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DXP18CN7515TL

型号：

DXP18CN7515TL

品牌：

MURATA[ muRata ]

页数：

9 页

PDF大小：

268 K

下载PDF手册
Reference Only  
Spec No.JEFK243A-0003E-01  
P1/9  
Micro Chip Transformer  
DXP18CN□□□□T□  
Reference Specification  
1. Scope  
This reference specification applies to Micro Chip Transformer DXP18CN Series.  
2. Part Numbering  
(ex.) DX  
(1)  
P
18  
C
N
75 10  
(6) (7)  
T
L
(2) (3) (4) (5)  
(8) (9)  
(1) Micro Chip Transformer  
(2) Structure (P: Film Type)  
(3) Dimension (LW)  
(6) Port Impedance (75 : 75ohm)  
(7) Coupling (10: 10dB/15:15dB)  
(8) Main Application (T: Terrestrial)  
(9) Packing Code L:Taping / B:Bulk  
(4) Type of Transformer (C: Coupler)  
(5) Category  
3. Electrical Specification  
Freq.  
Range  
[MHz]  
Port  
Impedance  
[ohm]  
Insertion  
Loss  
[dB max.]  
Rated  
Power  
[dBm]  
Customer  
Part Number  
Murata  
Part Number  
Coupling  
[dB typ.]  
Isolation  
[dB min.]  
DXP18CN7510TL  
DXP18CN7510TB  
DXP18CN7515TL  
DXP18CN7515TB  
50～870  
50～870  
75 ALL  
75 ALL  
2.3  
1.5  
10  
15  
18  
20  
20  
20  
Operating Temperature : -40 to +85°C  
Storage Temperature : -40 to +85°C  
4. Standard Testing Condition  
<Unless otherwise specified>  
<In case of doubt>  
Temperature : 20 ± 2°C  
Humidity : 60 to 70%(RH)  
Temperature : Ordinary Temperature 15 to 35°C  
Humidity : Ordinary Humidity 25 to 85%(RH)  
Atmospheric Pressure : 86 to106kPa  
5. Style and Dimensions  
■Dimension  
■Eqivalent Circuit  
(Top View)  
(6) (5) (4)  
(6)In (5)GND (4)Sub  
Out  
(1) (2) (3)  
Polarity  
Marking  
1.6±0.1  
0.2±0.1  
0.4±0.1  
(1)Main  
Out  
(2)GND (3)Termination  
0.3±0.1  
(Bottom View)  
: Electrode  
(in mm)  
■Unit Mass (typ.)  
0.003g  
■ TN (Termination) Terminal  
Please terminate TN terminal with 75 ohm to the circuit ground.  
6. Marking  
Polarity Marking is on the upper surface of a Product.  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P2/9  
7. Electrical Performance  
No.  
Item  
Specification  
Meet item 3.  
Definition and Measurement Method  
7.1 Insertion  
Insertion Loss is given by S12 mag extracted from the below circuit.  
Loss  
(IL)  
Parasitics and loss factors caused by the test board have to be removed.  
Port Impedance [ohm]: All 75 ohm  
IL[dB] = 20log10(S12)  
IN  
MO  
GND  
Port1  
Port2  
GND  
SO  
TN  
Port3  
Port4  
7.2 Coupling  
Meet item 3.  
Coupling is given by S42 mag extracted from the below circuit.  
Parasitics and loss factors caused by the test board have to be removed.  
Port Impedance [ohm]: All 75 ohm  
Coupling[dB] = 20log10(S42)  
IN  
MO  
GND  
Port1  
Port2  
GND  
SO  
TN  
Port3  
Port4  
7.3 Isolation  
Meet item 3.  
Isolation is given by S41 mag extracted from the below circuit.  
Parasitics and loss factors caused by the test board have to be removed.  
Port Impedance [ohm]: All 75 ohm  
Coupling[dB] = 20log10(S41)  
IN  
MO  
GND  
Port1  
Port2  
GND  
SO  
TN  
Port3  
Port4  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P3/9  
8. Mechanical Performance  
No.  
Item  
Specification  
Test Method  
8.1 Appearance  
and  
Meet all dimension on item 5.  
Visual Inspection and measurement with microscope.  
Dimensions  
The electrodes shall be at least Flux:Ethanol solution of rosin,25(wt)%  
95% covered with new solder Pre-Heating : 150±10°C 60s to 90s  
8.2 Solderability  
coating.  
Solder : Sn-3.0Ag-0.5Cu  
Solder Temperature : 240±5°C  
Immersion Time : 3±1 seconds  
Immersion and emersion rates : 25mm/s  
Flux : Ethanol solution of rosin,25(wt)%  
Pre-Heating : : 150±10°C 60s to 90s  
Solder : Sn-3.0Ag-0.5Cu  
8.3 Resistance  
to Soldering  
Heat  
Meet Table 1.  
Table 1  
Appearance  
IL  
No damaged  
Meet Item 3.  
Solder Temperature : 270±5°C  
Immersion Time : 10±1 seconds  
Immersion and emersion rates : 25mm/s  
Then measured after exposure in the room  
condition for 4 to 48 hours.  
Coupling  
Isolation  
8.4  
Drop  
It shall be dropped on concrete or steel board.  
Method : free fall  
Height : 1 m  
The Number of Times : 3 times  
8.5 Vibration  
It shall be soldered on the substrate.  
Oscillation Frequency : 10 to 2000 to 10Hz  
for 15 minutes  
Total Amplitude 3.0mm or Acceleration 196m/s2  
whichever is smaller  
Testing Time : A period of 2 hours in each of 3  
mutually perpendicular directions. (Total 6 hours)  
It shall be soldered on the Glass-epoxy substrate.  
8.6  
Bending  
Strength  
Deflection : 3mm  
(t=1.0mm).  
Keeping time : 5 seconds  
Speed of Applying Force : 0.5mm/s  
Pressure jig  
R230  
F
Deflection  
Product  
45  
45  
(in mm)  
9. Environmental Performance(Products shall be soldered on the substrate.)  
No. Item Specification Test Method  
Meet Table 1.  
9.1 Temperature  
Cycle  
1 Cycle  
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min  
Step 2 Ordinary Temp. / within 3 min  
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min  
Step 4 Ordinary Temp. / within 3 min  
Total of 100 cycles.  
Then measured after exposure in the room condition for  
4 to 48 hours.  
9.2 Humidity  
Temperature : 70±2°C  
