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EZ430-RF2480

型号:

EZ430-RF2480

描述:

Z-加速的2.4GHz的ZigBee处理器[ Z-Accel 2.4 GHz ZigBee Processor ]

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

48 页

PDF大小:

953 K

CC2480  
Z-Accel 2.4 GHz ZigBee® Processor  
Accelerate your ZigBee Development  
Applications  
ZigBeesystems  
Home/Building automation  
Industrial control and monitoring  
Low power wireless sensor networks  
Set-top boxes and remote controls  
Automated Meter Reading  
Description  
The CC2480 (formerly known as CCZACC06)  
CC2480 supports TI’s SimpleAPI. SimpleAPI  
has only 10 API calls to learn, which drastically  
simplifies the development of ZigBee  
applications.  
is a cost-effective, low power, Z-Accel ZigBee  
Processor  
that  
provides  
full  
ZigBee  
functionality with a minimal development effort.  
Z-Accel is a solution where TI’s ZigBee stack,  
Z-Stack, runs on a ZigBee Processor and the  
application runs on an external microcontroller.  
The CC2480 handles all the timing critical and  
processing intensive ZigBee protocol tasks,  
and leaves the resources of the application  
microcontroller free to handle the application.  
Z-Accel makes it easy to add ZigBee to new or  
existing products at the same time as it  
provides great flexibility in choice of  
microcontroller.  
CC2480 interfaces any microcontroller through  
an SPI or UART interface. There is no need to  
learn a new microcontroller or new tools.  
CC2480 can for example be combined with an  
MSP430.  
Key Features  
o Wide supply voltage range (2.0V –  
3.6V)  
Simple integration of ZigBee into any  
design  
o Low current consumption (RX: 27  
mA, TX: 27 mA) and fast transition  
times.  
Running the mature and stable ZigBee  
2006 compliant TI Z-Stack  
SPI  
or  
UART  
interface  
to  
any  
External System  
microcontroller running the application  
o Very few external components  
o RoHS compliant 7x7mm QLP48  
package  
Simple API and full ZigBee API supported  
Can implement any type of ZigBee device:  
Coordinator, Router or End Device  
Automatically enters low power mode (<0.5  
uA) in idle periods when configured as End  
Device  
Peripherals and Supporting Functions  
o Port expander with 4 general I/O  
pins, two with increased sink/source  
capability  
Radio  
o Battery monitor and temperature  
sensor  
o 7-12 bits ADC with two channels  
o Robust power-on-reset and brown-  
out-reset circuitry  
o Fully integrated and robust IEEE  
802.15.4-compliant 2.4 GHz DSSS  
RF transceiver  
o Excellent receiver sensitivity and  
best in class robustness to  
interferers  
Tools and Development  
o Packet sniffer PC software  
o Reference designs  
Power Supply  
CC2480 Data Sheet SWRS074A  
Page 1 of 43  
 
CC2480  
Table Of Contents  
APPLICATIONS.............................................................................................................................................. 1  
DESCRIPTION ................................................................................................................................................ 1  
KEY FEATURES ............................................................................................................................................. 1  
TABLE OF CONTENTS ................................................................................................................................. 2  
1
2
3
4
5
ABBREVIATIONS................................................................................................................................ 4  
REFERENCES...................................................................................................................................... 5  
ABSOLUTE MAXIMUM RATINGS .................................................................................................. 6  
OPERATING CONDITIONS............................................................................................................... 6  
ELECTRICAL SPECIFICATIONS .................................................................................................... 7  
5.1 GENERAL CHARACTERISTICS ................................................................................................................ 8  
5.2 RF RECEIVE SECTION ........................................................................................................................... 9  
5.3 RF TRANSMIT SECTION......................................................................................................................... 9  
5.4 32 MHZ CRYSTAL OSCILLATOR.......................................................................................................... 10  
5.5 32.768 KHZ CRYSTAL OSCILLATOR.................................................................................................... 10  
5.6 32 KHZ RC OSCILLATOR..................................................................................................................... 11  
5.7 16 MHZ RC OSCILLATOR ................................................................................................................... 11  
5.8 FREQUENCY SYNTHESIZER CHARACTERISTICS ................................................................................... 12  
5.9 ANALOG TEMPERATURE SENSOR........................................................................................................ 12  
5.10 ADC ................................................................................................................................................... 12  
5.11 CONTROL AC CHARACTERISTICS........................................................................................................ 14  
5.12 SPI AC CHARACTERISTICS ................................................................................................................. 15  
5.13 PORT OUTPUTS AC CHARACTERISTICS............................................................................................... 15  
5.14 DC CHARACTERISTICS........................................................................................................................ 15  
6
7
8
PIN AND I/O PORT CONFIGURATION ........................................................................................ 17  
CIRCUIT DESCRIPTION ................................................................................................................. 19  
APPLICATION CIRCUIT ................................................................................................................. 20  
8.1 INPUT / OUTPUT MATCHING................................................................................................................. 20  
8.2 BIAS RESISTORS .................................................................................................................................. 20  
8.3 CRYSTAL............................................................................................................................................. 20  
8.4 VOLTAGE REGULATORS ...................................................................................................................... 20  
8.5 POWER SUPPLY DECOUPLING AND FILTERING...................................................................................... 21  
9
PERIPHERALS................................................................................................................................... 23  
9.1 RESET ................................................................................................................................................. 23  
9.2 I/O PORTS............................................................................................................................................ 23  
9.3 ADC ................................................................................................................................................... 25  
9.4 RANDOM NUMBER GENERATOR ......................................................................................................... 27  
9.5 USART............................................................................................................................................... 28  
10  
RADIO.................................................................................................................................................. 29  
10.1 IEEE 802.15.4 MODULATION FORMAT............................................................................................... 30  
10.2 DEMODULATOR, SYMBOL SYNCHRONIZER AND DATA DECISION ....................................................... 31  
10.3 FRAME FORMAT.................................................................................................................................. 31  
10.4 SYNCHRONIZATION HEADER ............................................................................................................... 32  
10.5 MAC PROTOCOL DATA UNIT ............................................................................................................... 32  
10.6 FRAME CHECK SEQUENCE ................................................................................................................... 32  
10.7 LINEAR IF AND AGC SETTINGS .......................................................................................................... 33  
10.8 CLEAR CHANNEL ASSESSMENT........................................................................................................... 33  
10.9 VCO AND PLL SELF-CALIBRATION.................................................................................................... 33  
10.10 INPUT / OUTPUT MATCHING................................................................................................................ 33  
10.11 SYSTEM CONSIDERATIONS AND GUIDELINES ...................................................................................... 34  
10.12 PCB LAYOUT RECOMMENDATION ...................................................................................................... 35  
10.13 ANTENNA CONSIDERATIONS............................................................................................................... 35  
CC2480 Data Sheet SWRS074A  
Page 2 of 43  
 
CC2480  
11  
VOLTAGE REGULATORS............................................................................................................... 36  
11.1 VOLTAGE REGULATORS POWER-ON.................................................................................................... 36  
12  
PACKAGE DESCRIPTION (QLP 48).............................................................................................. 37  
12.1 RECOMMENDED PCB LAYOUT FOR PACKAGE (QLP 48)...................................................................... 38  
12.2 PACKAGE THERMAL PROPERTIES......................................................................................................... 38  
12.3 SOLDERING INFORMATION .................................................................................................................. 38  
12.4 TRAY SPECIFICATION .......................................................................................................................... 38  
12.5 CARRIER TAPE AND REEL SPECIFICATION ............................................................................................ 38  
13  
14  
ORDERING INFORMATION........................................................................................................... 40  
GENERAL INFORMATION............................................................................................................. 41  
14.1 DOCUMENT HISTORY .......................................................................................................................... 41  
15  
16  
ADDRESS INFORMATION .............................................................................................................. 41  
TI WORLDWIDE TECHNICAL SUPPORT................................................................................... 41  
CC2480 Data Sheet SWRS074A  
Page 3 of 43  
CC2480  
1
ADC  
Abbreviations  
Analog to Digital Converter  
LSB  
Least Significant Byte  
AES  
AGC  
API  
Advanced Encryption Standard  
Automatic Gain Control  
MAC  
MISO  
MOSI  
MPDU  
MSB  
MUX  
NA  
Medium Access Control  
Master In Slave Out  
Master Out Slave In  
MAC Protocol Data Unit  
Most Significant Byte  
Multiplexer  
Application Programming Interface  
ARIB  
Association of Radio Industries and  
Businesses  
BOD  
Brown Out Detector  
BOM  
CCA  
Bill of Materials  
Not Available  
Clear Channel Assessment  
Code of Federal Regulations  
Central Processing Unit  
Cyclic Redundancy Check  
NC  
Not Connected  
CFR  
O-QPSK  
PA  
Offset - Quadrature Phase Shift Keying  
Power Amplifier  
CPU  
CRC  
PCB  
PER  
PHY  
PLL  
Printed Circuit Board  
Packet Error Rate  
CSMA-CA  
Carrier Sense Multiple Access with  
Collision Avoidance  
Physical Layer  
CW  
Continuous Wave  
Phase Locked Loop  
Power Mode 0-3  
DAC  
DC  
Digital to Analog Converter  
Direct Current  
PM{0-3}  
POR  
PWM  
QLP  
RAM  
RC  
Power On Reset  
DNL  
DSM  
DSSS  
EM  
Differential Nonlinearity  
Delta Sigma Modulator  
Direct Sequence Spread Spectrum  
Evaluation Module  
Pulse Width Modulator  
Quad Leadless Package  
Random Access Memory  
Resistor-Capacitor  
ENOB  
ESD  
ESR  
ETSI  
Effective Number of bits  
Electro Static Discharge  
Equivalent Series Resistance  
RCOSC  
RF  
RC Oscillator  
Radio Frequency  
RoHS  
RSSI  
RX  
Restriction on Hazardous Substances  
Receive Signal Strength Indicator  
Receive  
European Telecommunications  
Standards Institute  
EVM  
FCC  
FCF  
FCS  
I/O  
Error Vector Magnitude  
Federal Communications Commission  
Frame Control Field  
SCK  
SFD  
SHR  
SINAD  
SPI  
Serial Clock  
Start of Frame Delimiter  
Synchronization Header  
Signal-to-noise and distortion ratio  
Serial Peripheral Interface  
Static Random Access Memory  
Sleep Timer  
Frame Check Sequence  
Input / Output  
I/Q  
In-phase / Quadrature-phase  
IEEE  
Institute of Electrical and Electronics  
Engineers  
SRAM  
ST  
IF  
Intermediate Frequency  
Integral Nonlinearity  
T/R  
Tape and reel  
INL  
T/R  
Transmit / Receive  
ISM  
JEDEC  
Industrial, Scientific and Medical  
TBD  
THD  
TI  
To Be Decided / To Be Defined  
Total Harmonic Distortion  
Texas Instruments  
Joint Electron Device Engineering  
Council  
KB  
1024 bytes  
TX  
Transmit  
kbps  
LFSR  
LNA  
LO  
kilo bits per second  
Linear Feedback Shift Register  
Low-Noise Amplifier  
Local Oscillator  
UART  
Universal Asynchronous  
Receiver/Transmitter  
USART  
Universal Synchronous/Asynchronous  
Receiver/Transmitter  
LQI  
Link Quality Indication  
Least Significant Bit / Byte  
VGA  
Variable Gain Amplifier  
Crystal Oscillator  
LSB  
XOSC  
CC2480 Data Sheet SWRS074A  
Page 4 of 43  
 
