SPECIFICATIONS
BGA 940 AM2 T2
BGA CPU Socket
Mechanical
BGA SMT Type
Contact Rentention Force: 0.13kgf min.
Durability: 50 Cycles min.
1.27X1.27mm [.05X.05”] Pitch
940 Pos.
Solder Ball Shear Force: 750gf min.
Unlatch Force: 240gf min.
Electrical
Contact Resistance : 25 mΩ max.
Insulation Resistance: 1000mΩ min.
Dielectric Withstanding Voltage: 650 VAC min.
Physical
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Cam: Stainless Steel
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55℃ to +110℃
DRAWING
LF
ORDERING INFORMATION
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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