Humidity : 90~95%(RH)  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
9.3 Heat  
Resistance  
Temperature : 85±2°C  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
9.4 Cold  
Resistance  
Temperature : -40± 2°C  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P4/9  
10. Frequency Characteristics (Typ.)  
DXP18CN7510T  
0
8
8.5  
9
18  
20  
22  
24  
26  
28  
30  
0.5  
1
9.5  
10  
1.5  
2
10.5  
11  
2.5  
3
11.5  
12  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
DXP18CN7515T  
0
0.5  
1
13.5  
14  
18  
20  
22  
24  
26  
28  
30  
32  
34  
14.5  
15  
.5  
2
15.5  
16  
.5  
3
16.5  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
0
100 200 300 400 500 600 700 800 900  
Freq[MHz]  
11. Specification of Packaging  
11.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)  
0.1  
1.5±  
0
0.20±0.05  
Sproket Hole  
Direction of feed  
1.82±0.05  
0.90±0.05  
4.0±0.1  
4.0±0.1  
2.0±0.05  
0.6±0.05  
11.2 Specification of Taping  
(1)Packing quantity(Standard quantity) 5000 pcs. / reel  
(2)Packing Method  
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.  
(3) Spliced point  
The cover tape have no spliced point.  
(4) Sprocket Hole  
Sprocket hole shall be located on the left hand side toward the direction of feed.  
(5)Missing components number  
Missing components number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not  
continuous. The specified quantity per reel is kept.  
11.3 Pull Strength of the Tape Package  
Plastic Tape  
Cover Tape  
5N min.  
10N min.  
165 to 180 degree  
11.4 Peeling force of the Cover Tape  
F
Cover tape  
Plastic tape  
0.2 to 0.7N(Minimum value is Typical)  
Peeling verosity is 300 mm / min  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P5/9  
11.5 Dimensions of Leader-tape, Trailer and Reel  
Leader  
Trailer  
160 min.  
2.0±0.5  
190 min.  
210 min.  
Label  
Empty tape Top tape  
13.0±0.2  
60±1  
0
21.0±0.8  
Direction of feed  
9± 10  
13±1.4  
180±0  
3
11.6 Marking for reel  
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc  
1) « Expression of Inspection No. »  
□□ OOOO   
(1)  
(2)  
(3)  
(1) Factory Code  
(2) Date  
First digit  
: Year / Last digit of year  
Second digit  
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D  
Third, Fourth digit : Day  
(3) Serial No.  
2) « Expression of RoHS Marking »  
ROHS – Y (△)  
(1) (2)  
(1) RoHS regulation conformity parts.  
(2) MURATA classification number  
11.7 Marking for Outside package  
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,  
RoHS Marking (2), Quantity, etc  
11.8 Specification of Outer Case  
Outer Case Dimensions  
Standard Reel Quantity in Outer Case  
(Reel)  
Label  
(mm)  
W
D
H
H
186  
186  
93  
5
D
Above Outer Case size is typical. It depends on a quantity of an  
order.  
W
!
12. △Caution  
Limitation of Application  
Please contact us before using our products for the applications listed below which require especially  
high reliability for the prevention of defects which might directly cause damage to the third party's life, body  
or property.  
(1) Aircraft equipment  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and / or reliability to the  
applications listed in the above.  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
13. Notice  
Products can only be soldered with reflow.  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
13.1 TN (Termination) Terminal  
Please terminate TN terminal with 75 ohm to the circuit ground, unless otherwise, it may affect on the  
performance of this part.  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P6/9  
13.2 Flux and Solder  
Flux  
Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ),  
but not highly acidic flux  
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).  
Do not use water-soluble flux.  
Solder  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of the solder paste should be 100 to 150µm.  
13.3 Standard Land Dimensions (Reflow)  
0.20 0.20  
0.45  
1.30  
0.40  
Resist  
Copper foil pattern  
No pattern  
0.40  
(in mm)  
13.4 Assembling  
<Thermal Shock>  
Pre-heating should be in such a way that the temperature difference between solder and  
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering  
should be in such a way that the temperature difference is limited to 100°C max.  
13.5 Standard Soldering Condition  
(1) Soldering Condition  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
Temp.  
(℃)  
260℃/10s  
230℃  
245±3℃  
220℃  
Limit Profile  
180  
150  
Standard Profile  
30～60s  
60s max.  
90s±30s  
Time（ｓ）  
Standard Profile  
Limit Profile  
Pre-heating  
150～180°C 、90s±30s  
above 220°C、30s～60s  
245±3°C  
Heating  
above 230°C、60s max.  
260°C、10s  
Peak temperature  
Cycle of reflow  
2 times  
2 times  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
(2) Reworking with Soldering iron  
P7/9  
The following conditions must be strictly followed when using a soldering iron after being  
mounted by reflow soldering.  
Tip temperature / Soldering time : 350°C max / 3(+1,-0)s  