CC2480  
2
References  
[1] IEEE std. 802.15.4 - 2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY)  
specifications for Low Rate Wireless Personal Area Networks (LR-WPANs).  
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf  
[2] CC2480 Interface Specification  
http://www.ti.com/lit/pdf/swra175  
CC2480 Data Sheet SWRS074A  
Page 5 of 43  
 
 
CC2480  
3
Absolute Maximum Ratings  
Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress  
exceeding one or more of the limiting values may cause permanent damage to the device.  
Table 1: Absolute Maximum Ratings  
Parameter  
Min  
–0.3  
–0.3  
Max  
Units  
Condition  
Supply voltage, VDD  
Voltage on any digital pin  
3.9  
V
V
All supply pins must have the same voltage  
VDD+0.3,  
max 3.9  
Voltage on the 1.8V pins (pin no.  
22, 25-40 and 42)  
–0.3  
–50  
2.0  
V
Input RF level  
10  
dBm  
°C  
Storage temperature range  
Reflow soldering temperature  
150  
260  
Device not programmed  
According to IPC/JEDEC J-STD-020C  
°C  
On RF pads (RF_P, RF_N, AVDD_RF1,  
and AVDD_RF2), according to Human  
Body Model, JEDEC STD 22, method A114  
<500  
V
ESD  
All other pads, according to Human Body  
Model, JEDEC STD 22, method A114  
700  
200  
V
V
According to Charged Device Model,  
JEDEC STD 22, method C101  
Caution! ESD sensitive device. Precaution should be used  
when handling the device in order to prevent  
permanent damage.  
4
Operating Conditions  
The operating conditions for CC2480 are listed in Table 2.  
Table 2: Operating Conditions  
Parameter  
Min  
Max  
Unit  
Condition  
Operating ambient temperature  
range, TA  
-40  
85  
°C  
Operating supply voltage  
2.0  
3.6  
V
The supply pins to the radio part must be driven  
by the 1.8 V on-chip regulator  
CC2480 Data Sheet SWRS074A  
Page 6 of 43  
 
 
 
CC2480  
5
Electrical Specifications  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 3: Electrical Specifications  
Parameter  
Min Typ Max  
Unit  
Condition  
Current Consumption  
Digital regulator on. 16 MHz RCOSC running. No radio,  
crystals, or peripherals active.  
Low CPU activity: no flash access (i.e. only cache hit), no  
RAM access.  
CPU Active Mode, 16 MHz,  
low CPU activity  
4.3  
5.1  
5.7  
mA  
mA  
mA  
Digital regulator on. 16 MHz RCOSC running. No radio,  
crystals, or peripherals active.  
CPU Active Mode, 16 MHz,  
medium CPU activity  
Medium CPU activity: normal flash access1, minor RAM  
access.  
Digital regulator on. 16 MHz RCOSC running. No radio,  
crystals, or peripherals active.  
High CPU activity: normal flash access, extensive RAM  
access and heavy CPU load.  
CPU Active Mode, 16 MHz,  
high CPU activity  
32 MHz XOSC running. No radio or peripherals active.  
Low CPU activity : no flash access (i.e. only cache hit),  
no RAM access  
CPU Active Mode, 32 MHz,  
low CPU activity  
9.5  
mA  
mA  
mA  
mA  
mA  
µA  
32 MHz XOSC running. No radio or peripherals active.  
Medium CPU activity: normal flash access1, minor RAM  
access.  
CPU Active Mode, 32 MHz,  
medium CPU activity  
10.5  
12.3  
26.7  
26.9  
190  
32 MHz XOSC running. No radio or peripherals active.  
High CPU activity: normal flash access1, extensive RAM  
access and heavy CPU load.  
CPU Active Mode, 32 MHz,  
high CPU activity  
CPU running at full speed (32MHz), 32MHz XOSC  
running, radio in RX mode, -50 dBm input power. No  
peripherals active. Low CPU activity.  
CPU Active and RX Mode  
CPU Active and TX Mode, 0dBm  
Power mode 1  
CPU running at full speed (32MHz), 32MHz XOSC  
running, radio in TX mode, 0dBm output power. No  
peripherals active. Low CPU activity.  
Digital regulator on, 16 MHz RCOSC and 32 MHz crystal  
oscillator off. 32.768 kHz XOSC, POR and ST active.  
RAM retention.  
Digital regulator off, 16 MHz RCOSC and 32 MHz crystal  
oscillator off. 32.768 kHz XOSC, POR and ST active.  
RAM retention.  
Power mode 2  
Power mode 3  
0.5  
0.3  
µA  
µA  
No clocks. RAM retention. POR active.  
Peripheral Current  
Consumption  
Adds to the figures above if the peripheral unit is  
activated  
Including 32.753 kHz RCOSC.  
When converting.  
Sleep Timer  
ADC  
0.2  
1.2  
3
µA  
mA  
mA  
mA  
Flash write  
Flash erase  
Estimated value  
3
Estimated value  
1 Normal Flash access means that the code used exceeds the cache storage so cache misses will  
happen frequently.  
CC2480 Data Sheet SWRS074A  
Page 7 of 43  
 
 
 
CC2480  
5.1 General Characteristics  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 4: General Characteristics  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Wake-Up and Timing  
Digital regulator on, 16 MHz RCOSC and  
32 MHz crystal oscillator off. Start-up of  
16 MHz RCOSC.  
Power mode 1 Æ power  
mode 0  
4.1  
µs  
µs  
Digital regulator off, 16 MHz RCOSC and  
32 MHz crystal oscillator off. Start-up of  
regulator and 16 MHz RCOSC.  
Power mode 2 or 3 Æ power  
mode 0  
120  
Time from enabling radio part in power  
mode 0, until TX or RX starts. Includes  
start-up of voltage regulator and crystal  
oscillator in parallel. Crystal ESR=16.  
Active Æ TX or RX  
32MHz XOSC initially OFF.  
Voltage regulator initially OFF  
525  
320  
µs  
µs  
Time from enabling radio part in power  
mode 0, until TX or RX starts. Includes  
start-up of voltage regulator.  
Active Æ TX or RX  
Voltage regulator initially OFF  
Radio part already enabled.  
Time until RX or TX starts.  
Active Æ RX or TX  
192  
192  
µs  
µs  
RX/TX turnaround  
Radio part  
RF Frequency Range  
2400  
2483.5  
MHz  
Programmable in 1 MHz steps, 5 MHz  
between channels for compliance with  
[1]  
Radio bit rate  
250  
2.0  
kbps  
As defined by [1]  
Radio chip rate  
MChip/s  
As defined by [1]  
CC2480 Data Sheet SWRS074A  
Page 8 of 43  
 
CC2480  
5.2 RF Receive Section  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 5: RF Receive Parameters  
Parameter  
Min  
Typ  
Max  
Unit Condition/Note  
Receiver sensitivity  
-92  
dBm PER = 1%, as specified by [1]  
Measured in 50 single endedly through a balun.  
[1] requires –85 dBm  
Saturation (maximum input  
level)  
10  
dBm PER = 1%, as specified by [1]  
Measured in 50 single endedly through a balun.  
[1] requires –20 dBm  
Adjacent channel rejection  
+ 5 MHz channel spacing  
Wanted signal -88dBm, adjacent modulated channel  
at +5 MHz, PER = 1 %, as specified by [1].  
41  
30  
55  
53  
dB  
[1] requires 0 dB  
Adjacent channel rejection  
- 5 MHz channel spacing  
Wanted signal -88dBm, adjacent modulated channel  
at -5 MHz, PER = 1 %, as specified by [1].  
dB  
[1] requires 0 dB  
Alternate channel rejection  
+ 10 MHz channel spacing  
Wanted signal -88dBm, adjacent modulated channel  
at +10 MHz, PER = 1 %, as specified by [1]  
dB  
[1] requires 30 dB  
Alternate channel rejection  
- 10 MHz channel spacing  
Wanted signal -88dBm, adjacent modulated channel  
at -10 MHz, PER = 1 %, as specified by [1]  
dB  
[1] requires 30 dB  
Channel rejection  
+ 15 MHz  
Wanted signal @ -82 dBm. Undesired signal is an  
802.15.4 modulated channel, stepped through all  
channels from 2405 to 2480 MHz. Signal level for  
PER = 1%. Values are estimated.  
55  
53  
dB  
- 15 MHz  
dB  
Co-channel rejection  
Wanted signal @ -82 dBm. Undesired signal is  
-6  
dB  
802.15.4 modulated at the same frequency as the  
desired signal. Signal level for PER = 1%.  
Blocking / Desensitization  
+ 5 MHz from band edge  
+ 10 MHz from band edge  
+ 20 MHz from band edge  
+ 50 MHz from band edge  
-42  
-29  
-26  
-22  
dBm Wanted signal 3 dB above the sensitivity level, CW  
dBm jammer, PER = 1%. Measured according to EN 300  
dBm 440 class 2.  
dBm  
- 5 MHz from band edge  
- 10 MHz from band edge  
- 20 MHz from band edge  
- 50 MHz from band edge  
-31  
-36  
-24  
-25  
dBm  
dBm  
dBm  
dBm  
Spurious emission  
30 – 1000 MHz  
1 – 12.75 GHz  
64  
75  
dBm  
dBm  
Conducted measurement in a 50 single ended  
load. Complies with EN 300 328, EN 300 440 class  
2, FCC CFR47, Part 15 and ARIB STD-T-66.  
Frequency error tolerance  
Symbol rate error tolerance  
±140  
±900  
ppm Difference between centre frequency of the received  
RF signal and local oscillator frequency.  
[1] requires minimum 80 ppm  
ppm Difference between incoming symbol rate and the  
internally generated symbol rate  
[1] requires minimum 80 ppm  
5.3 RF Transmit Section  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C, VDD=3.0V, and  
nominal output power unless stated otherwise.  
CC2480 Data Sheet SWRS074A  
Page 9 of 43  
 
