F-219
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
Integral metal plane
for power or ground
Board Mates:
Standard stack heights
from 5 mm to 25 mm
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Standoffs:
SO
Au or Sn over
POWER/SIGNAL
APPLICATION
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
10 YEAR MFG
WITH 50 µ" GOLD
HIGH-SPEED CHANNEL PERFORMANCE
EXTENDED LIFE
PRODUCT
QTE-D/QSE-D QTE-DP/QSE-DP
QTE-D/QSE-D or QTE-DP/QSE-DP
HIGH MATING
CYCLES
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
100
28
14
RoHS Compliant:
Yes
G
b p s
G
b p s
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
PROCESSING
Lead–Free Solderable:
Yes
TYPE
QTE
A
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
Specify
LEAD
STYLE
from
–K
For applications requiring
more than two connectors per
board contact ipg@samtec.com
= (7.00 mm)
.275" DIA
–020, –040, –060
–F
–D
(40 total pins per bank = –D)
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= Single-Ended
Polyimide
Film Pick &
Place Pad
chart
RECOGNITIONS
–014, –028, –042
–D–DP
= Differential Pair
(–01 only)
(14 pairs per bank = –D–DP)
For complete scope of
recognitions see
www.samtec.com/quality
–TR
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
FILE NO. E111594
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
–L
ALSO AVAILABLE
–C*
01
= Latching
Option
= Electro-Polished
Selective
(MOQ Required)
(5.97)
.235
(7.11)
.280
(N/A on –042 &
–060 positions)
• 15 mm, 22 mm and
30 mm stack height
50 µ" (1.27 µm) min
Au over 150µ"
02
(0.80)
.0315
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1.27 µm) min Ni on
all solder tails
(0.20)
.008
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
QTE
LEAD
STYLE
HEIGHT
WITH QSE*
A
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
A
(4.27) .168 (5.00) .197
(7.26) .286 (8.00) .315
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
–01
–02
–03
–04
–05
–07
–09
• 56 (-DP), 80, 100
positions per row
• Retention Option
(0.76)
.030
*Note:
–C Plating passes
10 year MFG testing
(0.64)
.025
(0.89)
.035 DIA
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Note:
–L
Some lengths, styles and
options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
