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DXT5401

型号:

DXT5401

描述:

PNP表面贴装晶体管[ PNP SURFACE MOUNT TRANSISTOR ]

品牌:

DIODES[ DIODES INCORPORATED ]

页数:

5 页

PDF大小:

120 K

DXT5401  
PNP SURFACE MOUNT TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Epitaxial Planar Die Construction  
Case: SOT89-3L  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish - Matte Tin annealed over Copper Leadframe  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 4  
Ordering Information: See Page 4  
Weight: 0.055 grams (approximate)  
Complementary NPN Type Available (DXT5551)  
Ideally Suited for Automated Assembly Processes  
Ideal for Medium Power Switching or Amplification Applications  
Lead Free By Design/RoHS Compliant (Note 1)  
"Green" Device (Note 2)  
COLLECTOR  
3 E  
2,4  
2
1
C
B
C 4  
1
BASE  
3
EMITTER  
Top View  
Device Schematic  
Pin Out Configuration  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
-160  
-150  
-5.0  
Unit  
V
V
V
Collector Current  
-600  
mA  
Thermal Characteristics  
Characteristic  
Power Dissipation @TA = 25°C (Note 3)  
Symbol  
PD  
Value  
1
Unit  
W
125  
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 3)  
Operating and Storage Temperature Range  
°C/W  
°C  
Rθ  
JA  
-55 to +150  
TJ, TSTG  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
3. Device mounted on FR-4 PCB, pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our  
website at http://www.diodes.com/datasheets/ap02001.pdf.  
1 of 5  
www.diodes.com  
March 2010  
© Diodes Incorporated  
DXT5401  
Document number: DS31226 Rev. 3 - 2  
DXT5401  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 4)  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Symbol  
Min  
Max  
Unit  
Test Condition  
IC = -100μA, IE = 0  
IC = -1.0mA, IB = 0  
IE = -10μA, IC = 0  
VCB = -120V, IE = 0  
-160  
-150  
-5.0  
V
V
V
V(BR)CBO  
V(BR)CEO  
V(BR)EBO  
nA  
μA  
nA  
Collector Cutoff Current  
-50  
-50  
ICBO  
IEBO  
V
CB = -120V, IE = 0, TA = 100°C  
Emitter Cutoff Current  
VEB = -3.0V, IC = 0  
ON CHARACTERISTICS (Note 4)  
VCE = -5.0V, IC = -1.0mA  
VCE = -5.0V, IC = -10mA  
VCE = -5.0V, IC = -50mA  
IC = -10mA, IB = -1.0mA  
50  
60  
50  
240  
DC Current Gain  
hFE  
-0.2  
-0.5  
Collector-Emitter Saturation Voltage  
Base-Emitter Saturation Voltage  
V
V
VCE(SAT)  
VBE(SAT)  
I
C = -50mA, IB = -5.0mA  
IC = -10mA, IB = -1.0mA  
IC = -50mA, IB = -5.0mA  
-1.0  
SMALL SIGNAL CHARACTERISTICS  
Output Capacitance  
6.0  
200  
300  
8.0  
pF  
MHz  
Cobo  
hfe  
fT  
40  
VCB = -10V, f = 1.0MHz, IE = 0  
Small Signal Current Gain  
Current Gain-Bandwidth Product  
Noise Figure  
VCE = -10V, IC = -1.0mA, f = 1.0kHz  
VCE = -10V, IC = -10mA, f = 100MHz  
100  
NF  
dB  
V
CE = -5.0V, IC = -200μA, RS = 10Ω, f = 1.0kHz  
Notes:  
4. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle 2%.  
250  
200  
1.0  
0.8  
I
= -10mA  
B
I
= -8mA  
B
I
= -6mA  
B
I
I
= -4mA  
B
B
150  
100  
0.6  
0.4  
= -2mA  
50  
0
0.2  
0
0
25  
50  
150  
75  
100  
125  
0
1
2
3
4
5
6
7
8
9
10  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 2 Typical Collector Current  
vs. Collector-Emitter Voltage  
Fig. 1 Power Dissipation  
vs. Ambient Temperature (Note 3)  
2 of 5  
www.diodes.com  
March 2010  
© Diodes Incorporated  
DXT5401  
Document number: DS31226 Rev. 3 - 2  
DXT5401  
400  
350  
0.25  
0.2  
300  
250  
200  
0.15  
0.1  
150  
100  
0.05  
0
50  
0
0.001  
0.01  
IC, COLLECTOR CURRENT (A)  
Fig. 3 Typical DC Current Gain vs. Collector Current  
0.1  
1
0.1  
1
10  
100  
IC, COLLECTOR CURRENT (mA)  
Fig. 4 Typical Collector-Emitter Saturation Voltage  
vs. Collector Current  
1.2  
1.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.8  
0.6  
0.4  
0.2  
0
0.2  
0
0.0001  
0.001  
0.01  
0.1  
1
0.0001  
0.001  
0.01  
0.1  
1
IC, COLLECTOR CURRENT (A)  
IC, COLLECTOR CURRENT (A)  
Fig. 6 Typical Base-Emitter Saturation Voltage  
vs. Collector Current  
Fig. 5 Typical Base-Emitter Turn-On Voltage  
vs. Collector Current  
45  
40  
250  
200  
f = 1MHz  
35  
30  
25  
20  
15  
10  
5
150  
100  
C
ibo  
V
= -10V  
CE  
50  
0
f = 100MHz  
C
obo  
0
0.01  
0
10 20 30 40 50 60 70 80 90 100  
IC, COLLECTOR CURRENT (mA)  
0.1  
1
10  
100  
VR, REVERSE VOLTAGE (V)  
Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current  
Fig. 7 Typical Capacitance Characteristics  
3 of 5  
www.diodes.com  
March 2010  
© Diodes Incorporated  
DXT5401  
Document number: DS31226 Rev. 3 - 2  
DXT5401  
Ordering Information (Note 5)  
Part Number  
DXT5401-13  
Case  
SOT89-3L  
Packaging  
2500/Tape & Reel  
Notes:  
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.  
Marking Information  
K4M = Product type marking code  
= Manufacturer’s code marking  
YWW = Date code marking  
Y = Last digit of year (ex: 7 = 2007)  
WW = Week code (01 – 53)  
YWW  
K4M  
Package Outline Dimensions  
D1  
C
SOT89-3L  
Dim  
A
B
B1  
C
D
Min  
1.40  
0.44  
0.35  
0.35  
4.40  
1.52  
2.29  
Max  
1.60  
0.62  
0.54  
0.43  
4.60  
1.83  
2.60  
E
H
L
B
D1  
E
e
B1  
e1  
e
e1  
H
1.50 Typ  
3.00 Typ  
3.94  
0.89  
4.25  
1.20  
A
L
All Dimensions in mm  
D
Suggested Pad Layout  
X1  
Dimensions Value (in mm)  
Y1  
X1  
X2  
X3  
Y1  
Y2  
Y3  
C
1.7  
0.9  
0.4  
2.7  
1.3  
1.9  
3.0  
X3  
X2  
Y2  
Y3  
C
4 of 5  
www.diodes.com  
March 2010  
© Diodes Incorporated  
DXT5401  
Document number: DS31226 Rev. 3 - 2  
DXT5401  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2010, Diodes Incorporated  
www.diodes.com  
5 of 5  
www.diodes.com  
March 2010  
© Diodes Incorporated  
DXT5401  
Document number: DS31226 Rev. 3 - 2  
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