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SZFP6F0A

型号：

SZFP6F0A

描述：

ž电源指示灯 - 超高光通量输出，高亮度[ Z Power LED - Super high Flux output and high Luminance ]

品牌：

SEOUL[ Seoul Semiconductor ]

页数：

23 页

PDF大小：

453 K

下载PDF手册
RoHS  
Specification  
SZFP6F0A  
SSC  
Customer  
Drawn Approval  
Approval  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
[ Contents ]  
1. Description  
------- 3  
2. Full code of Z6  
------- 4  
------- 5  
3. Outline dimension  
4. Characteristics of Z6  
5. Characteristic diagrams  
6. Binning Structure  
7. Labeling  
------- 6  
------- 10  
------- 17  
------- 18  
8. Reel Packing  
------- 19  
------- 20  
8. Recommended solder pad  
9. Soldering profile  
10. Precaution for Use  
11. Revision Profile  
------- 21  
------- 22  
------- 24  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
SZFP6F0A  
SZFP6F0A  
Description  
Features  
Z-Power series is designed for high  
• Super high Flux output  
and high Luminance  
• Designed for high  
current operation  
• Low thermal resistance  
• SMT solderability  
• Lead Free product  
• RoHS compliant  
current operation andhigh flux output  
applications.  
Z-Power LED's thermal management  
perform exceeds other power LED solutions.  
It incorporates state of the art SMD design and  
Thermal emission material.  
Full color Z-Power LED is using 4 RGBW power chips and  
isolated thermal slug.  
In case of the full color product used in architectural  
lighting or decoration, it emits diverse colors(Full, Pastel) in  
one package so that it can render a clear mixed color when  
it is mixed with other colors.  
Applications  
• Automotive interior /  
exterior lighting  
• Architectural lighting  
• Task lighting  
• Decorative /  
Pathway lighting  
• Remote /  
Solar powered lighting  
• Household appliances  
* The appearance and specifications of the product can be changed  
for improvement without notice.  
SZFP6F0A  
Rev. 00  
March. 2012  
3
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Full code of Z6 (SZFP6A0A)  
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11X12X13X14X15X16  
X1  
X2  
Company  
S
Z
F
P
6
F
0
A
-
SSC  
Package series  
Z-Power  
X3  
Full Color  
Pure White  
Color  
X4  
X5  
Z-Power series number  
Lens type  
Z6 series  
X6  
Flat White  
X7  
PCB type  
Emitter  
X8  
Revision No.  
Rev0  
X9  
Luminous flux (Red)  
Luminous flux (Blue)  
Luminous flux (Green)  
Luminous flux (White)  
Dominant Wavelength (Red)  
Dominant Wavelength (Blue)  
-
-
-
-
-
-
X10  
X11  
X12  
X13  
X14  
-
-
-
-
-
Dominant Wavelength  
(Green)  
X15  
X16  
-
-
-
-
Color bin (White)  
2. Sticker Diagram on Reel & Aluminum Vinyl Bag  
X9 X10 X11 X12 X13 X14 X15 X16  
X1 X2 X3 X4 X5 X6 X7X8  
X1 X2 X3 X4 X5 X6 X7X8  
SZFP6F0A  
Rev. 01  
July. 2012  
4
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Outline Dimensions  
5
1
2
3
4
Cathode  
Mark  
6
R
B
7
8
W G  
Red ( - )  
White ( - )  
Green ( - )  
Blue ( - )  
NC  
Red ( + )  
White ( + )  
Green ( + )  
Blue ( + )  
<Rear view>  
Notes :  
1. Tolerance is 0.2mm  
2. Scale : none  
3. NC PAD isn't connected to anode or cathode  
*The appearance and specifications of the product may be changed for improvement without notice.  
SZFP6F0A  
Rev. 01  
July. 2012  
5
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z6 (SZFP6F0A)  
1. White  
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Parameter  
Symbol  
Unit  
Min  
Typ  
Max  
[1]  
[2]  
V
Luminous Flux  
-
-
80  
-
lm  
K
[3]  
Correlated Color Temperature  
CRI  
CCT  
Ra  
5300  
70  
-
-
[4]  
Forward Voltage  
VF  
2.8  
3.4  
4.1  
V
[5]  
View Angle  
2
1/2  
120  
12  
deg.  
[6]  
Thermal Resistance  
R
ºC /W  
J-C  
1-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
700  
Forward Current  
IF  
mA  
1000 (@1KHz, 1/10duty)  
2.66  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
W
ºC  
ºC  
ºC  
-
145  
Topr  
Tstg  
-
-30 ~ +85  
-40 ~ +100  
8,000V HBM  
[7]  
ESD Sensitivity  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrated sphere.  
