Tape and Reel Specifications
◎Embossed Taping
P0
T
D0
P2
E
F
W
B0
K0
Top Tape
A0
D1
P1
T2
Direction of unreeling
Tape in accordance can be supplied to IEC publication 286-3
Symbol
DIMENSIONS (mm)
∮D0
∮D1
A0
±0.1
B0
±0.1
W
±0.3
F
±0.1
E
±0.1
P1
±0.1
P2
±0.1
P0
±0.1
T
Max.
T2
Max.
＋0.1
－0
Min.
Type
08CH
5.5
8.5
16
7.5
1.75
8.0
2.0
4.0
1.5
1.0
3.0
1.5
K0：
Depth of Cavity: Dependent Chip Size to Minimize Rotation
Precautions to the user for CH-series Surface mount MOV:
1. Soldering recommendation:
Material: 62/36/2 Sn/Pb/Ag or equivalent
Reflow temperature/time: 230℃ max. /10 sec. max.
Flux: non-activated
2. When mounting surface mount varistor on the PC board, the improper soldering temperature and time
out of the limits may reduce the adhesive strength of their terminals.
3. Put the proper volume of solder（the height of fillet）on PC board for installing surface mount
varistors, because it directly affects the installed varistors. The design of copper pad patterns and
dimensions should be set, so that the proper volume of solder can provide.
4. Do not use solvents such as thinner and acetone, which dissolve or make the exterior covering of
varistor deteriorate. Ultrasonic cleaning shall be so set that the vibration can not travel the assembly
boards.
5. For surface mount CH series MOV, use flux with a halogen content of less than 0.2 wt. Do not use
strong acid flux.
6. Store varistors at temperature of –10 to +40℃ and relative humidity of less than 75 . Avoid storing
in environment of rapid changes in temperature, direct sunlight, corrosive, gas or dust, and store with
the varistors packaged.
DB LECTRO Inc. 3600 boul. Matte suite i Brossard Qc J4Y-2Z2 tel:(450)-444-1424 fax:(450)-444-4714 www.dblectro.com
