IXFV110N25T
IXFV110N25TS
Symbol
Test Conditions
Characteristic Values
PLUS220 (IXFV) Outline
(TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
65
110
S
Ciss
Coss
Crss
9400
850
55
pF
pF
pF
VGS = 0V, VDS = 25V, f = 1MHz
td(on)
tr
td(off)
tf
19
27
60
27
ns
ns
ns
ns
Resistive Switching Times
VGS = 15V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2Ω (External)
Qg(on)
Qgs
157
40
nC
nC
nC
VGS = 10V, VDS = 0.5 • VDSS, ID = 25A
Qgd
50
RthJC
RthCS
0.18 °C/W
°C/W
0.21
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
110
350
1.2
IS
VGS = 0V
A
A
V
ISM
VSD
Repetitive, pulse width limited by TJM
IF = 55A, VGS = 0V, Note 1
PLUS220SMD (IXFV_S) Outline
trr
170 ns
IF = 55A, -di/dt = 250A/μs
VR= 100V, VGS = 0V
QRM
IRM
946
nC
17
A
Notes: 1. Pulse test, t ≤ 300ms; duty cycle, d ≤ 2%.
2. On through-hole packages, RDS(on) Kelvin test contact location must be
5 mm or less from the package body.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537
by one or moreof the following U.S. patents: 4,850,072 5,017,508
4,881,106 5,034,796