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.  
CCT 5% tester tolerance.  
[4] A tolerance of  
[5] Viewing angle is the reference condition.  
[6] R is measured with each LED die. (25 ºC ≤TJ ≤ 110 ºC)  
0.06V on forward voltage measurements  
J-C  
[7] It is included the zener chip to protect the product from ESD.  
SZFP6F0A  
Rev. 01  
July. 2012  
6
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z6 (SZFP6F0A)  
2. Blue  
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Parameter  
Symbol  
Unit  
Min  
Typ  
Max  
[1]  
[2]  
V
Luminous Flux  
-
16  
-
lm  
[3]  
Dominant Wavelength  
λD  
455  
3.0  
465  
4.1  
nm  
V
[4]  
Forward Voltage  
VF  
3.4  
[5]  
View Angle  
2
1/2  
120  
deg.  
[6]  
Thermal Resistance  
R
8
ºC /W  
J-C  
2-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
700  
Forward Current  
IF  
mA  
1000 (@1KHz, 1/10duty)  
2.66  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
W
ºC  
ºC  
ºC  
-
145  
Topr  
Tstg  
-
-30 ~ +85  
-40 ~ +100  
8,000V HBM  
[7]  
ESD Sensitivity  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrated sphere.  
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.  
A tolerance of 1.0nm for dominant wavelength  
[4] A tolerance of  
[5] Viewing angle is the reference condition.  
[6] R is measured with each LED die. (25 ºC ≤TJ ≤ 110 ºC)  
0.6V on forward voltage measurements  
J-C  
[7] It is included the zener chip to protect the product from ESD.  
SZFP6F0A  
Rev. 01  
July. 2012  
7
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z6 (SZFP6F0A)  
3. Green  
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Parameter  
Symbol  
Unit  
Min  
Typ  
Max  
[1]  
[2]  
V
Luminous Flux  
-
60  
-
lm  
[3]  
Dominant Wavelength  
λD  
518  
3.0  
525  
3.4  
535  
4.2  
nm  
V
[4]  
Forward Voltage  
VF  
[5]  
View Angle  
2
1/2  
120  
10  
deg.  
[6]  
Thermal Resistance  
R
ºC /W  
J-C  
3-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
700  
Forward Current  
IF  
mA  
1000 (@1KHz, 1/10duty)  
2.56  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
W
ºC  
ºC  
ºC  
-
145  
Topr  
Tstg  
-
-30 ~ +85  
-40 ~ +100  
8,000V HBM  
[7]  
ESD Sensitivity  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrated sphere.  
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.  
A tolerance of 1.0nm for dominant wavelength  
[4] A tolerance of  
[5] Viewing angle is the reference condition.  
[6] R is measured with each LED die. (25 ºC ≤TJ ≤ 110 ºC)  
0.6V on forward voltage measurements  
J-C  
[7] It is included the zener chip to protect the product from ESD.  
SZFP6F0A  
Rev. 01  
July. 2012  
8
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Characteristics for Z6 (SZFP6F0A)  
4. Red  
4-1 Electro-Optical characteristics at IF=350mA, TA=25ºC  
Value  
Parameter  
Symbol  
Unit  
Min  
Typ  
Max  
[1]  
[2]  
V
Luminous Flux  
-
38  
-
lm  
[3]  
Dominant Wavelength  
λD  
618  
2.0  
625  
2.3  
632  
3.0  
nm  
V
[4]  
Forward Voltage  
VF  
[5]  
View Angle  
2
1/2  
120  
8
deg.  
[6]  
Thermal Resistance  
R
ºC /W  
J-C  
4-2 Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
700  
Forward Current  
IF  
mA  
1000 (@1KHz, 1/10duty)  
1.75  
Power Dissipation  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Pd  
Tj  
W
ºC  
ºC  
ºC  
-
125  
Topr  
Tstg  
-
-30 ~ +85  
-40 ~ +100  
8,000V HBM  
[7]  
ESD Sensitivity  
*Notes :  
[1] SSC maintains a tolerance of 10% on flux and power measurements.  
[2] V is the total luminous flux output as measured with an integrated sphere.  
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.  
A tolerance of 1.0nm for dominant wavelength  
[4] A tolerance of  
[5] Viewing angle is the reference condition.  
[6] R is measured with each LED die. (25 ºC ≤TJ ≤ 110 ºC)  
0.6V on forward voltage measurements  
J-C  
[7] It is included the zener chip to protect the product from ESD.  
SZFP6F0A  
Rev. 01  
July. 2012  
9
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
                                  
