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IXFV26N50PS

型号:

IXFV26N50PS

描述:

额定雪崩禀快速二极管[ Avalanche Rated Fast Instrinsic Diode ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

5 页

PDF大小:

211 K

PolarHVTM  
Power MOSFET  
IXFH 26N50P  
IXFV 26N50P  
IXFV 26N50PS  
VDSS = 500 V  
ID25 26 A  
RDS(on) 230 mΩ  
trr 200 ns  
=
Avalanche Rated  
Fast Instrinsic Diode  
PreliminaryDataSheet  
Symbol  
TestConditions  
Maximum Ratings  
TO-247 (IXFH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
500  
500  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
VGSS  
VGSM  
Continuos  
Transient  
30  
40  
V
V
D (TAB)  
ID25  
IDM  
TC = 25°C  
26  
78  
A
A
TC = 25°C, pulse width limited by TJM  
IAR  
TC = 25°C  
TC = 25°C  
TC = 25°C  
26  
40  
A
mJ  
J
PLUS220 (IXFV)  
EAR  
EAS  
1.0  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 4 Ω  
,
10  
V/ns  
G
D
S
D (TAB)  
PD  
TC = 25°C  
400  
W
PLUS220SMD (IXFV_S)  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Plastic body  
300  
260  
°C  
°C  
G
S
D (TAB)  
Md  
Mounting torque  
Mounting force  
TO-3P  
(TO-247)  
1.13/10 Nm/lb.in.  
FC  
(PLUS220SMD)  
11..65/2.5..15  
N/lb  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
Weight  
6
5
g
g
PLUS220 & PLUS220SMD  
Features  
z International standard packages  
z Fast intrinsic diode  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
z Unclamped Inductive Switching (UIS)  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 4 mA  
VGS = 30 VDC, VDS = 0  
500  
V
V
rated  
z Low package inductance  
- easy to drive and to protect  
3.0  
5.0  
100  
nA  
Advantages  
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
µA  
µA  
z
Easy to mount  
TJ = 125°C  
250  
z
Space savings  
z
High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
230 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
DS99276A(09/05)  
© 2005 IXYS All rights reserved  
IXFH 26N50P  
IXFV 26N50P  
IXFV 26N50PS  
Symbol  
gfs  
TestConditions  
Characteristic Values  
TO-247 AD (IXFH) Outline  
(TJ = 25°C, unless otherwise specified)  
Min. Typ. Max.  
VDS = 20 V; ID = 0.5 ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
16  
26  
S
Ciss  
Coss  
Crss  
3600  
370  
57  
pF  
pF  
pF  
1
2
3
Terminals:  
1 - Gate  
2 - Drain  
3 - Source  
Tab - Drain  
td(on)  
tr  
td(off)  
tf  
20  
25  
58  
20  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 ID25  
RG = 4 (External)  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min.  
Max.  
A
A1  
A2  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185  
.087  
.059  
.209  
.102  
.098  
Qg(on)  
Qgs  
60  
20  
25  
nC  
nC  
nC  
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
b
b1  
b2  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040  
.065  
.113  
.055  
.084  
.123  
Qgd  
C
D
E
.4  
20.80  
15.75  
.8  
21.46  
16.26  
.016  
.819  
.610  
.031  
.845  
.640  
RthJC  
RthCK  
0.31  
K/W  
K/W  
0.21  
e
L
L1  
5.20  
19.81  
5.72  
20.32  
4.50  
0.205  
.780  
0.225  
.800  
.177  
Source-Drain Diode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
P  
3.55  
5.89  
3.65  
6.40  
.140  
0.232  
.144  
0.252  
Q
Symbol  
