1SMF5920BT1G
PACKAGE DIMENSIONS
SOD−123FL
CASE 498−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
E
q
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
MILLIMETERS
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
D
DIM
A
A1
b
c
D
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
NOM
0.95
0.05
0.90
0.15
1.65
2.70
0.75
3.60
−
MAX
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
1.00
0.10
1.10
0.20
1.80
2.90
0.95
3.80
8°
A1
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
E
L
L
H
E
q
b
SOLDERING FOOTPRINT*
0.91
0.036
H
E
q
1.22
0.048
c
2.36
0.093
4.19
mm
inches
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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