wakes automatically,

scans the keyboard matrix and then returns to sleep. The

length of time the part sleeps before automatically waking

up can be configured to one of eight different values, via a

look-up table. The look-up table index must be written to

the setups (see Table 6.3, page 21).

The awake period can be configured to a value between

100ms and 25.5s, in increments of 100ms.

AWAKE default value:

AWAKE range:

AWAKE Timeout accuracy: to within ±50ms

25 (2.5s)

1...255 (100ms...25.5s)

SLEEP default value:

SLEEP range:

3 (125ms)

0...7 (16ms...2s)

6.13 Wake on Key Touch - WAKE

The device can be configured for wakeup when specific

keys are touched. Each key has its own configuration bit

so that any combination of keys can be configured for this

purpose. The behavior is different depending on the

selected interface.

When the I²C interface is selected, the part will set the

detect output when a key with WAKE option enabled

confirms a touch.

6.15 Drift Hold Time - DHT

Drift Hold Time (DHT) is used to restrict drift on all keys

when one or more keys are activated. DHT also defines

the length of time the drift is halted after a key detection.

This feature is particularly useful in cases of high-density

keypads where touching a key or hovering a finger over the

keypad would cause keys to drift, and therefore create

sensitivity shift, and ultimately inhibit detection.

The DHT can be configured to a value of between 100ms

and 25.5s, in increments of 100ms. Setting this parameter

to 0 will disable this feature and the drift compensation on

any key will not be dependent on the state of other keys.

With the shift register interface selected, touches on keys

with WAKE option enabled prolong the period the part

remains awake before automatically returning to sleep.

This results in a fast response time to subsequent key

touches once the part has detected the first key touch after

waking up.

DHT default value: 10 (1s)

DHT range:

0...255 (Off, 100ms...25.5s)

The time the part will remain awake after each key touch

can be configured (see 6.14. All keys prolong the time the

part remains awake once a key configured with the WAKE

option has confirmed detect.

WAKE Default value:

1 (On)

WAKE Possible range: 0, 1 (Off, On)

Preliminary information; subject to change

QT60240-XSG X7.04/0706

6.16 Setups Block

Setups data is sent from the host to the QT using the I²C interface. The setups block is memory mapped onto this interface. Thus each setup can be accessed by

reading/writing the appropriate address. Setups can be accessed individually or as a block. Before writing to any setup, an unlock code (value 0x55) must be written to the

setups write unlock address (130). Refer also to Table 6.3, page 21 for further details, and all of Section 6.

Table 6.1 QT60160 Setups Table

(see next page for QT60240)

Key

Default

Item Address Bytes

Parameter

Symbol

Valid Range

Bits

Scope

Value

Description

Page

Neg thresh

NTHR NTHR = 0...15

Lower nibble = Neg Threshold - take operand and add 4 to get value

Upper nibble = Neg Drift comp - via LUT (Table 6.3, page 21)

131...146

147...162

163...178

Neg Drift Comp NDRIFT NDRIFT = 0...15

Pos Drift Comp PDRIFT PDRIFT = 0...15

Upper nibble = Pos Drift comp - via LUT (Table 6.3, page 21)

Normal DI Limit

Fast DI Limit

NDIL

FDIL

NDIL = 0...15

FDIL = 0...15

Lower nibble = Normal DI Limit, values same as operand (0 = disabled burst)

Upper nibble = Fast DI Limit, values same as operand (0 invalid)

