IXXH30N60B3D1
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
TO-247 (IXXH) Outline
Min.
Typ.
Max.
gfs
IC = 24A, VCE = 10V, Note 1
8
14
S
Cies
Coes
Cres
1185
137
25
pF
pF
pF
VCE = 25V, VGE = 0V, f = 1MHz
∅ P
1
2
3
Qg(on)
Qge
Qgc
39
9
nC
nC
nC
IC = 24A, VGE = 15V, VCE = 0.5 • VCES
17
td(on)
tri
Eon
td(off)
tfi
23
36
ns
ns
mJ
ns
ns
e
Inductive load, TJ = 25°C
IC = 24A, VGE = 15V
Terminals: 1 - Gate
3 - Emitter
2 - Collector
0.55
97
Dim.
Millimeter
Min. Max.
Inches
Min. Max.
150
VCE = 400V, RG = 10Ω
125
0.50
A
A1
A2
4.7
2.2
2.2
5.3
2.54
2.6
.185 .209
.087 .102
.059 .098
Note 2
Eof
0.80 mJ
f
td(on)
tri
23
34
ns
ns
b
b1
b2
1.0
1.65
2.87
1.4
2.13
3.12
.040 .055
.065 .084
.113 .123
Inductive load, TJ = 150°C
IC = 24A, VGE = 15V
Eon
td(off)
tfi
1.10
112
180
0.70
mJ
ns
C
D
E
.4
.8
.016 .031
.819 .845
.610 .640
20.80 21.46
15.75 16.26
VCE = 400V, RG = 10Ω
ns
e
L
L1
5.20
19.81 20.32
4.50
5.72 0.205 0.225
Note 2
.780 .800
.177
Eoff
mJ
∅P 3.55
3.65
.140 .144
RthJC
RthCS
0.55 °C/W
°C/W
Q
5.89
6.40 0.232 0.252
0.21
R
S
4.32
6.15 BSC
5.49
.170 .216
242 BSC
Reverse Diode (FRED)
Symbol Test Conditions
Characteristic Values
(TJ = 25°C Unless Otherwise Specified)
Min. Typ.
Max.
VF
IF = 30A, VGE = 0V, Note 1
2.7
V
V
TJ = 150°C
1.6
IRM
trr
TJ = 100°C
TJ = 100°C
4
A
ns
ns
IF = 30A, VGE = 0V, -diF/dt = 100A/μs,
VR = 100V
100
25
IF = 1A, VGE = 0V, -diF/dt = 100A/μs, VR = 30V
RthJC
0.9 °C/W
Notes:
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Switching times & energy losses may increase for higher VCE(clamp), TJ or RG.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions,and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or more of the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537