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XTL1003-1

型号:

XTL1003-1

描述:

表面贴装缝,焊缝套装[ Surface Mount Seam-Weld Package ]

品牌:

RFM[ RF MONOLITHICS, INC ]

页数:

6 页

PDF大小:

505 K

XTL1003-1  
Surface Mount Seam-Weld Package  
Good Frequency Stability over Temperature  
Excellent Reliability  
13.56000 MHz  
Crystal Unit  
Complies with Directive 2002/95/EC (RoHS)  
P
b
The XTL1003-1 is a surface mount 5.0 x 3.2 mm crystal unit for use in wireless  
telecommunications devices, especially where an ultra-miniature package is  
needed for mobility.  
SM5032-4 Case  
Electrical Characteristics  
Characteristic  
Sym  
Notes  
Minimum  
Typical  
13.56000  
Maximum  
Units  
Nominal Frequency  
MHz  
Mode of Oscillation  
Fundamental  
Storage Temperature Range, Crystal Only  
Storage Temperature Range, in Tape and Reel  
Operating Temperature Range  
Frequency Stability over Operating Temperature Range  
-50  
-40  
-20  
+125  
+85  
°C  
°C  
°C  
+70  
±20 ppm (referred to the value at 25 °C)  
F
Frequency Make Tolerance  
Equivalent Series Resistance  
Shunt Capacitance  
±10 ppm @ 25 °C ±3 °C  
L
ESR  
40  
pF  
fF  
C
2.0  
O
C
Motional Capacitance  
4.2 ±20%  
M
Nominal Drive Level  
10  
13.5  
µW  
pF  
M  
C
Load Capacitance  
L
Insulation Resistance at 100 VDC  
500  
Aging  
±1.0 ppm/year @ 25 °C  
0.037 ±0.005  
3000  
Weight  
g
Stanard Shipping Quantity on 330 mm (13”) Reel  
Lid Symbolization (in addition to Lot and/or Date Codes)  
units  
1003-1 YWWS  
C
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q
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1
3
C
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CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.  
Notes:  
1.  
2.  
3.  
US and international patents may apply.  
The design, manufacturing process, and specifications of this device are subject to change without notice.  
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 1 of 6  
XTL1003-1 - 2/3/10  
SM5032-4 Case  
4-Terminal Surface-Mount Seam Weld Case  
5.0 x 3.2 mm Nominal Footprint  
T
o
p
V
i
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w
5
.
0
±
0
.
1
D
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d
i
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e
s
P
i
n
3
l
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a
t
i
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n
Electrical Connections  
S
i
d
e
V
i
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w
Pin  
Connection  
0
.
8
±
0
.
1
1
2
3
4
COSC  
GND (lid)  
FSKOUT  
GND (lid)  
B
o
t
t
o
m
V
i
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w
1
.
2
2
.
4
±
0
.
2
±
0
.
1
0
1
.
.
8
4
1
4
2
3
±
±
0
0
.
.
1
2
1.7 ±0.1  
P
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n
s
2
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d
4
a
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d
D
i
m
e
n
s
i
o
n
s
a
r
e
i
n
m
m
2.2 ±0.1  
Footprint (mm)  
Pin 3  
Package Orientation in Carrier Tape  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 2 of 6  
XTL1003-1 - 2/3/10  
Reel Dimensions  
Tape Dimensions  
Notes:  
1. Unless otherwise specified, tolerance on dimensions is ±0.1 mm  
2. Material is black conductive polystyrene  
3. 10 pitch cumulative tolerance is ±0.2 mm  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 3 of 6  
XTL1003-1 - 2/3/10  
Typical Reflow Profile  
R
a
m
p
u
p
P
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e
h
e
a
t
R
e
f
l
o
w
C
o
o
l
D
o
w
n
3
2
2
1
1
0
5
0
5
0
0
0
0
0
0
5
0
0
0
6
0
1
2
0
1
8
0
2
4
0
3
0
0
3
6
0
T
i
m
e
(
s
e
c
o
n
d
s
)
Notes:  
1. Maximum peak temperature: 265 degrees C for 8 to 12 seconds  
2. Typical reflow temperature: 217 ±5 degrees C for 90 to 100 seconds  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 4 of 6  
XTL1003-1 - 2/3/10  
Packing - 3,000 units per reel maximum  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 5 of 6  
XTL1003-1 - 2/3/10  
Reliability Specifications  
Reference  
standard  
Test name  
Test process / method  
Mechanical characteristics  
resistance to  
Soldering heat  
(IR reflow)  
Temp./ Duration : 260 °C /10 seconds ×2 times  
EIAJED-4701  
-300(301)M(II)  
Total time : 4 minutes (IR-reflow)  
Vibration  
Total peak amplitude: 1.5 mm  
Vibration frequency: 10 to 55 Hz  
MIL-STD 202F  
method 201A  
Sweep period:  
Vibration directions:  
Duration:  
1.0 minute  
3 mutually perpendicular  
2 hours per direction  
Mechanical  
Shock  
Directions: 3 impacts per axis  
Acceleration: 3000g's, +20/-0 %  
MIL-STD 202F  
method 213C  
Duration:  
0.3 ms (total 18 shocks)  
Waveform : Half-sine  
Solderability  
Solder Temperature: 265 ±5°C  
MIL-STD 883G  
method 2003  
Duration time:  
5 ±0.5 seconds.  
Environmental characteristics  
Thermal Shock  
Heat cycle conditions  
MIL-STD 883G  
method 1010.7  
-55 °C, 30 minutes <> 125 °C, 30 minutes  
* cycle time : 10 times  
Humiditytest  
Temperature:  
Relative humidity: 90~95%  
70 ± 2 °C  
MIL-STD 202F  
method 103B  
Duration:  
96 hours  
Dry heat  
( Aging test )  
Temperature:  
Duration:  
125 ± 2 °C  
168 hours  
MIL-STD 883G  
method 1008.2  
condition C  
PCT test  
Pressure:  
Temperature :  
2.06 kg/cm2 (2.03*105 pa)  
121 ± 2 °C  
EIAJED-4701-3  
B-123A  
Relative humidity : 100%  
Duration: 24 hours  
www.RFM.com E-mail: info@rfm.com  
©2009-2010 by RF Monolithics, Inc.  
Page 6 of 6  
XTL1003-1 - 2/3/10  
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