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2U3809K33QDBVRG4Q1

型号：

2U3809K33QDBVRG4Q1

品牌：

TI[ TEXAS INSTRUMENTS ]

页数：

19 页

PDF大小：

844 K

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TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
TPS3809xxx-Q1 3-Pin Supply Voltage Supervisors  
1 Features  
3 Description  
The TPS3809 family of supervisory circuits provides  
circuit initialization and timing supervision, primarily  
for DSPs and processor-based systems.  
1
•
•
Qualified for Automotive Applications  
AEC-Q100 Qualified With the Following Results:  
–
Device Temperature Grade 1: –40°C to  
+125°C Ambient Operating Temperature  
Range  
During power-on, RESET is asserted when the  
supply voltage VDD becomes higher than 1.1 V.  
Thereafter, the supervisory circuit monitors VDD and  
keeps RESET active as long as VDD remains below  
the threshold voltage VIT. An internal timer delays the  
return of the output to the inactive state (high) to  
–
–
Device HBM ESD Classification Level 2  
Device CDM ESD Classification Level C5  
•
•
•
3-Pin SOT-23 Package  
ensure proper system reset. The delay time, td(typ)  
=
Supply Current of 9 μA (Typical)  
200 ms, starts after VDD has risen above the  
threshold voltage VIT. When the supply voltage drops  
below the threshold voltage VIT, the output becomes  
active (low) again. No external components are  
required. All the devices of this family have a fixed  
sense-threshold voltage VIT set by an internal voltage  
divider.  
Precision-Supply Voltage Monitor 2.5 V, 3 V, 3.3  
V, 5 V  
•
•
Power-On Reset Generator With Fixed Delay  
Time of 200 ms  
Pin-For-Pin Compatible With MAX 809  
The product spectrum is designed for supply voltages  
of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are  
available in a 3-pin SOT-23. The TPS3809xxx-Q1  
2 Applications  
•
Automotive Applications With DSPs,  
Microcontrollers, or Microprocessors  
devices are characterized for operation over  
a
temperature range of −40°C to 125°C, and are  
qualified in accordance with AEC-Q100 stress test  
qualification for integrated circuits. For more  
information about TI's voltage supervisor portfolio,  
please visit the Supervisor and Reset IC Overview  
web page.  
•
•
•
Automotive Camera Systems  
Automotive Radar  
USB Hubs and Charging  
Device Information(1)  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
TPS3809xxx-Q1  
SOT-23 (3)  
2.90 mm × 1.60 mm  
(1) For all available packages, see the orderable addendum at  
the end of the datasheet.  
Typical Application  
TPS76333  
IN OUT  
3.3 V  
5 V  
GND  
V
DD  
TMS320LC54x  
V
DD  
TPS3809K33-Q1  
RESET  
RESET  
GND  
GND  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
Table of Contents  
8.2 Functional Block Diagram ......................................... 8  
8.3 Feature Description................................................... 8  
8.4 Device Functional Modes.......................................... 8  
Application and Implementation .......................... 9  
9.1 Application Information.............................................. 9  
9.2 Typical Application ................................................... 9  
1
2
3
4
5
6
7
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Voltage Options ..................................................... 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
7.1 Absolute Maximum Ratings ...................................... 4  
7.2 ESD Ratings.............................................................. 4  
7.3 Recommended Operating Conditions....................... 4  
7.4 Thermal Information.................................................. 4  
7.5 Electrical Characteristics........................................... 5  
7.6 Timing Requirements................................................ 5  
7.7 Switching Characteristics.......................................... 5  
7.8 Typical Characteristics.............................................. 7  
Detailed Description .............................................. 8  
8.1 Overview ................................................................... 8  
9
10 Power Supply Recommendations ..................... 11  
11 Layout................................................................... 11  
11.1 Layout Guidelines ................................................. 11  
11.2 Layout Example .................................................... 11  
12 Device and Documentation Support ................. 12  
12.1 Related Links ........................................................ 12  
12.2 Community Resources.......................................... 12  
12.3 Trademarks........................................................... 12  
12.4 Electrostatic Discharge Caution............................ 12  
12.5 Glossary................................................................ 12  
8
13 Mechanical, Packaging, and Orderable  
Information ........................................................... 12  
4 Revision History  
Changes from Revision A (December 2002) to Revision B  
Page  
•
•
•
Added AEC-Q100 Qualified information in bullets ................................................................................................................ 1  
Changed Applications list items ............................................................................................................................................. 1  
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation  
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and  
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1  
•
Changed device part numbers by adding -Q1 to them throughout document ...................................................................... 5  
2
Submit Documentation Feedback  
Copyright © 2008–2016, Texas Instruments Incorporated  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
 
