Teccor® brandThyristors
8 Amp Sensitive, Standard & Alternistor (High Commutation) Triacs
Soldering Parameters
Reflow Condition
-Temperature Min (Ts(min)
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tP
TP
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (min to max) (ts)
)
200°C
tL
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Ramp-down
Preheat
Average ramp up rate (LiquidusTemp)
(TL) to peak
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TS(min)
tS
TS(max) toTL - Ramp-up Rate
-Temperature (TL) (Liquidus) ꢐꢆꢅ¡$ꢀ
25
Reflow
time to peak temperature
-Temperature (tL)
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Time
PeakTemperature (TP)
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Time within 5°C of actual peak
Temperature (tp)
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Ramp-down Rate
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280°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
Terminal Finish
Body Material
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Peak AC voltage @ 125°C for 1008 hours
AC Blocking (VDRM
)
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100 cycles; -40°C to +150°C; 15-min
dwell-time
Temperature Cycling
Terminal Material
Copper Alloy
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rel humidity
Temperature/
Humidity
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1008 hours; 150°C
HighTemp Storage
Low-Temp Storage
Design Considerations
1008 hours; -40°C
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
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rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
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10 cycles; 0°C to 100°C; 5-min dwell-
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transfer time between temperature
Thermal Shock
Autoclave
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Resistance to
Solder Heat
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Solderability
Lead Bend
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Lxx08xx & Qxx08xx & Qxx08xHx Series
©2010 Littelfuse, Inc
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
82
Revised: July 29, 2010 12:24 PM