IXGL200N60B3
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min.
Typ.
Max.
gfs
IC = 60A, VCE = 10V, Note 1
VCE = 25V, VGE = 0V, f = 1MHz
95
160
S
Cies
Coes
Cres
26
1260
97
nF
pF
pF
Qg
750
115
245
nC
nC
nC
Qge
Qgc
IC = 100A, VGE = 15V, VCE = 0.5 • VCES
td(on)
tri
44
83
ns
ns
Inductive load, TJ = 25°C
IC = 100A, VGE = 15V
Eon
td(off)
tfi
1.6
310
183
2.9
mJ
VCE = 300V, RG = 1Ω
450 ns
300 ns
Eoff
4.5 mJ
td(on)
tri
42
80
ns
ns
Inductive load, TJ = 125°C
Eon
td(off)
tfi
2.4
430
300
4.2
mJ
ns
IC = 100A, VGE = 15V
V
CE = 300V, RG = 1Ω
ns
Eoff
mJ
RthJC
RthCS
0.31 °C/W
°C/W
0.11
NOTE: BOTTOM HEATSINK MEETS 2,500Vrms ISOLATION TO
THE OTHER PINS.
Note 1: Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
by one or more of the following U.S. patents: 4,850,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537