Range is in 0.5 sec increments; 0 = infinite; default = 10s

Range is { infinite, 0.5...127s }; 255 is illegal to use

179...194

195...210

211

Neg recal delay

NRD

0...254

Wake On Touch WAKE WAKE = 0,1

Burst Length

AKS

Bit 3 = WAKE, 1 - enabled

Bits 5, 4: = BL, via LUT (Table 6.3, page 21), default = 48

Bit 6 = AKS, 1 = enabled

AKS

BL = 0..3

AKS = 0,1

Scope Sync

SSYNC SSYNC = 0,1

Bit 7 = Scope sync, 1 = enabled

Sleep Duration

Mains Sync

SLEEP SLEEP = 0...7

MSYNC MSYNC = 0,1

Bits 2,1,0 = Sleep Duration, via LUT (Table 6.3, page 21), default = 125ms

Bits 6 = Mains sync, negative edge, 1 = enabled; default = off

212

213

Awake Timeout AWAKE 1...255

Drift Hold Time DHT 0...255

Range is in 100ms increments; 1 = 100ms. Default = 2.5s. 0 is illegal to use

Range is in 100ms increments; 0 = disable, 1 = 100ms, default = 1s

QT60240-XSG X7.04/0706

Preliminary information; subject to change

Table 6.2 QT60240 Setups Table

(see prior page for QT60160)

Key

Default

Item Address Bytes

Parameter

Neg thresh

Neg Drift Comp

Symbol

Valid Range

Bits

Scope

Value

Description

Page

NTHR

NDRIFT NDrift = 0...15

NThr = 0...15

Lower nibble = Neg Threshold - take operand and add 4 to get value

Upper nibble = Neg Drift comp - via LUT (Table 6.3, page 21)

131...154

155...178

179...202

Pos Drift Comp

PDRIFT PDrift = 0...15

Upper nibble = Pos Drift comp - via LUT (Table 6.3, page 21)

Normal DI Limit

Fast DI Limit

NDIL

FDIL

Ndil = 0...15

FDil = 0...15

Lower nibble = Normal DI Limit, values same as operand (0 = disabled burst)

Upper nibble = Fast DI Limit, values same as operand (0 does not work)

Range is in 0.5 sec increments; 0 = infinite; default = 10s (operand = 20)

Range is { infinite, 0.5...127s }; 255 is illegal to use

203...226

227...250

251

Neg recal delay

NRD

0...254

Wake On Touch

Burst Length

AKS

WAKE WAKE = 0,1

AKS

Bit 3 = WAKE, 1 - enabled

Bits 5, 4: = BL, via LUT (Table 6.3, page 210), default = 48 (setting =2)

Bit 6 = AKS, 1 - enabled

BL = 0...3

AKS = 0,1

Scope Sync

SSYNC SSYNC = 0,1

Bit 7 = Scope sync, 1 = enabled

Sleep Duration

Mains Sync

SLEEP SLEEP = 0...7

MSYNC Msync = 0,1

Bits 2,1,0 = Sleep Duration, 7 values via LUT, default = 125ms

Bits 6 = Mains sync, negative edge, 1 = enabled; default = 0 (off)

252

253

Awake Timeout

Drift Hold Time

AWAKE 1...255

Range is in 100ms increments; 1 = 100ms. Default = 2.5s. 0 is illegal to use

Range is in 100ms increments; 0 = disable, 1 = 100ms, default = 1s

DHT

0...255

Preliminary information; subject to change

QT60240-XSG X7.04/0706

Table 6.3 Setups Lookup Table

Applies to both QT60160 and QT60240

Typical values: For most touch applications, use the values shown in the outlined cells. Bold text items indicate default settings. The number to send to the QT is the number in

the leftmost column (0...15), not numbers from within the table. The QT uses lookup tables to translate the 0.. .15 to the parameters for each function.

NRD is an exception: it can range from 0...254 which is translated from 1= 0.5s to 254= 127s with zero = infinity. 255 is illegal.

AWAKE is an exception: it can range from 0...255 which is translated from 1= 0.1s to 255s= 25.5s. Zero is illegal.