IS  
TestConditions  
R
S
4.32  
6.15 BSC  
5.49  
.170  
242 BSC  
.216  
VGS = 0 V  
26  
104  
1.5  
A
ISM  
Repetitive  
A
V
PLUS220 (IXFV) Outline  
VSD  
IF = IS, VGS = 0 V,  
E
E1  
A
A1  
E1  
L2  
Pulse test, t 300 µs, duty cycle d 2 %  
trr  
IF = 25A, -di/dt = 100 A/µs  
300  
3.3  
ns  
D1  
D
QRM  
VR = 100V  
µC  
L3  
L1  
PLUS220SMD (IXFV_S) Outline  
L
A
A1  
E
E1  
E1  
L2  
c
3X b  
A2  
2X e  
A
A1  
A2  
A3  
b
c
D
D1  
E
E1  
e
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
TAB - Drain  
D
A3  
L4  
L3  
L
A
L1  
A1  
A2  
b
c
D
D1  
E
E1  
e
2X b  
c
e
A2  
L
L1  
L2  
L3  
L4  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
TAB - Drain  
L
L1  
L2  
L3  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
IXFH 26N50P  
IXFV 26N50P  
IXFV 26N50PS  
Fig. 1. Output Characteristics  
Fig. 2. Extended Output Characteristics  
º
º
@ 25 C  
@ 25 C  
30  
27  
24  
21  
18  
15  
12  
9
60  
50  
40  
30  
20  
10  
0
V
GS  
= 10V  
7V  
V
GS  
= 10V  
7V  
6V  
6V  
5.5V  
5V  
5.5V  
5V  
6
3
4.5V  
6
0
0
0
0
1
2
3
4
5
7
8
0
3
6
9
12 15 18 21 24 27 30  
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
@ 125  
Fig. 4. RDS(on Normalized to 0.5 ID25  
Value vs. Junction Temperature  
)
º
C
30  
27  
24  
21  
18  
15  
12  
9
3.1  
2.8  
2.5  
2.2  
1.9  
1.6  
1.3  
1
V
GS  
= 10V  
7V  
V
GS  
= 10V  
6V  
5.5V  
5V  
I
= 26A  
D
I
= 13A  
D
6
0.7  
0.4  
3
4.5V  
0
2
4
6
8 10 12 14 16 18 20  
VD S - Volts  
-50  
-25  
0
25  
50  
75  
100 125 150  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to  
0.5 ID25 Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
27  
24  
21  
18  
15  
12  
9
3.4  
3
V
= 10V  
GS  
T = 125C  
J
2.6  
2.2  
1.8  
1.4  
1
6
T = 25C  
J
3
0.6  
0
5
10 15 20 25 30 35 40 45 50 55 60  
I D - Amperes  
-50  
-25  
0
25  
50  
TC - Degrees Centigrade  
75  
100 125 150  
© 2005 IXYS All rights reserved  
IXFH 26N50P  
IXFV 26N50P  
IXFV 26N50PS  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
40  
35  
30  
25  
20  
15  
10  
5
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
T = -40C  
J
25C  
125C  
T = 125C  
J
25C  
-40C  
0
0
3.5  
4
4.5  
5
5.5  
6
6.5  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
VG S - Volts  
I D - Amperes  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
10  
9
8
7
6
5
4
3
2
1
0
70  
V
= 250V  
DS  
60  
50  
40  
30  
20  
10  
0
I
I
= 13A  
D
G
= 10mA  
T = 125C  
J
T = 25C  
J
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
0
10 20 30 40 50 60 70 80 90 100  
VS D - Volts  
Q G - nanoCoulombs  
Fig. 12. Forward-Bias  
Safe Operating Area  
Fig. 11. Capacitance  
100  
10  
1
10000  
1000  
100  
R
Limit  
DS(on)  
C
iss  
25µs  
100µs  
C
C
oss  
rss  
1ms  
10ms  
DC  
T = 150C  
J
T
= 25C  
f = 1MHz  
C
10  
10  
100  
1000  
0
5
10  
15  
20  
VD S - Volts  
25  
30  
35  
40  
VD S - Volts  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXFH 26N50P  
IXFV 26N50P  
IXFV 26N50PS  
Fig. 13. Maximum Transient Thermal Resistance  
1.00  
0.10  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width - milliseconds  
© 2005 IXYS All rights reserved  
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