CC2480  
Table 6: RF Transmit Parameters  
Parameter  
Min  
Typ  
Max Unit Condition/Note  
Nominal output  
power  
0
dBm  
Delivered to a single ended 50 load through a balun.  
[1] requires minimum –3 dBm  
Harmonics  
2nd harmonic  
3rd harmonic  
4th harmonic  
5th harmonic  
-50.7  
-55.8  
-54.2  
-53.4  
dBm Measurement conducted with 100 kHz resolution bandwidth on  
spectrum analyzer. Output Delivered to a single ended 50 load  
dBm  
dBm  
dBm  
through a balun.  
Maximum output power.  
Spurious emission  
30 - 1000 MHz  
1– 12.75 GHz  
1.8 – 1.9 GHz  
5.15 – 5.3 GHz  
Texas Instruments CC2480 EM reference design complies with  
EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-  
T-66.  
-47  
-43  
-58  
-56  
dBm  
dBm  
dBm  
dBm  
Transmit on 2480MHz under FCC is supported by duty-cycling  
The peak conducted spurious emission is -47 dBm @ 192 MHz  
which is in an EN 300 440 restricted band limited to -54 dBm. All  
radiated spurious emissions are within the limits of  
ETSI/FCC/ARIB. Conducted spurious emission (CSE) can be  
reduced with a simple band pass filter connected between  
matching network and RF connector (1.8 pF in parallel with 1.6  
nH reduces the CSE by 20 dB), this filter must be connected to  
good RF ground.  
EVM  
11  
%
Measured as defined by [1]  
[1] requires max. 35 %  
Optimum load  
impedance  
60  
+ j164  
Differential impedance as seen from the RF-port (RF_Pand  
RF_N) towards the antenna2.  
5.4 32 MHz Crystal Oscillator  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 7: 32 MHz Crystal Oscillator Parameters  
Parameter  
Min  
Typ  
Max  
Unit  
MHz  
ppm  
Condition/Note  
Crystal frequency  
32  
Crystal frequency  
accuracy  
- 40  
40  
Including aging and temperature dependency, as specified by [1]  
requirement  
ESR  
6
1
16  
1.9  
13  
60  
7
Simulated over operating conditions  
Simulated over operating conditions  
Simulated over operating conditions  
pF  
pF  
µs  
C0  
CL  
10  
16  
Start-up time  
212  
5.5 32.768 kHz Crystal Oscillator  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
2 This is for 2440MHz  
CC2480 Data Sheet SWRS074A  
Page 10 of 43  
 
 
 
CC2480  
Table 8: 32.768 kHz Crystal Oscillator Parameters  
Parameter  
Min  
Typ  
Max  
Unit Condition/Note  
Crystal frequency  
32.768  
kHz  
Crystal frequency  
accuracy  
–40  
40  
ppm  
Including aging and temperature dependency, as specified by [1]  
requirement  
ESR  
40  
0.9  
12  
130  
2.0  
16  
Simulated over operating conditions  
Simulated over operating conditions  
Simulated over operating conditions  
Value is simulated.  
kΩ  
pF  
C0  
CL  
pF  
Start-up time  
400  
ms  
5.6 32 kHz RC Oscillator  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 9: 32 kHz RC Oscillator parameters  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Calibrated frequency  
32.753  
kHz  
The calibrated 32 kHz RC Oscillator frequency  
is the 32 MHz XTAL frequency divided by 977  
Frequency accuracy after  
calibration  
±0.2  
+0.4  
+3  
%
Value is estimated.  
Temperature coefficient  
Supply voltage coefficient  
Initial calibration time  
Frequency drift when temperature changes  
after calibration. Value is estimated.  
% / °C  
% / V  
ms  
Frequency drift when supply voltage changes  
after calibration. Value is estimated.  
1.7  
When the 32 kHz RC Oscillator is enabled,  
calibration is continuously done in the  
background as long as the 32 MHz crystal  
oscillator is running.  
5.7 16 MHz RC Oscillator  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 10: 16 MHz RC Oscillator parameters  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Frequency  
16  
MHz  
The calibrated 16 MHz RC Oscillator  
frequency is the 32 MHz XTAL frequency  
divided by 2  
Uncalibrated frequency  
accuracy  
%
%
±18  
Calibrated frequency  
accuracy  
±0.6  
±1  
Start-up time  
10  
µs  
Temperature coefficient  
-325  
Frequency drift when temperature changes  
after calibration  
ppm / °C  
ppm / mV  
µs  
Supply voltage coefficient  
Initial calibration time  
28  
Frequency drift when supply voltage changes  
after calibration  
50  
When the 16 MHz RC Oscillator is enabled it  
will be calibrated continuously when the  
32MHz crystal oscillator is running.  
CC2480 Data Sheet SWRS074A  
Page 11 of 43  
 
CC2480  
5.8 Frequency Synthesizer Characteristics  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 11: Frequency Synthesizer Parameters  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Phase noise  
Unmodulated carrier  
116  
117  
118  
dBc/Hz  
dBc/Hz  
dBc/Hz  
At ±1.5 MHz offset from carrier  
At ±3 MHz offset from carrier  
At ±5 MHz offset from carrier  
PLL lock time  
192  
The startup time until RX/TX turnaround. The crystal  
oscillator is running.  
µs  
5.9 Analog Temperature Sensor  
Measured on Texas Instruments CC2480 EM reference design with TA=25°C and VDD=3.0V  
unless stated otherwise.  
Table 12: Analog Temperature Sensor Parameters  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
0.648  
0.743  
0.840  
0.939  
2.45  
V
V
V
V
Value is estimated  
Value is estimated  
Value is estimated  
Value is estimated  
Output voltage at –40°C  
Output voltage at 0°C  
Output voltage at +40°C  
Output voltage at +80°C  
Temperature coefficient  
mV/°C Fitted from –20°C to +80°C on estimated values.  
Absolute error in calculated  
temperature  
–8  
°C  
°C  
From –20°C to +80°C when assuming best fit for  
absolute accuracy on estimated values: 0.743V at  
0°C and 2.45mV / °C.  
Error in calculated  
temperature, calibrated  
-2  
0
2
From –20°C to +80°C when using 2.45mV / °C,  
after 1-point calibration at room temperature.  
Values are estimated. Indicated min/max with 1-  
point calibration is based on simulated values for  
typical process parameters  
Current consumption  
280  
µA  
increase when enabled  
5.10 ADC  
Measured with TA=25°C and VDD=3.0V. Note that other data may result when using Texas  
Instruments’ CC2480 EM reference design.  
Table 13: ADC Characteristics  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Input voltage  
0
VDD  
V
VDD is voltage on AVDD_SOC pin  
Simulated using 4 MHz clock speed.  
Peak-to-peak, defines 0dBFS  
Input resistance, signal  
Full-Scale Signal3  
197  
kΩ  
V
2.97  
3 Measured with 300 Hz Sine input and VDD as reference.  
CC2480 Data Sheet SWRS074A  
Page 12 of 43  
 
 
 
CC2480  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
ENOB3  
5.7  
7.5  
bits  
7-bits setting.  
9-bits setting.  
10-bits setting.  
12-bits setting.  
7-bits setting.  
9-bits setting.  
10-bits setting.  
12-bits setting.  
7-bits setting  
Single ended input  
9.3  
10.8  
6.5  
ENOBError! Bookmark not defined.  
Differential input  
bits  
8.3  
10.0  
11.5  
0-20  
Useful Power Bandwidth  
THD3  
kHz  
-Single ended input  
-75.2  
-86.6  
dB  
dB  
12-bits setting, -6dBFS  
12-bits setting, -6dBFS  
-Differential input  
Signal To Non-Harmonic Ratio3  
-Single ended input  
-Differential input  
70.2  
79.3  
dB  
dB  
12-bits setting  
12-bits setting  
Spurious Free Dynamic Range3  
-Single ended input  
-Differential input  
78.8  
88.9  
<-84  
dB  
dB  
dB  
12-bits setting, -6dBFS  
12-bits setting, -6dBFS  
CMRR, differential input  
12- bit setting, 1 kHz Sine (0dBFS), limited by ADC  
resolution  
Crosstalk, single ended input  
<-84  
dB  
12- bit setting, 1 kHz Sine (0dBFS), limited by ADC  
resolution  
Offset  
-3  
mV  
%
Mid. Scale  
Gain error  
DNL3  
0.68  
0.05  
0.9  
LSB  
LSB  
LSB  
LSB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
µs  
12-bits setting, mean  
12-bits setting, max  
12-bits setting, mean  
12-bits setting, max  
7-bits setting.  
INL3  
4.6  
13.3  
35.4  
46.8  
57.5  
66.6  
40.7  
51.6  
61.8  
70.8  
20  
SINAD3  
Single ended input  
(-THD+N)  
9-bits setting.  
10-bits setting.  
12-bits setting.  
7-bits setting.  
SINADError! Bookmark not defined.  
Differential input  
(-THD+N)  
9-bits setting.  
10-bits setting.  
12-bits setting.  
7-bits setting.  
Conversion time  
36  
9-bits setting.  
µs  
68  
10-bits setting.  
12-bits setting.  
µs  
132  
1.2  
µs  
Power Consumption  
mA  
CC2480 Data Sheet SWRS074A  
Page 13 of 43  
CC2480  
5.11 Control AC Characteristics  
TA= -40°C to 85°C, VDD=2.0V to 3.6V if nothing else stated.  
Table 14: Control Inputs AC Characteristics  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
System clock,  
fSYSCLK  
16  
32  
MHz  
System clock is 32 MHz when crystal oscillator is used.  
System clock is 16 MHz when calibrated 16 MHz RC  
oscillator is used.  
t
SYSCLK= 1/ fSYSCLK  
RESET_N low  
width  
250  
ns  
ns  
See item 1, Figure 1. This is the shortest pulse that is  
guaranteed to be recognized as a complete reset pin  
request. Note that shorter pulses may be recognized but  
will not lead to complete reset of all modules within the  
chip.  
Interrupt pulse  
width  
tSYSCLK  
See item 2, Figure 1.This is the shortest pulse that is  
guaranteed to be recognized as an interrupt request. In  
PM2/3 the internal synchronizers are bypassed so this  
requirement does not apply in PM2/3.  
1
RESET_N  
GPIOx  
2
2
GPIOx  
Figure 1: Control Inputs AC Characteristics  
CC2480 Data Sheet SWRS074A  
Page 14 of 43  
 
