F-211-1
QSH–060–01–L–D–DP–A
®
QSH–060–01–L–D–A–K
(0,50mm) .0197"
QSH SERIES
QSH–030–01–F–D–A–RT1
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
for power or ground
Board Mates:
QTH
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Cable Mates:
HQCD, HQDP,
HFHM2
(See Application
Specific note)
• Retention pin
option
®
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
TM
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTH
Blade &
Beam Design
5mm Stack Height
Type
–D
Rated @ 3dB Insertion Loss
9 GHz / 18 Gbps
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Single-Ended Signaling
Differential Pair Signaling
–D
8 GHz / 16 Gbps
ALSO AVAILABLE
Differential Pair Signaling –DP
9.5 GHz / 19 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?QSH or contact
sig@samtec.com
Board Spacing Standoffs.
See SO Series.
Processing:
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
Lead-Free Solderable:
Yes
TYPE
QSH
A
01
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
–F
= Gold Flash
–D
= Single-
Ended
–K
.325" DIA
Polyimide Film
Pick & Place Pad
–030, –060, –090, –120
on Signal Pins
and Ground Plane,
MatteTin on tails
= (8,25mm)
(60 total pins per bank = –D)
–020, –040, –060, –080
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
–D–DP
= Differential
Pair
(20 pairs per bank = –D–DP)
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
MatteTin on tails
–TR
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
(–01 only)
= Tape & Reel
(–090 positions
maximum)
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
–C*
–RT1
= Retention
Option
(–090 positions
maximum)
02
= Electro-Polished
Selective
component height
restrictions. Please consult
machinery specifications.)
(7,49)
.295
50µ" (1,27µm) min Au
over 150µ" (3,81µm)
Ni on Signal Pins
in contact area,
• 30µ" (0,76µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
01
(0,50)
.0197
(0,15)
.006
–L
10µ" (0,25µm) min Au
QTH
LEAD
MATED
HEIGHT
= Latching
Option
over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1,27µm) min Ni
STYLE WITH QSH*
(N/A on
(5,00) .197
–01
–02
–03
–04
–060 (–D–DP),
–080, –090 &
–120 positions
or –RT1 option)
(3,25)
.128
(3,05)
.120
(8,00) .315
(11,00) .433
on all solder tails
(7,24)
.285
(16,00) .630
(0,76)
.030
(19,00) .748
–05
(25,00) .984
–07
(3,81)
.150
(0,89)
*Note: –C Plating passes
(0,64)
.025
*Processing
conditions will
affect mated height.
.035
DIA
(3,76)
.148
DIA
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
–01
–RT1
WWW.SAMTEC.COM