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
www.ti.com  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
5 Voltage Options  
TA  
DEVICE NAME  
THRESHOLD VOLTAGE  
MARKING  
PCZQ  
TPS3809J25QDBVRQ1  
TPS3809L30QDBVRQ1  
TPS3809K33QDBVRQ1  
TPS3809I50QDBVRQ1  
2.25 V  
2.64 V  
2.93 V  
4.55 V  
PDAQ  
−40°C to 125°C  
PDBQ  
PDCQ  
6 Pin Configuration and Functions  
DBV Package  
3-Pin SOT-23  
Top View  
GND  
1
2
3
V
DD  
RESET_  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
GND  
NO.  
1
—
O
I
Ground  
RESET  
VDD  
2
Reset output  
3
Supply voltage and supervising input  
Copyright © 2008–2016, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
 
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
MAX  
7
UNIT  
V
(2)  
Supply voltage, VDD  
All other pins(2)  
–0.3  
7
V
Maximum low output current, IOL  
Maximum high output current, IOH  
5
mA  
mA  
mA  
mA  
–5  
20  
20  
Input clamp current, IIK (VI<0 or VI>VDD  
)
–20  
–20  
Output clamp current, IOK (VO<0 or VO>VDD  
Continuous total power dissipation  
Operating free-air temperature range, TA  
Storage temperature, Tstg  
)
–40  
–65  
125  
150  
°C  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000 h  
continuously.  
7.2 ESD Ratings  
VALUE  
±2000  
±750  
UNIT  
Human-body model (HBM), per AEC Q100-002(1)  
Charged-device model (CDM), per AEC Q100-011  
V(ESD)  
Electrostatic discharge  
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2
NOM  
MAX  
6
UNIT  
VDD  
TA  
Supply voltage  
V
Operating free-air temperature  
–40  
125  
°C  
7.4 Thermal Information  
TPS3809xxx-Q1  
DBV (SOT-23)  
3 PINS  
232.5  
THERMAL METRIC(1)  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
187.6  
104.1  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
40.5  
ψJB  
104.4  
RθJC(bot)  
N/A  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
4
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Copyright © 2008–2016, Texas Instruments Incorporated  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
www.ti.com  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
7.5 Electrical Characteristics  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
VDD – 0.2  
VDD – 0.4  
VDD – 0.4  
VDD – 0.5  
TYP  
MAX  
UNIT  
VDD = 2.5 V to 6 V, IOH = −500 μA  
VDD = 3.3 V, IOH = −2 μA  
VOH  
High-level output voltage  
V
TA = −40°C to +25°C  
VDD = 6 V, IOH = −4 mA  
TA = 125°C  
VDD = 2 V to 6 V, IOL = 500 μA  
VDD = 3.3 V, IOL = 2 mA  
VDD = 6 V, IOL = 4 mA  
0.2  
0.4  
VOL  
Low-level output voltage  
Power-up reset voltage(1)  
V
V
0.4  
VDD ≥ 1.1 V, IOL = 50 μA  
0.2  
TPS3809J25-Q1  
TPS3809L30-Q1  
TPS3809K33-Q1  
2.20  
2.58  
2.87  
4.45  
4.4  
2.25  
2.64  
2.93  
4.55  
4.55  
30  
2.30  
2.7  
TA = −40°C to +125°C  
Negative-going input threshold  
voltage(2)  
VIT−  
2.99  
4.65  
4.65  
V
TA = −40°C to +85°C  
TA = −40°C to +125°C  
TPS3809I50-Q1  
TPS3809J25-Q1  
TPS3809L30-Q1  
TPS3809K33-Q1  
TPS3809I50-Q1  
35  
Vhys  
Hysteresis  
mV  
40  
60  
VDD = 2 V, Output unconnected  
VDD = 6 V, Output unconnected  
VI = 0 V to VDD  
9
15  
30  
IDD  
Ci  
Supply current  
μA  
20  
Input capacitance  
5
pF  
(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 µs/V.  
(2) To ensure best stability of the threshold voltage, a bypass capacitor ( 0.1 µF, ceramic) should be placed near the supply terminals.  
