BZX84C2V4T - BZX84C39T
150mW SURFACE MOUNT ZENER DIODE
Please click here to visit our online spice models database.
Features
Mechanical Data
•
•
•
•
Ultra-Small Surface Mount Package
Planar Die Construction
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
•
•
Case: SOT-523
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
•
•
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
•
•
•
•
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.002 grams (approximate)
Top View
Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
0.9
V
Forward Voltage
@ IF = 10mA
VF
Thermal Characteristics
Characteristic
Power Dissipation
Symbol
Value
150
Unit
mW
(Note 1)
(Note 1)
PD
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
833
°C/W
Rθ
JA
-65 to +150
TJ, TSTG
°C
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated
BZX84C2V4T - BZX84C39T
Document number: DS30262 Rev. 10 - 2