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XTL1029

型号:

XTL1029

描述:

高性能晶体的无线通信设备[ High Performance Crystal for Wireless Communications Devices ]

品牌:

RFM[ RF MONOLITHICS, INC ]

页数:

5 页

PDF大小:

582 K

Preliminary  
XTL1029  
• High Performance Crystal for Wireless Communications Devices  
• Excellent Frequency Stability and Reliability  
13.52915 MHz  
Crystal Unit  
• Ultra-Miniature Surface Mount Seam Weld Package  
• Complies with Directive 2002/95/EC (RoHS)  
P
b
The XTL1029 is a very high stability 13.52915 MHz crystal  
suitable for a wide range of communications applications. The XTL1029’s  
excellent frequency stability supports operation from -40 to +85 °C.  
SM3225-4 Case  
Electrical Characteristics  
Characteristic  
Sym  
Notes  
Minimum  
Typical  
13.52915  
Maximum  
Units  
F
Nominal Frequency  
MHz  
O
Mode of Oscillation  
Fundamental  
Storage Temperature Range in Tape and Reel  
Operating Temperature Range  
Frequency Stability over Operating Temperature Range  
-40  
-40  
+85  
+85  
°C  
°C  
±100 ppm (referred to the value at 25 °C)  
F
Frequency Make Tolerance  
Equivalent Series Resistance  
Shunt Capacitance  
±30 ppm @ 25 °C ±3 °C  
L
ESR  
70  
pF  
µW  
pF  
C
7
O
Nominal Drive Level  
100  
C
Load Capacitance  
16  
±1.0 ppm/year @ 25 °C  
500  
L
Aging  
Insulation Resistance  
M  
Standard Shipping Quantity on 178 mm (7”) Reel  
Lid Symbolization (in addition to Lot and/or Date Codes)  
3000  
units  
1029 YWWS  
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CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.  
Notes:  
1.  
2.  
3.  
US and international patents may apply.  
The design, manufacturing process, and specifications of this device are subject to change without notice.  
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 1 of 5  
XTL1029 2/4/10  
4-Terminal Surface-Mount Seam Weld Case  
3.2 x 2.5 mm Nominal Footprint  
PCB Footprint (mm)  
Package Dimensions  
Package Orientation in Carrier Tape  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 2 of 5  
XTL1029 2/4/10  
Reel Dimensions  
Tape Dimensions  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 3 of 5  
XTL1029 2/4/10  
Packing Details  
3K pcs maximum per reel  
Typical Solder Reflow Profile  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 4 of 5  
XTL1029 2/4/10  
Reliability Specifications  
Test name  
Reference  
standard  
Test process / method  
Mechanical characteristics  
resistance to  
Soldering heat  
(IR reflow)  
Temp./ Duration : 260°C /10sec ×2 times  
Total time : 4min.(IR-reflow)  
EIAJED-4701  
-300(301)M(II)  
Vibration  
Total peak amplitude : 1.5mm  
Vibration frequency : 10 to 55 Hz  
MIL-STD 202F  
method 201A  
Sweep period  
Vibration directions : 3 mutually perpendicular  
Duration : 2 hr / direc.  
: 1.0 minute  
Mechanical  
Shock  
directions : 3 impacts per axis  
Acceleration : 3000g's, +20/-0 %  
MIL-STD 202F  
method 213C  
Duration  
: 0.3 ms (total 18 shocks)  
Waveform : Half-sine  
Solderability  
Solder Temperature:265±5°C  
Duration time: 5±0.5 seconds.  
MIL-STD 883G  
method 2003  
Environmental characteristics  
Thermal Shock  
Heat cycle conditions  
-55 (30min)  
* cycle time : 10 times  
MIL-STD 883G  
method 1010.7  
125  
(30min)  
Humidity test  
Temperature : 70 ± 2 °C  
Relative humidity : 90~95%  
MIL-STD 202F  
method 103B  
Duration  
Temperature : 125 ± 2 °C  
Duration : 168 hours  
: 96 hours  
Dry heat  
( Aging test )  
MIL-STD 883G  
method 1008.2  
condition C  
PCT test  
Pressure: 2.06kg/cm2 (2.03*105 pa)  
Temperature : 121 ± 2 °C  
Relative humidity : 100%  
EIAJED-4701-3  
B-123A  
Duration  
: 24 hours  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 5 of 5  
XTL1029 2/4/10  
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