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XTR108-DIE

型号:

XTR108-DIE

描述:

两线制变送器[ TWO-WIRE TRANSMITTER ]

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

5 页

PDF大小:

120 K

XTR108-DIE  
www.ti.com  
SBOS615 JUNE 2012  
TWO-WIRE TRANSMITTER  
"SMART" PROGRAMMABLE WITH SIGNAL CONDITIONING  
1
FEATURES  
Complete Transmitter + RTD Linearization  
APPLICATIONS  
Two-Wire Output  
Remote RTD Transmitters  
Pressure Bridge Transmitters  
Strain Gate Transmitters  
Eliminates Potentiometers and Trimming  
Digitally Calibrated  
Serial SPI Bus Interface  
SCADA Remote Data Acquisition  
Weighing Systems  
Industrial Process Control  
DESCRIPTION  
The XTR108 is a “smart” programmable, two-wire transmitter designed for temperature and bridge sensors. Zero,  
span, and linearization errors in the analog signal path can be calibrated via a standard digital serial interface,  
eliminating manual trimming. Non-volatile external EEPROM stores calibration settings.  
The all-analog signal path contains an input multiplexer, autozeroed programmable-gain instrumentation  
amplifier, dual programmable current sources, linearization circuit, voltage reference, sub-regulator, internal  
oscillator, control logic, and an output current amplifier. Programmable level shifting compensates for sensor DC  
offsets. Selectable up- and down-scale output indicates out-of-range and burnout per NAMUR NE43. Automatic  
reset is initiated when supply is lost.  
Current sources, steered through the multiplexer, can be used to directly excite RTD temperature sensors,  
pressure bridges, or other transducers. An uncommitted operational amplifier can be used to convert current into  
a voltage.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE(2)  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
XTR108TDD1  
XTR108TDD2  
130  
10  
XTR108  
TD  
Bare die in waffle pack  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
XTR108-DIE  
SBOS615 JUNE 2012  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
BARE DIE INFORMATION  
BACKSIDE  
POTENTIAL  
BOND PAD  
METALLIZATION COMPOSITION  
BOND PAD  
THICKNESS  
DIE THICKNESS  
BACKSIDE FINISH  
15.5 mils.  
Silicon with backgrind  
Floating  
Ti/AlSiCu/TiN  
800 nm  
2
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
XTR108-DIE  
www.ti.com  
SBOS615 JUNE 2012  
Table 1. Bond Pad Coordinates in Microns(1)  
DESCRIPTION  
PAD NUMBER  
X MIN  
643.35  
447.05  
259.85  
7.8  
Y MIN  
2732.35  
2732.35  
2732.35  
2430.35  
2247.2  
2045.55  
1760.25  
879.7  
X MAX  
741.35  
545.05  
357.85  
105.8  
Y MAX  
2830.35  
2830.35  
2830.35  
2528.35  
2345.2  
2143.55  
1858.25  
977.7  
V/I-0  
V/I-1  
V/I-2  
V/I-3  
V/I-4  
V/I-5  
CFILTER  
RLIN  
1
2
3
4
5
7.8  
105.8  
6
7.8  
105.8  
7
7.8  
105.8  
8
7.8  
105.8  
VO  
9
7.8  
625.35  
327.4  
105.8  
791.85  
493.9  
IIN  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
7.8  
105.8  
IO  
333.7  
516.7  
743.5  
971.7  
1154.7  
1382.9  
1565.9  
1835.6  
1835.6  
1835.6  
1835.6  
1835.6  
1835.6  
1835.6  
1835.6  
1451.8  
1268.8  
7.65  
431.7  
105.65  
105.65  
105.65  
105.65  
105.65  
105.65  
105.65  
379  
IRET  
7.65  
614.7  
IRET  
7.65  
841.5  
IRET  
7.65  
1069.7  
1252.7  
1480.9  
1663.9  
1933.6  
1933.6  
1933.6  
1933.6  
1933.6  
1933.6  
1933.6  
1933.6  
1549.8  
1366.8  
VS  
7.65  
VS  
7.65  
VGATE  
CS2  
7.65  
281  
SDIO  
SCLK  
CS1  
547.35  
782.9  
645.35  
880.9  
1035  
1133  
RSET  
REFIN  
REFOUT  
OPA OUT  
OPA -IN  
OPA +IN  
1543.5  
1749.75  
1976.25  
2457.25  
2732.35  
2732.35  
1641.5  
1847.75  
2074.25  
2555.25  
2830.35  
2830.35  
(1) Substrate is N/C.  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Apr-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
XTR108TDD1  
XTR108TDD2  
PREVIEW  
PREVIEW  
0
0
130  
10  
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
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Applications  
www.ti.com/audio  
amplifier.ti.com  
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e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  
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