 
CC2480  
5.12 SPI AC Characteristics  
TA= -40°C to 85°C, VDD=2.0V to 3.6V if nothing else stated.  
Table 15: SPI AC Characteristics  
Parameter  
Min  
Typ  
Max Unit  
Condition/Note  
SSN low to SCK  
SCK to SSN high  
SCK period  
SCK duty cycle  
SI setup  
2*tSYSCLK  
30  
See item 5 Figure 2  
See item 6 Figure 2  
See item 1 Figure 2  
ns  
ns  
100  
50%  
10  
10  
ns  
ns  
See item 2 Figure 2  
SI hold  
See item 3 Figure 2  
SCK to SO  
25  
ns  
See item 4 Figure 2, load = 10 pF  
Figure 2: SPI AC Characteristics  
5.13 Port Outputs AC Characteristics  
TA= 25°C, VDD=3.0V if nothing else stated.  
Table 16: Port Outputs AC Characteristics  
Parameter  
Min  
Typ  
Max  
Unit  
Condition/Note  
Load = 10 pF  
GPIO/USART output  
rise time  
(SC=0/SC=1)  
3.15/  
1.34  
ns  
Timing is with respect to 10% VDD and 90% VDD levels.  
Values are estimated  
Load = 10 pF  
fall time  
3.2/  
Timing is with respect to 90% VDD and 10% VDD.  
Values are estimated  
(SC=0/SC=1)  
1.44  
5.14 DC Characteristics  
The DC Characteristics of CC2480 are listed in Table 17 below.  
TA=25°C, VDD=3.0V if nothing else stated.  
Table 17: DC Characteristics  
CC2480 Data Sheet SWRS074A  
Page 15 of 43  
 
 
 
 
CC2480  
Digital Inputs/Outputs  
Min  
Typ  
Max  
Unit  
%
Condition  
Logic "0" input voltage  
30  
Of VDD supply (2.0 – 3.6 V)  
Of VDD supply (2.0 – 3.6 V)  
Input equals 0V  
Logic "1" input voltage  
70  
NA  
NA  
%
Logic "0" input current per pin  
Logic "1" input current  
12  
12  
70  
70  
nA  
nA  
nA  
nA  
kΩ  
Input equals VDD  
Total logic “0” input current all pins  
Total logic “1” input current all pins  
I/O pin pull-up and pull-down  
resistor  
20  
CC2480 Data Sheet SWRS074A  
Page 16 of 43  
CC2480  
6
Pin and I/O Port Configuration  
The CC2480 pinout is shown in Figure 3 with details in Table 18.  
Figure 3: Pinout top view  
Note: The exposed die attach pad must be connected to a solid ground plane as this is the  
ground connection for the chip.  
CC2480 Data Sheet SWRS074A  
Page 17 of 43  
 
 
CC2480  
Table 18: Pinout overview  
Pin Pin name  
Pin type  
Ground  
Description  
-
GND  
The exposed die attach pad must be connected to a solid ground plane  
1
NC  
N/A  
2
NC  
N/A  
3
GPIO3  
GPIO2  
SRDY  
Digital I/O  
Digital I/O  
Digital Output  
Digital Input  
General I/O pin 3  
4
General I/O pin 2  
5
Slave ready. Mandatory for SPI, optional for UART.  
Master ready. Optional for SPI and UART.  
6
MRDY  
DVDD  
7
Power (Digital) 2.0V-3.6V digital power supply for digital I/O  
8
GPIO1  
GPIO0  
RESET_N  
CFG0  
Digital I/O  
General I/O pin 1 – increased drive capability  
General I/Opin 0 – increased drive capability  
Reset, active low  
9
Digital I/O  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Digital input  
Digital Input  
Digital Input  
Digital Input  
Digital Output  
Digital I/O  
Configuration input 0  
CFG1  
Configuration input 1  
SO/RX  
SI/TX  
SPI slave output or UART RX data  
SPI slave input or UART TX data  
SPI slave select (in) or UART CTS (out)  
SPI clock or UART RTS  
SS/CT  
C/RT  
Digital Input  
Analog Input  
Analog Input  
Analog I/O  
A0  
ADC input A0  
A1  
ADC input A1  
XOSC_Q2  
AVDD_SOC  
XOSC_Q1  
RBIAS1  
AVDD_RREG  
RREG_OUT  
32 MHz crystal oscillator pin 2  
Power (Analog) 2.0V-3.6V analog power supply connection  
Analog I/O  
Analog I/O  
32 MHz crystal oscillator pin 1, or external clock input  
External precision bias resistor for reference current  
Power (Analog) 2.0V-3.6V analog power supply connection  
Power output 1.8V Voltage regulator power supply output. Only intended for supplying the analog  
1.8V part (power supply for pins 25, 27-31, 35-40).  
25  
AVDD_IF1  
Power (Analog) 1.8V Power supply for the receiver band pass filter, analog test module, global bias  
and first part of the VGA  
26  
27  
28  
29  
30  
31  
32  
RBIAS2  
Analog output  
External precision resistor, 43 k, ±1 %  
AVDD_CHP  
VCO_GUARD  
AVDD_VCO  
AVDD_PRE  
AVDD_RF1  
RF_P  
Power (Analog) 1.8V Power supply for phase detector, charge pump and first part of loop filter  
Power (Analog) Connection of guard ring for VCO (to AVDD) shielding  
Power (Analog) 1.8V Power supply for VCO and last part of PLL loop filter  
Power (Analog) 1.8V Power supply for Prescaler, Div-2 and LO buffers  
Power (Analog) 1.8V Power supply for LNA, front-end bias and PA  
RF I/O  
Positive RF input signal to LNA during RX. Positive RF output signal from PA during  
TX  
33  
34  
TXRX_SWITCH  
RF_N  
Power (Analog) Regulated supply voltage for PA  
RF I/O  
Negative RF input signal to LNA during RX  
Negative RF output signal from PA during TX  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
AVDD_SW  
AVDD_RF2  
AVDD_IF2  
AVDD_ADC  
DVDD_ADC  
Power (Analog) 1.8V Power supply for LNA / PA switch  
Power (Analog) 1.8V Power supply for receive and transmit mixers  
Power (Analog) 1.8V Power supply for transmit low pass filter and last stages of VGA  
Power (Analog) 1.8V Power supply for analog parts of ADCs and DACs  
Power (Digital) 1.8V Power supply for digital parts of ADCs  
AVDD_DGUARD Power (Digital) Power supply connection for digital noise isolation  
AVDD_DREG  
DCOUPL  
32K_XOSC_Q2  
32K_XOSC_Q1  
NC  
Power (Digital) 2.0V-3.6V digital power supply for digital core voltage regulator  
Power (Digital) 1.8V digital power supply decoupling. Do not use for supplying external circuits.  
Analog I/O  
Analog I/O  
N/A  
32.768 kHz XOSC  
32.768 kHz XOSC  
NC  
N/A  
DVDD  
Power (Digital) 2.0V-3.6V digital power supply for digital I/O  
N/A  
NC  
CC2480 Data Sheet SWRS074A  
Page 18 of 43  
CC2480  
7
Circuit Description  
DIGITAL  
ANALOG  
MIXED  
VDD (2.0 - 3.6 V)  
DCOUPL  
ON-CHIP VOLTAGE  
REGULATOR  
32K_XOSC_Q2  
32 MHz  
CRYSTAL OSC  
HIGH SPEED  
RC-OSC  
POWER ON RESET  
BROWN OUT  
32K_XOSC_Q1  
XOSC_Q2  
XOSC_Q1  
32.768 kHz  
CRYSTAL OSC  
32 kHz RC-OSC  
SLEEP TIMER  
CLOCK MUX &  
CALIBRATION  
RESET_N  
RESET  
SLEEP MODE CONTROLLER  
128 KB  
GPIO3  
GPIO2  
GPIO1  
GPIO0  
FLASH  
GP  
8051 CPU  
CORE  
MEMORY  
DMA  
I/O  
ARBITRATOR  
8 KB  
SRAM  
IRQ  
CTRL  
FLASH  
WRITE  
AES  
ENCRYPTION  
&
∆Σ ADC  
AUDIO / DC  
2 CHANNELS  
A1  
A0  
DEMODULATOR  
AGC  
MODULATOR  
DECRYPTION  
SRDY  
MRDY  
SI/TX  
USART  
RECEIVE  
CHAIN  
TRANSMIT  
CHAIN  
SO/RX  
SS/CT  
C/RT  
RF_P  
RF_N  
Figure 4: CC2480 Block Diagram  
A block diagram of CC2480 is shown in Figure  
4. The modules can be roughly divided into  
one of three categories: CPU-related modules,  
modules related to power and clock  
distribution, and radio-related modules. CC2480  
features an IEEE 802.15.4 compliant radio  
based on the leading CC2420 transceiver. See  
Section 10 for details.  
CC2480 Data Sheet SWRS074A  
Page 19 of 43  
 
