IXGA30N60C3D4
IXGP30N60C3D4
Symbol
Test Conditions
Characteristic Values
TO-263 (IXGA) Outline
(TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
g
IC = 20A, VCE = 10V, Note 1
9
16
S
fs
C
915
78
pF
pF
pF
ies
Coes
Cres
VCE = 25V, VGE = 0V, f = 1MHz
32
Qg
38
8
nC
nC
nC
Qge
Qgc
IC = 20A, VGE = 15V, VCE = 0.5 • VCES
17
td(on)
tri
16
26
ns
ns
Inductive Load, TJ = 25°C
IC = 20A, VGE = 15V
Eon
td(off)
0.27
42
mJ
ns
75
VCE = 300V, RG = 5Ω
t
47
ns
fi
Eoff
0.09 0.18
mJ
td(on)
tri
17
28
ns
ns
Inductive Load, TJ = 125°C
IC = 20A, VGE = 15V
Eon
td(off)
0.44
70
mJ
ns
VCE = 300V, RG = 5Ω
t
90
ns
fi
Eoff
0.33
mJ
RthJC
RthCS
0.56 °C/W
°C/W
TO-220
0.50
TO-220 (IXGP) Outline
Reverse Diode (FRED)
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
Min.
Typ.
Max.
VF
IF = 10A, VGE = 0V, Note 1
3.0
V
V
TJ = 150°C
TJ = 100°C
1.7
60
trr
ns
IF = 10A, -diF/dt = 200A/μs
IRM
TJ = 25°C
TJ = 100°C
3
4
A
A
VR = 300V
Pins: 1 - Gate
3 - Source
2 - Drain
4 - Drain
RthJC
2.5 °C/W
Note 1: Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405 B2 6,759,692
6,710,463
6,727,585
7,005,734 B2 7,157,338B2
7,063,975 B2
by one or more of the following U.S. patents: 4,850,072
4,881,106
6,259,123 B1
6,306,728 B1
6,771,478 B2 7,071,537