7.6 Timing Requirements  
RL = 1 MΩ, CL = 50 pF, TA = 25°C  
MIN  
NOM  
MAX  
UNIT  
tw  
Pulse width at VDD  
VDD = VIT− + 0.2 V, VDD = VIT− − 0.2 V  
3
μs  
7.7 Switching Characteristics  
RL = 1 MΩ, CL = 50 pF, TA = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
V
DD ≥ VIT− + 0.2 V, See  
td  
Delay time  
120  
200  
280  
ms  
timing diagram, Figure 1  
Propagation (delay) time,  
high-to-low-level output  
VIL = VIT− − 0.2 V, VIH = VIT−  
+0.2 V  
tPHL  
VDD to RESET delay  
1
μs  
Copyright © 2008–2016, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
V
DD  
V
(NOM)  
V
IT  
1.1 V  
t
RESET  
1
0
t
t
t
d
d
For V < 1.1 V Undefined  
DD  
Behavior of RESET Output  
Figure 1. Timing Diagram  
6
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Copyright © 2008–2016, Texas Instruments Incorporated  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
www.ti.com  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
7.8 Typical Characteristics  
2.75  
50  
T
= 25oC  
A
V
DD  
= 2.5 V  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0
40  
30  
T
= 25oC  
20  
A
10  
TPS3809J25  
0
T
A
= 85oC  
–10  
–20  
–30  
–40  
–50  
T
= 0oC  
A
T
A
= –40oC  
0
2.5  
5.0  
7.5  
10.0  
12.5  
–2  
0
2
4
6
V
DD  
– Supply Voltage – V  
I
OL  
– Low-Level Output Current – mA  
Figure 3. Supply Current vs Supply Voltage  
Figure 2. Low-Level Output Voltage vs  
Low-Level Output Current  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
3.00  
V
= 6 V  
V
= 2.5 V  
DD  
DD  
2.75  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0
T
A
= –40oC  
T
= –40oC  
A
= 0oC  
T
= 0oC  
A
T
A
T
= 85oC  
A
T
A
= 85oC  
T
= 25oC  
= 25oC  
A
T
A
0
–10  
–20  
–30  
–40  
–50  
0
–2  
I – High-Level Output Current – mA  
OH  
–4  
–6  
–8  
–10  
I
– High-Level Output Current – mA  
OH  
VDD = 6 V  
VDD = 2.5 V  
Figure 4. High-Level Output Voltage vs  
High-Level Output Current  
Figure 5. High-Level Output Voltage vs  
High-Level Output Current  
1.001  
1.000  
0.999  
0.998  
0.997  
0.996  
0.995  
3.5  
V
DD  
= 2.3 V  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
0.2  
V – Threshold Overdrive Voltage – V  
DD  
0.4  
0.6  
0.8  
1.0  
–40  
–20  
0
20  
40  
60  
85  
T
A
– Free-Air Temperature – o  
C
VDD = 2.3 V  
Figure 6. Normalized Input Threshold Voltage vs  
Free-Air Temperature at VDD  
Figure 7. Minimum Pulse Duration at VDD vs  
VDD Threshold Overdrive Voltage  
Copyright © 2008–2016, Texas Instruments Incorporated  
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7
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
8 Detailed Description  
8.1 Overview  
The TPS3809xxx-Q1 device is a low-current supervisory circuit for monitoring system voltages above 2 V. The  
device asserts an active-low RESET signal when VDD drops below a preset threshold. The RESET output  
remains low until VDD returns above its threshold. The device design is also to be relatively immune to short  
negative transients on the VDD pin.  
8.2 Functional Block Diagram  
TPS3809xxx-Q1  
Reset  
RESET  
Logic  
R1  
_
+
+
V
DD  
Timer  
R2  
GND  
Oscillator  
Reference  
Voltage  
of 1.137 V  
8.3 Feature Description  
8.3.1 VDD Monitoring  