 
CC2480  
8
Application Circuit  
Few external components are required for the  
operation of CC2480. A typical application  
circuit is shown in Figure 5. Typical values and  
description of external components are shown  
in Table 19.  
8.1 Input / output matching  
The RF input/output is high impedance and  
differential. The optimum differential load for  
the RF port is 60 + j164 4.  
LNA (RX) and the PA (TX). See Input/output  
matching section on page 33 for more details.  
If a balanced antenna such as a folded dipole  
is used, the balun can be omitted. If the  
antenna also provides a DC path from  
TXRX_SWITCH pin to the RF pins, inductors  
are not needed for DC bias.  
When using an unbalanced antenna such as a  
monopole, a balun should be used in order to  
optimize performance. The balun can be  
implemented using low-cost discrete inductors  
and capacitors. The recommended balun  
shown, consists of C341, L341, L321 and  
Figure 5 shows a suggested application circuit  
using a differential antenna. The antenna type  
is a standard folded dipole. The dipole has a  
virtual ground point; hence bias is provided  
without degradation in antenna performance.  
L331 together with  
a
PCB microstrip  
transmission line (λ/2-dipole), and will match  
the RF input/output to 50 . An internal T/R  
switch circuit is used to switch between the  
Also  
refer  
to  
the  
section  
Antenna  
Considerations on page 35.  
4 This is for 2440MHz.  
8.2 Bias resistors  
The bias resistors are R221 and R261. The  
bias resistor R221 is used to set an accurate  
bias current for the 32 MHz crystal oscillator.  
8.3 Crystal  
An external 32 MHz crystal, XTAL1, with two  
loading capacitors (C191 and C211) is used  
for the 32 MHz crystal oscillator. See page 10  
for details. The load capacitance seen by the  
32 MHz crystal is given by:  
sleep current consumption and accurate wake  
up times. The load capacitance seen by the  
32.768 kHz crystal is given by:  
1
CL =  
+ Cparasitic  
1
1
1
+
CL =  
+ Cparasitic  
C441 C431  
1
1
+
C191 C211  
A series resistor may be used to comply with  
the ESR requirement.  
XTAL2 is an optional 32.768 kHz crystal, with  
two loading capacitors (C441 and C431), used  
for the 32.768 kHz crystal oscillator. The  
32.768 kHz crystal oscillator is used in  
applications where you need both very low  
8.4 Voltage regulators  
The on chip voltage regulators supply all 1.8 V  
power supply pins and internal power supplies.  
C241 and C421 are required for stability of the  
regulators.  
CC2480 Data Sheet SWRS074A  
Page 20 of 43  
 
 
 
CC2480  
8.5 Power supply decoupling and filtering  
Proper power supply decoupling must be used  
for optimum performance. The placement and  
size of the decoupling capacitors and the  
power supply filtering are very important to  
achieve the best performance in an  
application. TI provides a compact reference  
design that should be followed very closely.  
Refer  
to  
the  
section  
PCB  
Layout  
Recommendation on page 35.  
Figure 5:  
CC2480  
Applicatio  
n Circuit.  
(Digital I/O  
and ADC  
interface  
not  
C431  
C441  
C421  
2.0 - 3.6V Power Supply  
XTAL2  
optional  
connected  
).  
Decouplin  
g
capacitors  
not shown.  
Antenna  
(50 Ohm)  
1
2
3
4
5
6
7
8
9
36  
NC  
AVDD_RF2  
35  
NC  
AVDD_SW  
34  
GPIO3  
GPIO2  
SRDY  
MRDY  
DVDD  
GPIO1  
GPIO0  
C341  
L341  
RF_N  
L321  
33  
TXRX_SWITCH  
32  
RF_P  
L331  
CC2480  
31  
30  
29  
28  
27  
26  
AVDD_RF1  
AVDD_PRE  
AVDD_VCO  
VCO_GUARD  
AVDD_CHP  
RBIAS2  
λ/4  
λ/4  
10 RESET_N  
or  
R261  
11  
12  
CFG0  
CFG1  
AVDD_IF1 25  
L331  
L321  
XTAL1  
R221  
C241  
C191  
C211  
CC2480 Data Sheet SWRS074A  
Page 21 of 43  
 
 
CC2480  
Table 19: Overview of external components (excluding supply decoupling capacitors)  
Component  
C191  
Description  
Differential Antenna  
Single Ended 50Output  
33 pF, 5%, NP0, 0402  
27 pF, 5%, NP0, 0402  
220 nF, 10%, 0402  
32 MHz crystal load capacitor  
32 MHz crystal load capacitor  
33 pF, 5%, NP0, 0402  
27 pF, 5%, NP0, 0402  
220 nF, 10%, 0402  
C211  
C241  
Load capacitance for analogue power  
supply voltage regulators  
C421  
C341  
Load capacitance for digital power supply  
voltage regulators  
1 µF, 10%, 0402  
1 µF, 10%, 0402  
DC block to antenna and match  
5.6 pF, 5%, NP0, 0402  
Not used  
Note: For RF connector a LP filter can be  
connected between this C, the antenna  
and good ground in order to remove  
conducted spurious emission by using  
1.8pF in parallel with 1.6nH  
1.8 pF, Murata COG 0402,  
GRM15  
1.6 nH, Murata 0402,  
LQG15HS1N6S02  
C431, C441  
L321  
32.768 kHz crystal load capacitor (if low-  
frequency crystal is needed in application)  
15 pF, 5%, NP0, 0402  
15 pF, 5%, NP0, 0402  
Discrete balun and match  
Discrete balun and match  
Discrete balun and match  
6.8 nH, 5%,  
Monolithic/multilayer, 0402  
12 nH 5%,  
Monolithic/multilayer, 0402  
L331  
22 nH, 5%,  
Monolithic/multilayer, 0402  
27 nH, 5%,  
Monolithic/multilayer, 0402  
L341  
1.8 nH, +/-0.3 nH,  
Not used  
Monolithic/multilayer, 0402  
R221  
Precision resistor for current reference  
generator to system-on-chip part  
56 k, 1%, 0402  
56 k, 1%, 0402  
43 k, 1%, 0402  
R261  
Precision resistor for current reference  
generator to RF part  
43 k, 1%, 0402  
XTAL1  
XTAL2  
32 MHz Crystal  
32 MHz crystal,  
ESR < 60 Ω  
32 MHz crystal,  
ESR < 60 Ω  
Optional 32.768 kHz watch crystal (if low-  
frequency crystal is needed in application) Epson MC 306.  
32.768 kHz crystal,  
32.768 kHz crystal,  
Epson MC 306.  
CC2480 Data Sheet SWRS074A  
Page 22 of 43  
 
CC2480  
9
Peripherals  
In the following sub-sections the user-  
accessible CC2480 peripheral modules are  
described  
in  
detail.  
9.1 Reset  
The initial conditions after a reset are as  
follows:  
The CC2480 has four reset sources. The  
following events generate a reset:  
I/O pins are configured as inputs with pull-  
up  
See the CC2480 Interface Specification [2]  
for a description of the interaction between  
CC2480 and the host processor after  
reset.  
Forcing RESET_N input pin low  
A power-on reset condition  
A brown-out reset condition  
A
firmware-generated  
reset  
(SYS_RESET_REQ [2])  
9.1.1  
Power On Reset and Brown Out Detector  
state until the supply voltage reaches above  
the Power On Reset and Brown Out voltages.  
The CC2480 includes a Power On Reset (POR)  
providing correct initialization during device  
power-on. Also includes is a Brown Out  
Detector (BOD) operating on the regulated  
1.8V digital power supply only, The BOD will  
protect the memory contents during supply  
voltage variations which cause the regulated  
1.8V power to drop below the minimum level  
required by flash memory and SRAM.  
Figure 6 shows the POR/BOD operation with  
the 1.8V (typical) regulated supply voltage  
together with the active low reset signals  
BOD_RESET and POR_RESET shown in the  
bottom of the figure (note that signals are not  
available, just for illustration of events).  
When power is initially applied to the CC2480  
the Power On Reset (POR) and Brown Out  
Detector (BOD) will hold the device in reset  
1.8V REGULATED  
UNREGULATED  
VOLT  
BOD RESET ASSERT  
POR RESET DEASSERT RISING VDD  
POR RESET ASSERT FALLING VDD  
0
POR OUTPUT  
X
X
X
BOD RESET  
POR RESET  
X
X
X
Figure 6 : Power On Reset and Brown Out Detector Operation  
9.2 I/O ports  
The CC2480 has digital input/output pins that  
have the following key features:  
General purpose I/O or peripheral I/O  
Pull-up or pull-down capability on inputs  
External interrupt capability  
Two of the I/O pins have external interrupts  
that can be used to wake up the device from  
sleep modes.  
CC2480 Data Sheet SWRS074  
Page 23 of 43  
 
 
CC2480  
9.2.1  
Unused I/O pins  
Unused I/O pins should have a defined level  
and not be left floating. One way to do this is to  
leave the pin unconnected and configured with  
pull-up resistor. This is also the state of all pins  
after reset.  
9.2.2  
Low I/O Supply Voltage  
In applications where the digital I/O power  
supply voltage pin DVDD is below 2.6 V, the  
SC bit should be set to 1 in order to obtain  
output DC characteristics specified in section  
5.14. See the CC2480 user guide [2] for a  
description of how to do this.  
9.2.3  
General Purpose I/O  
up, pull-down or tri-state mode of operation. By  
default, after a reset, inputs are configured as  
inputs with pull-up. Please note that GPIO0  
and GPIO1 do not have pull-up or pull-down  
capabilities.  
See the CC2480 user guide [2] for a description  
of how to configure and use the GPIO pins.  
The output drive strength is 4 mA on all  
outputs, except for the two high-drive outputs,  
GPIO0 and GPIO1, which each have ~20 mA  
output drive strength.  
In power modes PM2 and PM3 the I/O pins  
retain the I/O mode and output value (if  
applicable) that was set when PM2/3 was  
entered  
When used as an input, the general purpose  
I/O port pins can be configured to have a pull-  
CC2480 Data Sheet SWRS074  
Page 24 of 43  
CC2480  
9.3 ADC  
9.3.1  
ADC Introduction  
The ADC supports up to 12-bit analog-to-  
digital conversion. The ADC includes an  
analog multiplexer with up to two individually  
configurable channels and reference voltage  
generator.  
Selectable decimation rates which also  
sets the resolution (7 to 12 bits).  
Two individual input channels, single-  
ended or differential  
Internal voltage reference  
Temperature sensor input  
The main features of the ADC are as follows:  
Battery measurement capability  
A1  
A0  
Sigma-delta  
modulator  
Decimation  
filter  
input  
mux  
VDD/3  
TMP_SENSOR  
Int 1.25V  
Clock generation and  
control  
Figure 7: ADC block diagram.  
9.3.2  
ADC Operation  
This section describes the general setup and  
operation of the ADC.  
9.3.2.1  
ADC Core  
The ADC includes an ADC capable of  
converting an analog input into a digital  
representation with up to 12 bits resolution.  
The ADC uses a selectable positive reference  
voltage.  
9.3.2.2  
ADC Inputs  
The signals from input pins A0 and A1 are  
used as single-ended ADC inputs. The ADC  
selected as an input to the ADC for  
temperature measurements.  
automatically performs  
conversions when the SYS_ADC_READ  
command is issued.  
a
sequence of  
It is also possible to select a voltage  
corresponding to AVDD_SOC/3 as an ADC  
input. This input allows the implementation of  
e.g. a battery monitor in applications where  
In addition to the input pins A0-1, the output of  
an on-chip temperature sensor can be  
this  
feature  
is  
required.  
9.3.2.3  
ADC conversion sequences  
In the case where differential inputs are  
selected, the differential inputs consist of the  
input pair A0-1. Note that no negative supply  
can be applied to these pins, nor a supply  
larger than VDD (unregulated power). It is the  
difference between the pairs that are  
converted in differential mode.  
The CC2480 has two ADC channels that are  
connected to external pins. Additionally, the  
ADC can measure the chip voltage and  
temperature.  
The ADC conversions are done channel by  
channel incrementally.  
The two external pin inputs A0 and A1 can be  
used as single-ended or differential inputs.  
CC2480 Data Sheet SWRS074  
Page 25 of 43  
 