Color Spectrum, Ta=25℃  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Red  
Green  
Blue  
White  
350  
400  
450  
500  
550  
600  
650  
700  
750  
800  
Wavelength(nm)  
SZFP6F0A  
Rev. 01  
July. 2012  
10  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Forward Current Characteristics  
Forward Voltage vs. Forward Current , Ta=25  
0.8  
Red  
Green  
Blue  
White  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
Forward Voltage (V)  
Forward Current vs. Relative Luminous Flux, Ta=25  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Red  
Green  
Blue  
White  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
Forward Current (A)  
SZFP6F0A  
Rev. 01  
July. 2012  
11  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Forward Current vs. Dominant Wavelength Shift, Ta=25  
10  
Red  
Green  
Blue  
8
6
4
2
0
-2  
-4  
-6  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
Forward Current (A)  
SZFP6F0A  
Rev. 01  
July. 2012  
12  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Junction Temperature Characteristics  
Relative Light Output vs. Junction Temperature at IF=350mA  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
Red  
0.2  
0.1  
0.0  
Green  
Blue  
White  
25  
50  
75  
100  
125  
Junction Temperature (Celcius)  
Forward Voltage Shift vs. Junction Temperature at IF=350mA  
0.0  
Red  
Green  
Blue  
White  
-0.1  
-0.2  
-0.3  
-0.4  
-0.5  
SZFP6F0A  
Rev. 01  
25  
50  
75  
100  
125  
Junction Temperature [Celcius]  
July. 2012  
13  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Dominant Wavelength Shift vs. Junction Temperature at IF=350mA  
12  
Red  
Green  
Blue  
10  
8
6
4
2
0
-2  
25  
50  
75  
100  
125  
150  
Junction Temperature [Celcius]  
Radiation pattern at IF=350mA, Ta=25  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Red  
Blue  
Green  
White  
SZFP6F0A  
Rev. 01  
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
Angle(deg.)  
July. 2012  
14  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Maximum Forward Current vs. Ambient Temperature  
1. Red (Tjmax = 125 , at 700mA)  
0.8  
Red  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
RjaT = 40 /W  
RjaT = 30 /W  
RjaT = 20 /W  
0
25  
50  
75  
100  
125  
150  
Ambient Temperature [Celcius]  
2. Green (Tjmax = 145 , at 700mA)  
0.8  
Green  
0.7  
0.6  
0.5  
0.4  
RjaT = 40 /W  
RjaT = 30 /W  
RjaT = 20 /W  
0.3  
0.2  
0.1  
0.0  
25  
50  
75  
100  
125  
150  
SZFP6F0A  
Rev. 01  
Ambient Temperature [Celcius]  
July. 2012  
15  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
3. Blue (Tjmax = 145 , at 700mA)  
0.8  
Blue  
0.7  
0.6  
0.5  
RjaT = 40 /W  
RjaT = 30 /W  
RjaT = 20 /W  
0.4  
0.3  
0.2  
0.1  
0.0  
25  
50  
75  
100  
125  
150  
Ambient Temperature [Celcius]  
4. White (Tjmax = 145 , at 700mA)  
0.8  
White  
0.7  
0.6  
0.5  
RjaT = 40 /W  
RjaT = 30 /W  
RjaT = 20 /W  
0.4  
0.3  
0.2  
0.1  
0.0  
25  
50  
75  
100  
125  
150  
SZFP6F0A  
Rev. 01  
Ambient Temperature [Celcius]  
July. 2012  
16  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
                                                                  