Soldering iron output :30W max  
Tip diameter : 3mm  
Reworking should be limited to 2 times.  
Notes: Do not touch the products directly with the soldering iron.  
(3) Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Upper limit  
Upper limit  
Recommendable  
Recommendable  
t
1/3 T  
≦ t ≦ T (T:thickness of electrodes)  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
13.6 Resin coating  
The electric characteristics may change and/or it may affect on the product's performance due to high  
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you  
select resin. In prior to use, please make the reliability evaluation with the product mounted in your application  
set.  
13.7 Attention regarding P.C.B. bending  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to  
warping the board.  
［Products direction］  
Products shall be location the sideways  
a
Direction (Length : a<b) to the machanical  
b
Stress.  
Poor example  
〈
〉
Good example  
〈
〉
［Wraping direction］  
Products(wraping direction 1, wraping direction  
2) shall be located carefully so that products are  
not subject to the mechanical stress due to  
warping the board. Because they may be  
subjected the mechanical stress in order of  
wraping direction 1wraping direction 2.  
a
a
b
b
Wraping direction 1  
〈
〉
Wraping direction 2  
〈
〉
(2)Products location on P.C.B. separation  
Products(A,B,C,D) shall be located carefully  
so that products are not subject to the  
mechanical stress due to warping the board.  
Because they may be subjected the mechanical  
stress in order of ACB D.  
C
B
Seam  
D
A
a
b
Slit  
Length:a b  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P8/9  
Portion of  
Perforation  
13.8 Attention Regarding P.C.B. Design  
< The Arrangement of Products >  
×
P.C.B. shall be designed so that products are far from the portion  
P.C.B.  
○
of perforation.  
○
Product  
The portion of perforation shall be designed as narrow as possible  
and shall be designed so as not to be applied the stress in the case  
of P.C.B. separation.  
Portion of  
Perforation  
×
Products shall not be arranged on the line of a series of holes when  
there are big holes in P.C.B. (Because the stress concentrate on the  
line of holes.)  
○
×
P.C.B.  
Product  
Hole  
< Products Placing >  
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.  
during placing the products on the other side of P.C.B.  
Pick-up nozzle  
Product  
< P.C.B. Separation >  
P.C.B. shall not be separated with hand.  
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.  
P.C.B.  
13.9 Cleaning Conditions  
Support pin  
Products shall be cleaned on the following conditions.  
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)  
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon  
at the mounted products and P.C.B..  
・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.  
(3) Cleaner  
1. Alternative cleaner Isopropyl alcohol (IPA)  
2. Aqueous agent  
PINE ALPHA ST-100S  
(4) There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized  
water in order to remove the cleaner.  
(5) Other cleaning  
Please contact us.  
13.10 Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to  
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening  
screw to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
13.11 Operating Environment  
Do not use this product under the following environmental conditions, on deterioration of the performance, such  
as insulation resistance may result from the use.  
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)  
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.  
MURATA MFG.CO.,LTD  
Reference Only  
Spec No.JEFK243A-0003E-01  
P9/9  
13.12 Storage Condition  
(1) Storage period  
Use the products within 12 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2) Storage environment conditions  
·Products should be stored in the warehouse on the following conditions.  
Temperature ： -10 ~ +40°C  
Humidity  
： 15 to 85% relative humidity No rapid change on temperature and humidity.  
· Products should not be storaged in corrosive gases, such as sulfureous, acid gases, alkaline gases,  
to prevent the following deterioration. Poor solderability due to the oxidized electrode.  
· Products should be storaged on the palette for the prevention of the influence from humidity,dust and so on.  
· Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on.  
· Products should not be storaged under the air tights packaged condition.  
(3) Delivery  
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  
!
14. △Notes  
(1)Please make sure that your product has been evaluated in view of your specifications with our product being  
mounted to your product.  
(2)You are requested not to use our product deviating from the reference specifications.  
(3)The contents of this reference specification are subject to change without advance notice. Please approve our  
product specifications or transact the approval sheet for product specifications before ordering.  
MURATA MFG.CO.,LTD  
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