The VDD pin provides a terminal at which a system voltage can be monitored. If the voltage on this pin drops  
below VIT, RESET is asserted low. The comparator has a built-in hysteresis to ensure smooth RESET assertions  
and deassertions. Refer to Voltage Options to determine the VDD voltage threshold for each device.  
8.4 Device Functional Modes  
TPS3809xxx-Q1 monitors one supply using the VDD pin. When VDD is above the VIT threshold for the device,  
RESET will be high. When VDD is below the VIT threshold for the device, RESET will be low.  
8
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Copyright © 2008–2016, Texas Instruments Incorporated  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
www.ti.com  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
9 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The TPS3809xxx-Q1 voltage supervisor device design asserts an active-low RESET signal when VDD drops  
below a voltage threshold VIT. The RESET signal remains low until the voltage returns above its threshold. The  
typical application is with a processor or microcontroller, which needs to be reset when the supply rail drops  
below a specified tolerance.  
9.2 Typical Application  
TPS76333  
3.3 V  
OUT  
5 V  
IN  
GND  
V
DD  
TMS320LC54x  
V
DD  
TPS3809K33-Q1  
RESET  
RESET  
GND  
GND  
Figure 8. Typical Application Schematic  
9.2.1 Design Requirements  
Each device has a fixed=voltage monitoring threshold, and the device should be chosen based on the voltage  
being monitored. Refer to Voltage Options to determine the VDD voltage threshold for each device. In this  
example, a 3.3V supply rail to a microcontroller will be monitored.  
9.2.2 Detailed Design Procedure  
Because a 3.3-V supply rail needs to be monitored, TPS3809K33-Q1 should be used. This device has a 2.93-V  
threshold for reset. Connect the 3.3-V supply to the VDD pin and the reset output of the supervisor to the reset pin  
of the microcontroller.  
Copyright © 2008–2016, Texas Instruments Incorporated  
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9
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
Typical Application (continued)  
9.2.3 Application Curves  
50  
40  
1.001  
1.000  
0.999  
0.998  
0.997  
0.996  
0.995  
T
A
= 25oC  
V
DD  
= 2.3 V  
30  
20  
10  
TPS3809J25  
0
–10  
–20  
–30  
–40  
–50  
–2  
0
2
4
6
–40  
–20  
0
20  
40  
60  
85  
– Free-Air Temperature – o  
C
V
DD  
– Supply Voltage – V  
T
A
VDD = 2.3 V  
Figure 9. Supply Current vs Supply Voltage  
Figure 10. Normalized Input Threshold Voltage vs Free-Air  
Temperature at VDD  
10  
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Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
www.ti.com  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
10 Power Supply Recommendations  
The TPS3809xxx-Q1 device design operates from an input supply from 2 V to 6 V. TI recommends placing a 0.1-  
µF capacitor near the VDD pin.  
11 Layout  
11.1 Layout Guidelines  
TI recommends placing the 0.1-µF decoupling capacitor close to the VDD pin. The VDD and GND traces should be  
able to carry 30 µA without a significant drop in voltage.  
11.2 Layout Example  
GND  
CVDD  
TPS3809xxx-Q1  
VDD  
RESET  
Denotes GND Via  
Figure 11. Layout Example  
Copyright © 2008–2016, Texas Instruments Incorporated  