CC2480  
In addition to the input pins A0-1, the output of  
an on-chip temperature sensor can be  
selected as an input to the ADC for  
temperature measurements.  
It is also possible to select a voltage  
corresponding to AVDD_SOC/3 as an ADC  
input. This input allows the implementation of  
e.g. a battery monitor in applications where  
this feature is required.  
9.3.2.4  
ADC Operating Modes  
This section describes the operating modes  
and initialization of conversions.  
The decimation rate (and thereby also the  
resolution and time required to complete a  
conversion and sample rate) is configurable  
from 7-12 bits.  
The ADC uses an internal voltage reference  
for single-ended conversions.  
9.3.2.5  
ADC Conversion Results  
The digital conversion result is represented in  
two's complement form. The result is always  
positive. This is because the result is the  
difference between ground and input signal  
For differential configurations the difference  
between the pins is converted and this  
difference can be negatively signed. For 12-bit  
resolution the digital conversion result is 2047  
when the analog input, Vconv, is equal to  
VREF, and the conversion result is -2048  
when the analog input is equal to –VREF.  
which  
is  
always  
posivitely  
signed  
(Vconv=Vinp-Vinn, where Vinn=0V). The  
maximum value is reached when the input  
amplitude is equal VREF, the internal voltage  
reference.  
9.3.2.6  
ADC Reference Voltage  
The positive reference voltage for analog-to-  
digital conversions is an internally generated  
1.25V voltage.  
9.3.2.7  
ADC Conversion Timing  
The ADC is run on the 32MHz system clock,  
which is divided by 8 to give a 4 MHz clock.  
multiplexer is allowed 16 4 MHz clock cycles to  
settle in case the channel has been changed  
since the previous conversion. The 16 clock  
cycles settling time applies to all decimation  
rates. Thus in general, the conversion time is  
given by:  
The time required to perform a conversion  
depends on the selected decimation rate.  
When the decimation rate is set to for instance  
128, the decimation filter uses exactly 128 of  
the 4 MHz clock periods to calculate the result.  
When a conversion is started, the input  
Tconv = (decimation rate + 16) x 0.25 µs.  
CC2480 Data Sheet SWRS074  
Page 26 of 43  
CC2480  
9.4 Random Number Generator  
9.4.1 Introduction  
The random number generator has the  
following features.  
The random number generator is a 16-bit  
Linear Feedback Shift Register (LFSR) with  
polynomial X 16 + X 15 + X 2 +1 (i.e. CRC16).  
It uses different levels of unrolling depending  
on the operation it performs. The basic version  
(no unrolling) is shown in Figure 8.  
Generate pseudo-random bytes which can  
be read by the external microprocessor.  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
0
+
+
in_bit  
+
Figure 8: Basic structure of the Random Number Generator  
9.4.2  
Semi random sequence generation  
The operation is to clock the LFSR once (13x  
unrolling) each time the external  
microprocessor reads the random value. This  
leads to the availability of a fresh pseudo-  
random byte from the LSB end of the LFSR.  
CC2480 Data Sheet SWRS074  
Page 27 of 43  
 
 
CC2480  
9.5 USART  
The USART is a serial communications  
interface that can be operated in either  
asynchronous UART mode or in synchronous  
SPI mode.  
9.5.1  
UART mode  
For asynchronous serial interfaces, the UART  
mode is provided. In the UART mode the  
interface uses a two-wire or four-wire interface  
consisting of the pins RXD, TXD and optionally  
RTS and CTS. The UART mode of operation  
is as follows:  
8N1 byte format.  
DCE signal connection.  
The UART mode provides full duplex  
asynchronous transfers, and the  
synchronization of bits in the receiver does not  
interfere with the transmit function. A UART  
byte transfer consists of a start bit, eight data  
bits, a parity bit, and one stop bit.  
Baud rate: 115200.  
Hardware (RTS/CTS) flow control.  
9.5.2  
SPI Mode  
This section describes the SPI mode of  
operation for synchronous communication. In  
SPI mode, the USART communicates with an  
external system through a 3-wire or 4-wire  
interface. The interface consists of the pins SI,  
SO, SCK and SS_N. The SPI mode is as  
follows:  
SPI slave.  
Clock speed up to 4 MHz.  
Clock polarity 0 and clock phase 0 on  
CC2480 .  
Bit order: MSB first.  
9.5.2.1  
SPI Slave Operation  
An SPI byte transfer in slave mode is  
controlled by the external system. The data on  
the SI input is shifted into the receive register  
controlled by the serial clock SCK which is an  
input in slave mode. At the same time the byte  
in the transmit register is shifted out onto the  
SO output.  
9.5.3  
SSN Slave Select Pin  
When the USART is operating in SPI mode,  
configured as an SPI slave, a 4-wire interface  
is used with the Slave Select (SSN) pin as an  
input to the SPI (edge controlled). At falling  
edge of SSN the SPI slave is active and  
receives data on the SI input and outputs data  
on the SO output. At rising edge of SSN, the  
SPI slave is inactive and will not receive data.  
Note that the SO output is not tri-stated after  
rising edge on SSn. This could be achieved  
using an external buffer. Also note that release  
of SSn (rising edge) must be aligned to end of  
byte recived or sent. If released in a byte the  
next received byte will not be received  
properly as information about previous byte is  
present in SPI system.  
CC2480 Data Sheet SWRS074  
Page 28 of 43  
 
CC2480  
10 Radio  
AUTOMATIC GAIN CONTROL  
DIGITAL  
DEMODULATOR  
RADIO  
ADC  
Register bus  
REGISTER  
BANK  
- Digital RSSI  
- Gain Control  
- Image Suppression  
- Channel Filtering  
- Demodulation  
- Frame  
LNA  
FFCTRL  
ADC  
synchronization  
CSMA/CA  
STROBE  
TXRX SWITCH  
PROCESSOR  
0
FREQ  
SYNTH  
SFR bus  
90  
TX POWER CONTROL  
IRQ  
HANDLING  
DAC  
DIGITAL  
MODULATOR  
Power  
Control  
- Data spreading  
- Modulation  
PA  
Σ
DAC  
Figure 9: CC2480 Radio Module  
A simplified block diagram of the IEEE  
802.15.4 compliant radio inside CC2480 is  
shown in Figure 9. The radio core is based on  
the industry leading CC2420 RF transceiver.  
The RF signal is amplified in the power  
amplifier (PA) and fed to the antenna.  
The internal T/R switch circuitry makes the  
antenna interface and matching easy. The RF  
connection is differential. A balun may be used  
for single-ended antennas. The biasing of the  
PA and LNA is done by connecting  
TXRX_SWITCH to RF_P and RF_N through an  
external DC path.  
CC2480 features  
a
low-IF receiver. The  
received RF signal is amplified by the low-  
noise amplifier (LNA) and down-converted in  
quadrature (I and Q) to the intermediate  
frequency (IF). At IF (2 MHz), the complex I/Q  
signal is filtered and amplified, and then  
digitized by the RF receiver ADCs.  
The frequency synthesizer includes  
a
completely on-chip LC VCO and a 90 degrees  
phase splitter for generating the I and Q LO  
signals to the down-conversion mixers in  
receive mode and up-conversion mixers in  
transmit mode. The VCO operates in the  
frequency range 4800 – 4966 MHz, and the  
frequency is divided by two when split into I  
and Q signals.  
The CC2480 transmitter is based on direct up-  
conversion. The preamble and start of frame  
delimiter are generated in hardware. Each  
symbol (4 bits) is spread using the IEEE  
802.15.4 spreading sequence to 32 chips and  
output to the digital-to-analog converters  
(DACs).  
An on-chip voltage regulator delivers the  
regulated 1.8 V supply voltage.  
An analog low pass filter passes the signal to  
the quadrature (I and Q) up-conversion mixers.  
CC2480 Data Sheet SWRS074  
Page 29 of 43  
 
 
CC2480  
10.1 IEEE 802.15.4 Modulation Format  
This section is meant as an introduction to the  
2.4 GHz direct sequence spread spectrum  
(DSSS) RF modulation format defined in IEEE  
802.15.4. For a complete description, please  
refer to [1].  
For multi-byte fields, the least significant byte  
is transmitted first.  
Each symbol is mapped to one out of 16  
pseudo-random sequences, 32 chips each.  
The symbol to chip mapping is shown in Table  
20. The chip sequence is then transmitted at 2  
MChips/s, with the least significant chip (C0)  
transmitted first for each symbol.  
The modulation and spreading functions are  
illustrated at block level in Figure 10 [1]. Each  
byte is divided into two symbols, 4 bits each.  
The least significant symbol is transmitted first.  
Transmitted  
bit-stream  
(LSB first)  
Bit-to-  
Symbol  
Symbol-  
to-Chip  
O-QPSK  
Modulator  
Modulated  
Signal  
Figure 10: Modulation and spreading functions [1]  
The modulation format is Offset – Quadrature  
Phase Shift Keying (O-QPSK) with half-sine  
chip shaping. This is equivalent to MSK  
modulation. Each chip is shaped as a half-  
sine, transmitted alternately in the I and Q  
channels with one half chip period offset. This  
is illustrated for the zero-symbol in Figure 11.  
Table 20: IEEE 802.15.4 symbol-to-chip mapping [1]  
Symbol Chip sequence (C0, C1, C2, … , C31)  
1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0  
1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0  
0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0  
0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1  
0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1  
0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1 1 1 0 0  
1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1 1 0 0 1  
1 0 0 1 1 1 0 0 0 0 1 1 0 1 0 1 0 0 1 0 0 0 1 0 1 1 1 0 1 1 0 1  
1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1  
1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1  
0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1  
0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0  
0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1 0 1 1 0  
0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0 1 0 0 1  
1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0 1 1 0 0  
1 1 0 0 1 0 0 1 0 1 1 0 0 0 0 0 0 1 1 1 0 1 1 1 1 0 1 1 1 0 0 0  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
CC2480 Data Sheet SWRS074  
Page 30 of 43  
 
