Teccor® brandThyristors
4 / 6 / 8 / 10 / 15 Amp Quadracs
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
-Time (min to max) (ts)
60 – 180 secs
Ramp-down
Preheat
Average ramp up rate (LiquidusTemp)
(TL) to peak
5°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
5°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
-Temperature (tL)
60 – 150 seconds
260°C +0/-5
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
8 minutes Max.
280°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
Terminal Finish
1005 MatteTin-plated
MIL-STD-750: Method 1040, Condition A
Rated VDRM (VAC-peak), 125°C, 1008
hours
HighTemperature
Voltage Blocking
UL Recognized epoxy meeting
flammability classification 94v-0
Body Material
Lead Material
MIL-STD-750: Method 1051
-40°C to 150°C, 15-minute dwell,
100 cycles
Temperature Cycling
Copper Alloy
BiasedTemperature & EIA/JEDEC: JESD22-A101
Humidity
320VDC, 85°C, 85%RH, 1008 hours
MIL-STD-750: Method 1031
150°C, 1008 hours
HighTemp Storage
Design Considerations
Low-Temp Storage
Thermal Shock
Autoclave
-40°C, 1008 hours
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of theThyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
EIA/JEDEC: JESD22-A102
(Pressure CookerTest) 121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability
Lead Bend
ANSI/J-STD-002, Category 3, Test A
MIL-STD-750: Method 2036, Condition E
QxxxxLTx Series
©2010 Littelfuse, Inc
160
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Revised:November1, 2010 05:04PM