Binning Structure  
IF=350mA, Ta=25℃  
0.40  
0.38  
0.36  
0.34  
0.32  
0.30  
0.31  
0.32  
0.33  
0.34  
0.35  
0.36  
0.37  
CIE (x)  
Bin  
B
CIE x  
CIE y  
0.3616  
0.3462  
0.3243  
0.3369  
0.3616  
0.3760  
0.3616  
0.3369  
0.3487  
0.3760  
0.3376  
0.3207  
0.3222  
0.3366  
0.3376  
0.3551  
0.3376  
0.3366  
0.3515  
0.3551  
C
SZFP6F0A  
Rev. 01  
July. 2012  
17  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Label  
Rank :  
X X X X X X X X  
15 16  
3  
9
10 11 12 13 14  
1000  
QUANTITY :
Lot No : # # # # # # # # #  
SSC PART NUMBER :
X1X2X3X4X5X6X7X8  
X X X X X X X X  
5  
8
1
2
3
4
6
7
Full code form :  
X1X2X3X4X5X6X7X8  
- X1 : Company  
- X2 : Z-Power LED series number  
- X3X4 : Color  
- X5 : Series number  
- X6 : Lens type  
- X7 : PCB type  
- X8 : Revision number  
Rank  
X9X10X11X12X13X14X15X16  
- X9 : Luminous Flux (Red)  
- X16 : Color bin  
- X10 : Luminous Flux (Blue)  
- X11 : Luminous Flux (Green)  
- X12 : Luminous Flux (White)  
- X13 : Dominant Wavelength (Red)  
- X14 : Dominant Wavelength (Blue)  
- X15 : Dominant Wavelength (Green)  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Emitter Carrier & Reel Packaging  
Notes :  
[1] The number of loaded products in the reel is 500 or 1000 pcs  
[2] All dimensions are in millimeters. (tolerance : 0.2)  
[3] Scale : none  
*The appearance and specifications of the product may be changed for improvement without  
notice.  
SZFP6F0A  
Rev. 01  
July. 2012  
19  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Recommended solder pad  
ISOLATION  
SOLDER PAD  
Notes :  
[1] All dimensions are in millimeters.  
[2] Scale : none  
[3] This drawing without tolerances are for reference only  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Reflow Soldering Conditions / Profile  
IPC/JEDEC J-STD-020C  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Average ramp-up rate (Tsmax to Tp)  
3°C/second max.  
3°C/second max.  
Preheat  
- Temperature Min (Tsmin)  
- Temperature Max (Tsmax)  
- Time (Tsmin to Tsmax) (ts)  
100 °C  
150 °C  
60-120 seconds  
150 °C  
200 °C  
60-180 seconds  
Time maintained above:  
- Temperature (TL)  
- Time (tL)  
183 °C  
60-150 seconds  
217 °C  
60-150 seconds  
Peak Temperature (Tp)  
215  
260  
Time within 5°C of actual Peak  
Temperature (tp)2  
10-30 seconds  
20-40 seconds  
Ramp-down Rate  
6 °C/second max.  
6 °C/second max.  
Time 25°C to Peak Temperature  
6 minutes max.  
8 minutes max.  
* Caution  
1. Reflow soldering should not be done more than one time.  
2. Repairs should not be done after the LEDs have been soldered. When  
repair is unavoidable, suitable tools must be used.  
3. Die slug is to be soldered.  
4. When soldering, do not put stress on the LEDs during heating.  
5. After soldering, do not warp the circuit board.  
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.  
SZFP6F0A  
Rev. 01  
July. 2012  
21  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Precaution for use  
• Storage  
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box  
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum  
humidity of 50%.  
• Use Precaution after Opening the Packaging  
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may  
affect the light output efficiency.  
Pay attention to the following:  
a. Soldering should be done immediately after opening the package (within 24Hrs).  
b. Required conditions after opening the package  
- Sealing  
- Temperature : 5 ~ 40  
Humidity : less than 30%  
c. If the package has been opened more than 1 week or the color of the desiccant changes,  
components should be dried for 10-12hr at 60 5  
• Do not apply mechanical force or excess vibration during the cooling process to normal  
temperature after soldering.  
• Do not rapidly cool device after soldering.  
• Components should not be mounted on warped (non coplanar) portion of PCB.  
• Radioactive exposure is not considered for the products listed here in.  
• Gallium arsenide is used in some of the products listed in this publication. These products are  
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to  
drink the liquid or inhale the gas generated by such products when chemically disposed of.  
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When washing is required, IPA (Isopropyl Alcohol) should be used.  
• When the LEDs are in operation the maximum current should be decided after measuring the  
package temperature.  
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or  
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used  
for storage.  
• The appearance and specifications of the product may be modified for improvement without  
notice.  
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.  
• The slug is isolated from anode electrically.  
Therefore, we recommend that you don’t isolate the heat sink.  
• Attaching LEDs, do not use adhesives that outgas organic vapor.  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Handling of Silicone resin LEDs  
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.  
Notes for handling:  
• Avoid touching silicone resin parts especially with sharp tools such as Pincette  
(Tweezers)  
• Avoid leaving fingerprints on silicone resin parts.  
• Silicone resin will attract dust so use covered containers for storage.  
• When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that excessive mechanical  
pressure on the surface of the resin must be prevented.  
• It is not recommend to cover the silicone resin of the LEDs with other resin  
(epoxy, urethane, etc)  
SZFP6F0A  
Rev. 01  
July. 2012  
www.seoulsemicon.com  
Document No. : SSC-QP-7-07-24 (Rev.00)  
厂商 型号 描述 页数 下载

ETC

 		SZF-01T-P0.7 可拆卸式压接式的线对线连接器[ Disconnectable Crimp style Wire-to-wire connectors ] 5 页

ETC

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