Parameter

Index

Number counts

NTHR

NDRIFT PDRIFT

NDIL

counts

FDIL

counts

NRD

secs

pulses

AWAKE

secs

DHT

secs

SLEEP

secs

AKS

SSYNC

MSYNC

WAKE

Per key

0.1

Per key

0.1

Per key

Key off

Per key

unused

Per key

Off

Per key

Global

unused

Global

Off

0 (Infinite)

- Off -

0.2

0.3

0.4

0.6

0.8

0.2

0.3

- 2 -

0.5 .. 127s

- On -

- 48 -

0.1...25.5s 0.1...25.5s

Default=

10s

Default=

2.5s

Default=

0.4

-125-

250

500

- 0.6 -

0.8

- 5 -

- 10 -

1.2

1.5

1.2

1.5

1,000

2,000

- 2.5 -

3.3

4.5

- 2.5 -

3.3

4.5

7.5

QT60240-XSG X7.04/0706

Preliminary information; subject to change

7 Specifications

7.1 Absolute Maximum Electrical Specifications

Operating temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40^OC to +85^OC

Storage temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55^OC to +125^OC

Vdd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +5.5V

Max continuous pin current, any control or drive pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA

Short circuit duration to ground, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite

Short circuit duration to Vdd, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite

Voltage forced onto any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (Vdd + 0.6) Volts

EEPROM setups maximum writes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100,000 write cycles

7.2 Recommended Operating Conditions

Vdd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1.8V to 5.25V

Supply ripple+noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mV p-p max

Cx transverse load capacitance per key. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 20pF

7.3 DC Specifications

Vdd = 5.0V, Cs = 4.7nF, Rs = 470K; Ta = recommended range, unless otherwise noted

Parameter

Description

Min

Typ

Max

Units

Notes

Iddr

Vil

Supply current, running

Low input logic level

High input logic level

Low output voltage

0.2Vdd

0.2

1.8V <Vdd <5V

Vhl

Vol

Voh

Iil

0.6Vdd

4.2

High output voltage

Input leakage current

Acquisition resolution

Internal /RST pullup resistor

µA

bits

k✡

Rrst

7.4 Timing Specifications

Parameter

Description

Min

Typ

Max

Units

Notes

Burst spacing

µs

kHz

Burst center frequency

Burst modulation, percent

Preliminary information; subject to change

QT60240-XSG X7.04/0706

7.5 Mechanical Dimensions

PIN 1

Dimensions in Millimeters

Symbol

Minimum

Nominal

0.90

Maximum

1.00

0.80

0.02

0.65

0.20 REF

5.00 BSC

0.23

0.40

3.10

0.50 BSC

0.05

1.00

0.18

0.30

2.95

0.30

0.50

3.25

7.6 Marking

T_A

MLF Part Number

QT60160-XSG

QT60240-XSG

Keys

Marking

6160

6240

-40⁰C to +85⁰C

Preliminary information; subject to change

QT60240-XSG X7.04/0706

Patented and patents pending

Corporate Headquarters

1 Mitchell Point

Ensign Way, Hamble SO31 4RF

Great Britain

Tel: +44 (0)23 8056 5600 Fax: +44 (0)23 8045 3939

www.qprox.com

North America

651 Holiday Drive Bldg. 5 / 300

Pittsburgh, PA 15220 USA

Tel: 412-391-7367 Fax: 412-291-1015

This device is covered under one or more United States and corresponding international patents. QRG patent numbers can be found online

at www.qprox.com. Numerous further patents are pending, which may apply to this device or the applications thereof.

The specifications set out in this document are subject to change without notice. All products sold and services supplied by QRG are subject

to our Terms and Conditions of sale and supply of services which are available online at www.qprox.com and are supplied with every order

acknowledgement. QRG trademarks can be found online at www.qprox.com. QRG products are not suitable for medical (including lifesaving

equipment), safety or mission critical applications or other similar purposes. Except as expressly set out in QRG's Terms and Conditions, no

licenses to patents or other intellectual property of QRG (express or implied) are granted by QRG in connection with the sale of QRG

products or provision of QRG services. QRG will not be liable for customer product design and customers are entirely responsible for their

products and applications which incorporate QRG's products.

Development Team: Dr. Tim Ingersoll, Samuel Brunet

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