 
 
CC2480  
TC  
1
0
1
1
0
1
0
1
0
1
0
0
0
0
1
1
I-phase  
Q-phase  
1
1
0
1
1
0
0
1
1
1
0
0
0
0
1
0
2TC  
Figure 11: I / Q Phases when transmitting a zero-symbol chip sequence, TC = 0.5 µs  
10.2 Demodulator, Symbol Synchronizer and Data Decision  
Soft decision is used at the chip level, i.e. the  
demodulator does not make a decision for  
each chip, only for each received symbol. De-  
spreading is performed using over-sampling  
symbol correlators. Symbol synchronization is  
achieved by a continuous start of frame  
delimiter (SFD) search.  
The block diagram for the CC2480 demodulator  
is shown in Figure 12. Channel filtering and  
frequency offset compensation is performed  
digitally. The signal level in the channel is  
estimated to generate the RSSI level. Data  
filtering is also included for enhanced  
performance.  
With the ±40 ppm frequency accuracy  
requirement from [1], a compliant receiver  
must be able to compensate for up to 80 ppm  
or 200 kHz. The CC2480 demodulator tolerates  
up to 300 kHz offset without significant  
degradation of the receiver performance.  
The CC2480 demodulator also handles symbol  
rate errors in excess of 120 ppm without  
performance degradation. Resynchronization  
is performed continuously to adjust for error in  
the incoming symbol rate.  
Digital  
IF Channel  
Filtering  
Frequency  
Offset  
Compensation  
Digital  
Data  
Filtering  
Symbol  
Correlators and  
Synchronisation  
Data  
Symbol  
Output  
I / Q Analog  
IF signal  
ADC  
Average  
Correlation  
Value (may be  
used for LQI)  
RSSI  
Generator  
RSSI  
Figure 12: Demodulator Simplified Block Diagram  
10.3 Frame Format  
Figure 13 [1] shows a schematic view of the  
IEEE 802.15.4 frame format. Similar figures  
describing specific frame formats (data  
frames, beacon frames, acknowledgment  
frames and MAC command frames) are  
included in [1].  
CC2480 has hardware support for parts of the  
IEEE 802.15.4 frame format. This section  
gives a brief summary to the IEEE 802.15.4  
frame format, and describes how CC2480 is  
set up to comply with this.  
CC2480 Data Sheet SWRS074  
Page 31 of 43  
 
 
CC2480  
Bytes:  
2
1
Data  
Sequence  
Number  
0 to 20  
n
2
Frame  
Frame Check  
Sequence  
(FCS)  
MAC Footer  
(MFR)  
MAC  
Layer  
Address  
Information  
Control Field  
(FCF)  
Frame payload  
MAC Payload  
MAC Header (MHR)  
Bytes:  
4
1
1
5 + (0 to 20) + n  
Start of frame  
Delimiter  
(SFD)  
MAC Protocol  
Data Unit  
(MPDU)  
PHY  
Layer  
Preamble  
Sequence  
Frame  
Length  
Synchronisation Header  
PHY Header  
(PHR)  
PHY Service Data Unit  
(SHR)  
(PSDU)  
11 + (0 to 20) + n  
PHY Protocol Data Unit  
(PPDU)  
Figure 13: Schematic view of the IEEE 802.15.4 Frame Format [1]  
10.4 Synchronization header  
The synchronization header (SHR) consists of  
the preamble sequence followed by the start of  
frame delimiter (SFD). In [1], the preamble  
sequence is defined to be four bytes of 0x00.  
The SFD is one byte, set to 0xA7.  
A
synchronization  
header  
is  
always  
transmitted first in all transmit modes.  
In receive mode CC2480 uses the preamble  
sequence for symbol synchronization and  
frequency offset adjustments. The SFD is  
used  
for  
byte  
synchronization.  
10.5 MAC protocol data unit  
The FCF, data sequence number and address  
information follows the length field as shown in  
Figure 13. Together with the MAC data  
payload and Frame Check Sequence, they  
form the MAC Protocol Data Unit (MPDU).  
The format of the FCF is shown in Figure 14.  
Please refer to [1] for details.  
Bits: 0-2  
3
4
5
6
7-9  
10-11  
12-13  
14-15  
Frame  
Type  
Security  
Enabled  
Frame  
Pending  
Acknowledge  
request  
Intra  
PAN  
Reserved  
Destination  
addressing  
mode  
Reserved  
Source  
addressing  
mode  
Figure 14: Format of the Frame Control Field (FCF) [1]  
10.6 Frame check sequence  
A 2-byte frame check sequence (FCS) follows  
the last MAC payload byte as shown in Figure  
13. The FCS is calculated over the MPDU, i.e.  
the length field is not part of the FCS.  
The CC2480 hardware implementation is  
shown in Figure 15. Please refer to [1] for  
further details.  
In transmit mode the FCS is appended at the  
correct position defined by the length field.  
The FCS polynomial is [1]:  
x16 + x12 + x5 + 1  
The most significant bit in the last byte of each  
frame is set high if the CRC of the received  
frame is correct and low otherwise.  
Data  
input  
(LSB  
first)  
r0  
r1  
r2  
r3  
r4  
r5  
r6  
r7  
r8  
r9  
r10  
r11 r12 r13 r14 r15  
Figure 15: CC2480 Frame Check Sequence (FCS) hardware implementation [1]  
CC2480 Data Sheet SWRS074  
Page 32 of 43  
 
 
 
 
CC2480  
10.7 Linear IF and AGC Settings  
The AGC (Automatic Gain Control) loop  
ensures that the ADC operates inside its  
dynamic range by using an analog/digital  
feedback loop.  
CC2480 is based on a linear IF chain where the  
signal amplification is done in an analog VGA  
(variable gain amplifier). The gain of the VGA  
is digitally controlled.  
10.8 Clear Channel Assessment  
The clear channel assessment signal is based  
CSMA-CA functionality specified in [1]. CCA is  
valid when the receiver has been enabled for  
at least 8 symbol periods.  
on the measured RSSI value and  
a
programmable threshold. The clear channel  
assessment function is used to implement the  
10.9 VCO and PLL Self-Calibration  
10.9.1  
VCO  
The VCO is completely integrated and  
operates at 4800 – 4966 MHz. The VCO  
frequencies in the desired band (2400-2483.5  
MHz).  
frequency is divided by  
2
to generate  
10.9.2 PLL self-calibration  
The VCO's characteristics will vary with  
temperature, changes in supply voltages, and  
the desired operating frequency.  
In order to ensure reliable operation the VCO’s  
bias current and tuning range are  
automatically calibrated every time the RX  
mode or TX mode is enabled.  
10.10 Input / Output Matching  
The RF output and DC bias can be done using  
different topologies. Some are shown in Figure  
5 on page 21.  
The RF input / output is differential (RF_Nand  
RF_P). In addition there is supply switch output  
pin (TXRX_SWITCH) that must have an  
external DC path to RF_Nand RF_P.  
Component values are given in Table 19 on  
page 22. If  
implemented, no balun is required.  
a
differential antenna is  
In RX mode the TXRX_SWITCH pin is at  
ground and will bias the LNA. In TX mode the  
TXRX_SWITCHpin is at supply rail voltage and  
will properly bias the internal PA.  
If a single ended output is required (for a  
single ended connector or a single ended  
antenna), a balun should be used for optimum  
performance.  
CC2480 Data Sheet SWRS074  
Page 33 of 43  
 
CC2480  
10.11 System Considerations and Guidelines  
10.11.1 SRD regulations  
International regulations and national laws  
regulate the use of radio receivers and  
transmitters. SRDs (Short Range Devices) for  
license free operation are allowed to operate  
in the 2.4 GHz band worldwide. The most  
important regulations are ETSI EN 300 328  
and EN 300 440 (Europe), FCC CFR-47 part  
15.247 and 15.249 (USA), and ARIB STD-T66  
(Japan).  
10.11.2 Frequency hopping and multi-channel systems  
The 2.4 GHz band is shared by many systems  
both in industrial, office and home  
environments. CC2480 uses direct sequence  
spread spectrum (DSSS) as defined by [1] to  
spread the output power, thereby making the  
communication link more robust even in a  
noisy environment.  
10.11.3 Crystal accuracy and drift  
A crystal accuracy of ±40 ppm is required for  
compliance with IEEE 802.15.4 [1]. This  
accuracy must also take ageing and  
temperature drift into consideration.  
total frequency offset between the transmitter  
and receiver. This could e.g. relax the  
accuracy requirement to 60 ppm for each of  
the devices.  
A crystal with low temperature drift and low  
aging could be used without further  
compensation. A trimmer capacitor in the  
crystal oscillator circuit (in parallel with C191 in  
Figure 5) could be used to set the initial  
frequency accurately.  
Optionally in a star network topology, the full-  
function device (FFD) could be equipped with  
a more accurate crystal thereby relaxing the  
requirement on the reduced-function device  
(RFD). This can make sense in systems where  
the reduced-function devices ship in higher  
volumes than the full-function devices.  
For non-IEEE 802.15.4 systems, the robust  
demodulator in CC2480 allows up to 140 ppm  
10.11.4 Communication robustness  
highly important parameters for reliable  
operation in the 2.4 GHz band, since an  
increasing number of devices/systems are  
using this license free frequency band.  
CC2480 provides very good adjacent, alternate  
and co channel rejection, image frequency  
suppression and blocking properties. The  
CC2480 performance is significantly better than  
the requirements imposed by [1]. These are  
10.11.5 Communication security  
The hardware encryption and authentication  
of data processing, which is costly in an 8-bit  
microcontroller system. The hardware support  
within CC2480 enables a high level of security  
with minimum CPU processing requirements.  
operations  
in  
CC2480  
enable  
secure  
communication, which is required for many  
applications. Security operations require a lot  
10.11.6 Low cost systems  
A differential antenna will eliminate the need  
for a balun, and the DC biasing can be  
achieved in the antenna topology.  
As the CC2480 provides 250 kbps multi-  
channel performance without any external  
filters, a very low cost system can be made  
(e.g. two layer PCB with single-sided  
component mounting).  
10.11.7 Battery operated systems  
consumption may be achieved since the  
voltage regulators are turned off.  
In low power applications, the CC2480 should  
be placed in the low-power modes PM2 or  
PM3 when not active. Ultra low power  
CC2480 Data Sheet SWRS074  
Page 34 of 43  
 