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11  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
TPS3809J25-Q1, TPS3809L30-Q1, TPS3809K33-Q1, TPS3809I50-Q1  
SGLS142B –JUNE 2008–REVISED MARCH 2016  
www.ti.com  
12 Device and Documentation Support  
12.1 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to sample or buy.  
Table 1. Related Links  
TECHNICAL  
DOCUMENTS  
TOOLS &  
SOFTWARE  
SUPPORT &  
COMMUNITY  
PARTS  
PRODUCT FOLDER  
SAMPLE & BUY  
TPS3809J25-Q1  
TPS3809L30-Q1  
TPS3809K33-Q1  
TPS3809I50-Q1  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
12.2 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
12.3 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.4 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
12.5 Glossary  
SLYZ022 — TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
12  
Submit Documentation Feedback  
Copyright © 2008–2016, Texas Instruments Incorporated  
Product Folder Links: TPS3809J25-Q1 TPS3809L30-Q1 TPS3809K33-Q1 TPS3809I50-Q1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Dec-2016  
PACKAGING INFORMATION  
Orderable Device  
2T09I50QDBVRG4Q  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
3
3
3
3
3
3
3
3
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
PDCQ  
2T09J25QDBVRG4Q  
2U3809K33QDBVRG4Q1  
2U3809L30QDBVRG4Q1  
TPS3809I50QDBVRQ1  
TPS3809J25QDBVRQ1  
TPS3809K33QDBVRQ1  
TPS3809L30QDBVRQ1  
LIFEBUY  
LIFEBUY  
LIFEBUY  
ACTIVE  
LIFEBUY  
ACTIVE  
ACTIVE  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
Green (RoHS  
& no Sb/Br)  
PCZQ  
PDBQ  
PDAQ  
PDCQ  
PCZQ  
PDBQ  
PDAQ  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Dec-2016  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS3809-Q1, TPS3809I50-Q1, TPS3809J25-Q1, TPS3809K33-Q1, TPS3809L30-Q1 :  
Catalog: TPS3809I50, TPS3809J25, TPS3809K33, TPS3809L30  
•
Enhanced Product: TPS3809-EP, TPS3809I50-EP, TPS3809K33-EP, TPS3809L30-EP  
•
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
•
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
22-Dec-2016  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
2T09I50QDBVRG4Q  
2T09J25QDBVRG4Q  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3
3
3
3
3
3
3
3
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
9.0  
9.0  
9.0  
9.0  
9.0  
9.0  
9.0  
9.0  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.47  
1.47  
1.47  
1.47  
1.47  
1.47  
1.47  
1.47  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
2U3809K33QDBVRG4Q1 SOT-23  
2U3809L30QDBVRG4Q1 SOT-23  
TPS3809I50QDBVRQ1 SOT-23  
TPS3809J25QDBVRQ1 SOT-23  
TPS3809K33QDBVRQ1 SOT-23  
TPS3809L30QDBVRQ1 SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
22-Dec-2016  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
2T09I50QDBVRG4Q  
2T09J25QDBVRG4Q  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3
3
3
3
3
3
3
3
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
182.0  
20.0  
20.0  
20.0  
20.0  
20.0  
20.0  
20.0  
20.0  
2U3809K33QDBVRG4Q1  
2U3809L30QDBVRG4Q1  
TPS3809I50QDBVRQ1  
TPS3809J25QDBVRQ1  
TPS3809K33QDBVRQ1  
TPS3809L30QDBVRQ1  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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Copyright © 2016, Texas Instruments Incorporated  
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