IXGH 10N170A
IXGT 10N170A
Symbol
gfs
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
TO-247 AD Outline
IC = I ; VCE = 20 V
Note 2 C25
3
5
S
∅ P
Cies
Coes
Cres
650
40
22
pF
pF
pF
VCE = 25 V, VGE = 0 V, f = 1 MHz
IC = IC90, VGE = 15 V, VCE = 0.5 VCES
QG
QGE
QGC
29
5
10
nC
nC
nC
e
Dim.
Millimeter
Inches
Min. Max.
Min.
Max.
A
A12
4.7
2.2
2.2
1.0
1.65
2.87
5.3
2.54
2.6
1.4
2.13
3.12
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
td(on)
tri
td(off)
tfi
46
57
190
35
ns
ns
360 ns
ns
A
Inductive load, TJ = 25°C
IC = IC25, VGE = 15 V
RG = 22 Ω, VCE = 0.5 VCES
b
b
b12
C
D
E
.4
.8
Eoff
0.38
0.8 mJ
20.80 21.46
15.75 16.26
e
5.20
5.72 0.205 0.225
L
19.81 20.32
4.50
.780 .800
.177
td(on)
tri
48
59
ns
ns
mJ
ns
L1
Inductive load, TJ = 125°C
IC = IC25, VGE = 15 V
RG = 22 Ω, VCE = 0.5 VCES
∅P 3.55
3.65
.140 .144
Q
5.89
4.32
6.40 0.232 0.252
Eon
1.2
R
S
5.49
.170 .216
242 BSC
td(off)
200
6.15 BSC
tfi
40
ns
Eoff
0.6
mJ
TO-268 Outline
RthJC
RthCK
0.89 K/W
K/W
(TO-247)
0.25
Notes:1. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
2. Pulse test, t ≤ 300 µs, duty cycle ≤ 2 %
Dim.
Millimeter
Inches
Min.
Max.
Min. Max.
A
4.9
2.7
.02
5.1
2.9
.25
.193 .201
.106 .114
.001 .010
A1
A2
b
1.15
1.9
.4
1.45
.045 .057
b2
2.1
.75
.83
C
.65
.016 .026
D
E
13.80 14.00
.543 .551
.624 .632
.524 .535
15.85 16.05
E1
13.3
13.6
e
H
L
5.45 BSC
.215 BSC
.736 .752
.094 .106
18.70 19.10
2.40
1.20
2.70
1.40
L1
.047 .055
L2
L3
L4
1.00
1.15
.039 .045
.010 BSC
0.25 BSC
3.80
4.10
.150 .161
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYSMOSFETs andIGBTsarecovered byoneormore
ofthefollowingU.S.patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 6,583,505