CC2480  
10.12 PCB Layout Recommendation  
In the Texas Instruments reference design, the  
top layer is used for signal routing, and the  
open areas are filled with metallization  
connected to ground using several vias. The  
area under the chip is used for grounding and  
must be well connected to the ground plane  
with several vias.  
The external components should be as small  
as possible (0402 is recommended) and  
surface mount devices must be used.  
If using any external high-speed digital  
devices, caution should be used when placing  
these in order to avoid interference with the  
RF circuitry.  
The ground pins should be connected to  
ground as close as possible to the package  
pin using individual vias. The de-coupling  
capacitors should also be placed as close as  
possible to the supply pins and connected to  
the ground plane by separate vias. Supply  
power filtering is very important.  
It is strongly advised that this reference layout  
is followed very closely in order to obtain the  
best performance.  
The schematic, BOM and layout Gerber files  
for the reference designs are all available from  
the TI website.  
10.13 Antenna Considerations  
the antenna. Many vendors offer such  
antennas intended for PCB mounting.  
CC2480 can be used together with various  
types of antennas. A differential antenna like a  
dipole would be the easiest to interface not  
needing a balun (balanced to un-balanced  
transformation network).  
Helical antennas can be thought of as a  
combination of a monopole and a loop  
antenna. They are a good compromise in size  
critical applications. Helical antennas tend to  
be more difficult to optimize than the simple  
monopole.  
The length of the λ/2-dipole antenna is given  
by:  
L = 14250 / f  
Loop antennas are easy to integrate into the  
PCB, but are less effective due to difficult  
impedance matching because of their very low  
radiation resistance.  
where f is in MHz, giving the length in cm. An  
antenna for 2450 MHz should be 5.8 cm. Each  
arm is therefore 2.9 cm.  
Other commonly used antennas for short-  
range communication are monopole, helical  
and loop antennas. The single-ended  
monopole and helical would require a balun  
network between the differential output and  
the antenna.  
For low power applications the differential  
antenna is recommended giving the best  
range and because of its simplicity.  
The antenna should be connected as close as  
possible to the IC. If the antenna is located  
away from the RF pins the antenna should be  
matched to the feeding transmission line  
(50).  
Monopole antennas are resonant antennas  
with a length corresponding to one quarter of  
the electrical wavelength (λ/4). They are very  
easy to design and can be implemented  
simply as a “piece of wire” or even integrated  
into the PCB.  
The length of the λ/4-monopole antenna is  
given by:  
L = 7125 / f  
where f is in MHz, giving the length in cm. An  
antenna for 2450 MHz should be 2.9 cm.  
Non-resonant monopole antennas shorter than  
λ/4 can also be used, but at the expense of  
range. In size and cost critical applications  
such an antenna may very well be integrated  
into the PCB.  
Enclosing the antenna in high dielectric  
constant material reduces the overall size of  
CC2480 Data Sheet SWRS074  
Page 35 of 43  
 
CC2480  
11 Voltage Regulators  
The analog voltage regulator input pin  
AVDD_RREG is to be connected to the  
unregulated 2.0 to 3.6 V power supply. The  
regulated 1.8 V voltage output to the analog  
parts, is available on the RREG_OUT pin. The  
digital regulator input pin AVDD_DREG is also  
to be connected to the unregulated 2.0 to 3.6  
V power supply. The output of the digital  
regulator is connected internally within the  
CC2480 to the digital power supply.  
The CC2480 includes two low drop-out voltage  
regulators. These are used to provide a 1.8 V  
power supply to the CC2480 analog and digital  
power supplies.  
Note: It is recommended that the voltage  
regulators are not used to provide power to  
external circuits. This is because of limited  
power sourcing capability and due to noise  
considerations. External circuitry can be  
powered if they can be used when internal  
power consumption is low and can be set I PD  
mode when internal power consumption I high.  
The voltage regulators require external  
components as described in section 8 on page  
20.  
11.1 Voltage Regulators Power-on  
When the analog voltage regulator is powered-  
on before use of the radio, there will be a  
delay before the regulator is enabled.  
The digital voltage regulator is disabled when  
the CC2480 is placed in low power modes to  
reduce power consumption.  
CC2480 Data Sheet SWRS074  
Page 36 of 43  
 
CC2480  
12 Package Description (QLP 48)  
All dimensions are in millimeters, angles in degrees. NOTE: The CC2480 is available in RoHS lead-  
free package only. Compliant with JEDEC MS-020.  
Table 21: Package dimensions  
Quad Leadless Package (QLP)  
D
D1  
E
E1  
e
b
L
D2  
E2  
QLP 48  
Min  
6.9  
7.0  
7.1  
6.65  
6.75  
6.85  
6.9  
7.0  
7.1  
6.65  
6.75  
6.85  
0.18  
0.3  
0.4  
0.5  
5.05  
5.10  
5.15  
5.05  
5.10  
5.15  
0.5  
Max  
0.30  
The overall package height is 0.85 +/- 0.05  
All dimensions in mm  
Figure 16: Package dimensions drawing  
CC2480 Data Sheet SWRS074  
Page 37 of 43  
 
CC2480  
12.1 Recommended PCB layout for package (QLP 48)  
Figure 17: Recommended PCB layout for QLP 48 package  
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes  
distributed symmetrically in the ground pad under the package. See also the CC2480 EM reference  
design  
12.2 Package thermal properties  
Table 22: Thermal properties of QLP 48 package  
Thermal resistance  
Air velocity [m/s]  
Rth,j-a [K/W]  
0
25.6  
12.3 Soldering information  
The recommendations for lead-free solder reflow in IPC/JEDEC J-STD-020C should be followed.  
12.4 Tray specification  
Table 23: Tray specification  
Tray Specification  
Package  
QLP 48  
Tray Width  
Tray Height  
Tray Length  
Units per Tray  
260  
135.9mm ± 0.25mm  
7.62mm ± 0.13mm  
322.6mm ± 0.25mm  
12.5 Carrier tape and reel specification  
Carrier tape and reel is in accordance with EIA Specification 481.  
CC2480 Data Sheet SWRS074  
Page 38 of 43  
 
CC2480  
Table 24: Carrier tape and reel specification  
Tape and Reel Specification  
Package  
Tape Width  
Component  
Pitch  
Hole  
Pitch  
Reel  
Diameter  
Units per Reel  
QLP 48  
16mm  
12mm  
4mm  
13 inches  
2500  
CC2480 Data Sheet SWRS074  
Page 39 of 43  
CC2480  
13 Ordering Information  
Table 25: Ordering Information  
Ordering part number  
CC2480A1RTC  
Description  
MOQ  
CC2480, QLP48 package, RoHS compliant Pb-free assembly, trays with 260 pcs per  
tray, ZigBee 2006 Network Processor.  
260  
2,500  
1
CC2480A1RTCR  
eZ430-RF2480  
CC2480, QLP48 package, RoHS compliant Pb-free assembly, T&R with 2500 pcs  
per reel, ZigBee 2006 Network Processor.  
CC2480 Demonstration Board based on the eZ430-RF platform  
MOQ = Minimum Order Quantity  
T&R = tape and reel  
CC2480 Data Sheet SWRS074  
Page 40 of 43  
 
CC2480  
14 General Information  
14.1 Document History  
Table 26: Document History  
Revision Date  
1.0 2008-04-02  
Description/Changes  
First data sheet for released product.  
15 Address Information  
Texas Instruments Norway AS  
Gaustadalléen 21  
N-0349 Oslo  
NORWAY  
Tel: +47 22 95 85 44  
Fax: +47 22 95 85 46  
Web site: http://www.ti.com/lpw  
16 TI Worldwide Technical Support  
Internet  
TI Semiconductor Product Information Center Home Page:  
TI Semiconductor KnowledgeBase Home Page:  
support.ti.com  
support.ti.com/sc/knowledgebase  
Product Information Centers  
Americas  
Phone:  
+1(972) 644-5580  
Fax:  
+1(972) 927-6377  
Internet/Email:  
support.ti.com/sc/pic/americas.htm  
Europe, Middle East and Africa  
Phone:  
Belgium (English)  
Finland (English)  
France  
+32 (0) 27 45 54 32  
+358 (0) 9 25173948  
+33 (0) 1 30 70 11 64  
+49 (0) 8161 80 33 11  
180 949 0107  
Germany  
Israel (English)  
Italy  
800 79 11 37  
Netherlands (English)  
Russia  
+31 (0) 546 87 95 45  
+7 (0) 95 363 4824  
+34 902 35 40 28  
Spain  
Sweden (English)  
United Kingdom  
Fax:  
+46 (0) 8587 555 22  
+44 (0) 1604 66 33 99  
+49 (0) 8161 80 2045  
support.ti.com/sc/pic/euro.htm  
Internet:  
CC2480 Data Sheet SWRS074  
Page 41 of 43  
 
CC2480  
Japan  
Fax  
International  
Domestic  
+81-3-3344-5317  
0120-81-0036  
Internet/Email  
International  
Domestic  
support.ti.com/sc/pic/japan.htm  
www.tij.co.jp/pic  
Asia  
Phone  
International  
Domestic  
Australia  
China  
+886-2-23786800  
Toll-Free Number  
1-800-999-084  
800-820-8682  
Hong Kon  
India  
800-96-5941  
+91-80-51381665 (Toll)  
001-803-8861-1006  
080-551-2804  
Indonesia  
Korea  
Malaysia  
New Zealand  
Philippines  
Singapore  
Taiwan  
1-800-80-3973  
0800-446-934  
1-800-765-7404  
800-886-1028  
0800-006800  
Thailand  
001-800-886-0010  
+886-2-2378-6808  
tiasia@ti.com or ti-china@ti.com  
support.ti.com/sc/pic/asia.htm  
Fax  
Email  
Internet  
CC2480 Data Sheet SWRS074  
Page 42 of 43  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Dec-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CC2480A1RTCR  
VQFN  
RTC  
48  
2500  
330.0  
16.4  
7.4  
7.4  
1.6  
12.0  
16.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Dec-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
VQFN RTC 48  
SPQ  
Length (mm) Width (mm) Height (mm)  
378.0 70.0 346.0  
CC2480A1RTCR  
2500  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
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Copyright © 2011, Texas Instruments Incorporated  
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