Product specification
NTR4502P, NVTR4502P
Power MOSFET
V
R
TYP
I
D
Max (Note 1)
−1.95 A
(BR)DSS
DS(on)
155 mW @ −10 V
240 mW @ −4.5 V
−30 V, −1.95 A, Single, P−Channel,
SOT−23
−30 V
P−Channel MOSFET
Features
S
• Leading Planar Technology for Low Gate Charge / Fast Switching
• Low R
for Low Conduction Losses
DS(ON)
G
• SOT−23 Surface Mount for Small Footprint (3 X 3 mm)
• AEC Q101 Qualified − NVTR4502P
• These Devices are Pb−Free and are RoHS Compliant
Applications
• DC to DC Conversion
D
• Load/Power Switch for Portables and Computing
• Motherboard, Notebooks, Camcorders, Digital Camera’s, etc.
• Battery Charging Circuits
MARKING DIAGRAM/
PIN ASSIGNMENT
Drain
3
TR2 M G
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
G
SOT−23
CASE 318
STYLE 21
Parameter
Drain−to−Source Voltage
Symbol Value Unit
2
1
Gate
Source
V
DSS
−30
20
V
V
A
Gate−to−Source Voltage
V
GS
TR2 = Device Code
M
G
= Date Code*
Drain Current (Note 1)
t < 10 s T = 25°C
I
D
−1.95
−1.56
1.25
A
= Pb−Free Package
T = 70°C
A
(Note: Microdot may be in either location)
Power Dissipation
(Note 1)
t < 10 s
P
D
W
A
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Continuous Drain Current Steady T = 25°C
I
−1.13
−0.90
0.4
A
D
(Note 1)
State
Steady State
t = 10 ms
ORDERING INFORMATION
T = 70°C
A
Power Dissipation
(Note 1)
P
W
Device
Package
Shipping†
D
NTR4502PT1G
SOT−23
3000 / Tape & Reel
Pulsed Drain Current
I
−6.8
A
(Pb−Free)
p
DM
Operating Junction and Storage Temperature
T ,
STG
−55 to
°C
J
NVTR4502PT1G
SOT−23
(Pb−Free)
3000 / Tape & Reel
T
150
Source Current (Body Diode)
I
S
−1.25
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
T
L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
300
100
Unit
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t = 10 s (Note 1)
R
°C/W
q
JA
R
q
JA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces).
http://www.twtysemi.com
sales@twtysemi.com
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